PCB materials for Automotive ... iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015 2...

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Transcript of PCB materials for Automotive ... iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015 2...

  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail info@ats.net

    www.ats.net

    PCB materials for Automotive applications

    iNEMI / SMTA Automotive Electronics Workshop October 5th, 2015

  • 2

    Short Overview about AT&S

    Material basics + qualification process

    Product examples with advanced material requirements

    High frequency materials for automotive radar

    Agenda

  • AT&S Group

    AT&S is currently the  Technology Leader in HDI* and Any-Layer Boards

     Highest automated HDI factory in China

     No. 1 - ECP®** supplier with real commercial and industrial set up

     Largest European PCB supplier

     Largest PCB producer in India

     Supplier of the Top Players in each targeted segment

    * HDI = High Density Interconnect ** ECP = Embedded Component Packaging

    3

  • 4

    AT&S Locations

     Production facilities in Europe and Asia  Headquarters in Leoben, Austria  Procurement center in Hong Kong, China

     Design center in Düren, Germany  Sales network spanning three continents  About ~8000 employees

    BU IA Plant Leoben, Austria Headquarters Staff: ~ 900 Customer Orientation: 9% Automotive 91% Industrial

    BU IA Plant Fehring, Austria Staff: ~350 Customer Orientation: 44% Automotive 56% Industrial

    BU MS Plant Shanghai, China Staff: ~4.500 Customer Orientation: 84% Mobile Devices 14% Automotive 2% Industrial

    BU IA Plant Ansan, Korea Staff: ~250 Customer Orientation: 13% Automotive 47% Industrial 40% Mobile Devices

    BU IA Plant Nanjangud, India Staff: ~1.100 Customer Orientation: 60% Automotive 40% Industrial

    BU MS Plant Chongqing, China under construction Staff: ~1000

    AT&S AG Headquarters

    Leoben, Austria

    BU MS Headquarters

    Hong Kong, China

    AT&S AG Headquarters Sales Offices /Representations Business Unit Mobile Devices & Substrates (BU MS) Business Unit Industrial & Automotive (BU IA)

  • 5

    AT&S plants / installed capacity [m²]*

    * Maximum capacity of plants Source: AT&S

    AT&S plants

    Technology: DS-PTH, Flex

    Volume: low-mid

    Market: IND / AUT

    Technology: Standard ML

    Volume: mid-high

    Market: IND / AUT

    Technology: HDI

    Volume: high

    Market: MD / IND / AUT

    Technology: HDI / Standard ML,

    Flex

    Volume: Samples, Prototyps

    low-mid

    Market: IND / AUT

    Technology: Flex / ridid-flex

    Volume: mid-high

    Market: MD / IND / AUT

    380k

    120k 300k

    130k ~ 200k

    Nanjangud Shanghai Seoul (Korea) Leoben Fehring Chongqing

    710k

    Under Construction

    IC-substrates

  • 6

    Material: Prepreg, Core, copper foils

    6

    Carrier- und Isolation material with increasing requirements

     Electrical Performance (Impedance, Signalspeed-/loss, higher frequencies…)

     Thermal Performance

    (TCT performance , Thermal stress, thermal conductivity…)

     Physical Performance (Miniaturisation, Rigidity, Flexibility, Peel Strength, …)

  • • Prepreg: Glass cloth with resin; pre-cured; different types of glass clothes available,

    • Core:

    Prepreg with copper on top and bottom (CCL = copper clad laminate); fully cured

    • RCC:

    Resin Coated Copper; used only for HDI (laser drilling); no glass cloth, pre-cured

    Base material introduction

    7

  • Base material introduction

    8

  • Base material introduction

    1037

    106

    1080

    2116

    9

  • Base material introduction

    10

    Warp and weft (Grain direction )- glass fibers – different number of fibers in one bundle - different number of glass bundles per centimeter.

  • 11

    …currently used resin systems

    • FR4 halogenated / halogen-reduced (e.g. R1755M, R1755V, R1566WN, 370HR …)

    • FR4 high TG / halogen reduced / high speed (e.g. EM888, R1577, …)

    • PPE Polyphenylether (low Dk Df) (e.g. Megtron7, Megtron 6, Megtron 4S, …)

    • HF Hydrocarbon / Ceramics (low Dk Df) (e.g. RO4000 …)

    • PI Polyimid (PI-glass , PI flex) (e.g. 35N, N7000, P96, DuPont, UBE, ..)

    • LCP Liquid Crystal Polymer (flex, low water abs., low Dk Df) (e.g.FR-705T)

    • PTFE Polytetrafloureten (Teflon) (e.g. RO3003, …)

    • Substrate (Low CTExy, ..) (e.g. MCL E700, …)

  • 12

    Customer requirements

    • IPC-class sheet defined

    • RoHS conform (environmental feature)

    • Halogen reduced (environmental feature)

    • Lead free solder compatible (thermal reliability)

    • CAF resistant

    • TG (temperature related reliability)

    • TCTxyz, CTExyz (temperature cycle reliability)

    • Er (Dk) , Df (electrical signal performance)

    • Degradiation Temperature (thermal reliability)

    • T260 , T288 (time to delamination, thermal reliability)

    • High thermal conductivity (heat transfer)

    • Mechanical properties (Drop Test, stiffness, etc.)

  • 13

    „Standard“ FR4

    Material definition at AT&S

     Halogenated (ROHS) or Halogen reduced materials

     TG 150 , 170 , …

     Reliability: Leadfree soldering , Low CTE z for temperature cycle tests

    High Speed , Low Loss

     HF/PPE (Hydrocarbon Ceramics, Polyphenylenether, …)

     PTFE , LCP , …

    Low CTE x y , Special Modulus Materials

     BT / CE / ..Blend (Bismaleinimid-Triazin resin , Cyanatester)

     CTE x y Reliability solutions

    13

  • 14

    AT&S material Analysis To protect special technology requirements (material and final application):

    • Reflow [thermal stability, delamination]

    • Scanning Measuring Machine [accurate overall Dimensional Panel behaviour]

    • SEM: Scanning Electron Microscope [check Filler, roughness, etc.]

    • EDX: Energy Dispersive X-ray spectrometer [element analysis]

    • FTIR: Fourier Transforming Infra-Red Spectroscope [footprint resin system]

    • DSC: Differential Scanning Calorimeter [TG]

    • MFK: Model Free Kinetic (DSC) [required energy to cure B-stage resin]

    • TGA: Thermo Gravimetry [Degradiation]

    • TMA: Thermo Mechanical Analysis [TG mechanical, CTE, TTD time to delamination]

    • DMA: Dynamic Mechanic Analysis [TG , thermomechanic behaviour]

    • Rheometer / Viscosimeter [viscosity and curing behaviour of resin system]

    • Peel Strength Tester [Cu peel strength, all sorts of peel strength]

    • TCT – Tester [temperature cycle test e.g. -40/+125° 1000 Cycles]

    • HAST (CAF/SIR) [High Accelerated Stress Test , Conductive Anodic Filament, Surface Insulation Resistance]

    • Laboratory Press [resin flow, prepreg cure]

    • Climatic Chamber [humidity, temperature simulations]

    • Drop Test

    • Bending Test [Flex, Semiflex application]

  •  Prototyping  asap, define risk managment with the customer

     Process parameter qualification  app. 3 months

     UL Qualification Flammability, Full Recognition  app. 6 months

    15

    Material Qualification + UL Listing

    - Technology requirements , qualification time and cost will define the material selection - Check existing material portfolio New Technologies and new materials on the market require ongoing material qualifications

  • 16

    Standard qualification

    Qualification process

     Resin assignment

     Process parameter definition

     Reliability Tests

    Reliability Qualification

     Special , increased Reliability Requirements

     Temperatur Cycle Test x y z direction (smaller packages)

     HAST

     CAF requirements / Design

     … let us know your requirements ?

    New applications will require adjusted reliability tests

    Laboratory equipment and AT&S Know How allow sophisticated customer solutions

    Quelle: foto: lowe ggk

    Quelle: foto: lowe ggk

  • Radar

    Short range radar 24 GHz (79GHz) and long range radar 77 GHz AT&S produces standard multilayer controller boards as well as hybrid multilayer boards implementing high-frequency materials addressing the requirements for modern automotive radar systems.

    Cameras are increasingly supported by radar technology for blind spot detection, rear pre-crash, rear cross traffic alert, vehicle assistant and lane change assistant systems.

  • Frequency Allocation Dilemma

    18

    Source: ANALOG DEVIC