Partial high current solutions WIRELAID · Seite 13 05.11.2013 Wires welded under the internal...
Transcript of Partial high current solutions WIRELAID · Seite 13 05.11.2013 Wires welded under the internal...
Partial high current solutions WIRELAID
The technology and technical application
Agenda
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
Introduction
Power (3-200A) Signal (SMD, fine line)
Benefit
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Requirements of the market:
Introduction
The priciple
Use of embedded copper wires to realise high current tracks
Combination of power and signal processing electronics
Competitive alternative to PCBs with thick copper technology or
parallel arrangement of additional layers
The technics
The copper wires are fixed onto the under side (treatment) of the copper foil using resistance welding
After lamination the process, wires are embedded by prepregs into a multilayer PCB
WIRELAID copper foil forms external layer and is structured with standard PCB processes
Therefore external layer are SMD-capable
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Production process
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1 • Welding first point
2 • Wire is cut to length
3 • Second welding point
4 • Turning the „WIRELAID foil“
5 • Lamination process
6 • Embedding wires
7 • Wirelaid Multilayer
Production process
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1 • Anschweißen des ersten Punktes
2 • Ziehen und Ablängen des Drahtes
3 • Schweißung des zweiten Punktes
4 • Wenden der bestückten Folie
5 • Verpressen der Folie
6 • Einbetten der Drähte
7 • Fertiger Multilayer
Types of wires
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Flat wire
_____________
F08 0,8 x 0,25mm²
Cross-sectional-area : 0,2mm²
F14 1,4 x 0,35mm² Cross-sectional-area : 0,5mm²
3 dimensional way of installation
Wirelaid 3D
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Depth-milled slot
Suited for complicated installation space
Partial thick copper with “hinge” character
Bending radius <1mm
WIRELAID vs. Standard
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
WIRELAID vs. Standard
WIRELAID Cross-sectional
area
track width Wirelaid
(35µm base Cu)
Track width standard
(35µm base Cu)
Reduction
F14 0,5mm² 1,9mm 8,9mm 78,7%
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0,63mm² Requirements: 20A at 20K allowed temperature rise
WIRELAID use:
Reduction of
78,7%
8,9mm
1,9mm
4,5mm
Poll
1. Guess how many amps two wires (F14) can carry with maximum temperature rise
of 20K?
1. 12A
2. 23A
3. 38A
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Design Guide
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
Ampacity
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Wires welded under the internal layer rise of temperature (ΔT in °C)
Strom [A] 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84
Draht Leiterbreite [mm]
1x300 0.9 8 13 19 28 40 53 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2x300 1.8 3 6 8 12 16 21 25 31 38 45 52 62 . . . . . . . . . . . . . . . . . . . . . . . . . .
1x800 1.4 3 6 9 13 18 22 28 35 42 50 59 . . . . . . . . . . . . . . . . . . . . . . . . . . .
2x800 3.1 2 2 4 5 7 9 11 13 16 19 23 27 32 36 41 46 52 58 64 . . . . . . . . . . . . . . . . . . .
3x800 4.8 1 1 2 3 4 6 7 9 10 12 14 17 19 21 24 27 30 34 38 41 46 50 55 59 64 . . . . . . . . . . . . .
4x800 6.5 0 1 2 2 3 4 5 6 7 9 10 12 13 15 18 20 22 25 28 31 34 37 40 43 47 51 55 58 61 . . . . . . . . .
1x1400 2.0 2 2 3 5 5 7 9 11 13 16 19 22 26 30 34 38 43 48 53 59 65 . . . . . . . . . . . . . . . . .
2x1400 4.3 0 1 1 2 3 4 5 6 8 9 11 12 14 16 18 20 22 25 28 30 33 37 40 43 47 51 54 59 63 . . . . . . . . .
3x1400 6.6 0 0 1 1 2 2 2 3 3 4 5 6 8 10 12 13 15 16 18 20 22 24 25 27 29 31 34 36 38 41 44 47 50 54 58 62 66 .
4x1400 8.9 0 0 0 1 1 1 2 2 3 4 4 5 6 7 9 10 11 12 14 15 17 19 21 22 24 26 27 29 31 34 36 36 37 42 47 49 51 54
Strom [A] 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 60 62 64 66 68 70 72 74 76 78 80 82 84
Draht Leiterbreite [mm]
1x300 0.9 12 21 31 46 63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2x300 1.8 5 9 13 17 24 30 39 47 58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1x800 1.4 6 9 14 19 25 32 41 50 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2x800 3.1 2 4 6 8 11 14 17 20 24 28 34 40 46 52 59 67 . . . . . . . . . . . . . . . . . . . . . .
3x800 4.8 1 2 3 4 6 8 10 12 15 18 21 24 28 32 35 39 45 50 55 60 66 . . . . . . . . . . . . . . . . .
4x800 6.5 0 1 2 3 4 5 7 9 11 13 15 17 19 23 26 30 33 37 41 45 50 53 59 65 . . . . . . . . . . . . . .
1x1400 2.0 2 3 5 7 8 10 12 14 17 21 25 29 34 40 45 50 57 64 . . . . . . . . . . . . . . . . . . . .
2x1400 4.3 0 1 1 2 4 5 7 8 10 12 13 16 18 22 24 27 30 34 37 43 46 50 56 61 65 . . . . . . . . . . . . .
3x1400 6.6 0 0 1 2 3 3 4 5 6 7 9 10 12 14 16 18 20 22 24 26 29 31 35 39 43 46 50 53 57 62 66 . . . . . . .
4x1400 8.9 0 0 0 0 1 1 2 3 4 5 6 7 8 10 12 14 17 19 21 23 25 27 30 32 35 37 40 43 46 49 53 57 60 64 . . . .
Copper thickness conductor 70µm
35µm
38
20 2 x F14 4,3mm
4,3mm
Wirelaid sample
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clearance – view on
embedded wires
depth-milled bendable area
Power
electronics
Signal
processing
electronics
cross-sectional area of
embedded wires
Example of use
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
Frequently asked questions by customers
Mr Jürgen Westenkirchner
– Business Development – Sales – Technical Customer Support
FAQ about WIRELAID technology – experience from everyday professional life
1. Hot Spots aon angled wirelaid tracks
2. Connection of Wirelaid layers
3. Layouting Wirelaid layers
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Frequently asked questions by customers
Hot Spots aon angled wirelaid tracks
Increased current density
Dinstance between wires according to design rules
Problem investigation
– Thermal analysis
– Explanation:
• Power derating on ohmic resistance
– P = I² x R, increased current density S
– Solution: No hot spots thriugh local high thermal capacity
Relation:
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I [A] = 9,1 [mm²] 0,68 * ΔT [K]0,43
Frequently asked questions by customers
Connection of Wirelaid layers
– No „through wire connection“
– Distance between wires according to design guide
– Connection through pad after wire`s end
– The more vias the better the thermal management
Problem investigation
– Similar to angled wires, but with a higher local thermal capacity with the help of cable,
pressfits, etc
» in correlation with the conductivity and the emissivity (radiation, Cu
0,76))
– Leads to temperatur increment
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Frequently asked questions by customers
Layout
For implementing the WIRELAID technology in your PCB build-up, use an additional help layer
showing the relevant wires (width and length) in Gerber format
The combination of “bottom” and “wirelaid_bottom” represents the “Wirelaid copper foil” in the
shown build-up
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bottom
wirelaid_bottom
(Help layer)
top
Example of use a)
Permanent current load 70 A
Allowed temperature 80C°
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before: 8 layer build-up, 6 inner layer 105µm Cu
after: 4 layer with embedded wires (highlighted) under one layer
Advantages in cost by reduced amount of layers and thickness of copper foil
Example of use b)
Permanent current load 50 A
Allowed temperature 80C°
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Before: 3 PCBs, 6 layers with 70µm
After: 1 PCB , 6 layers with 70µm + Wirelaid 3D
Advantages in cost through production , solder process and omission of connectors
Markets and target groups
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
Applications
Automotive
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Automotive
Motor electr..
Gear box electr.
Comfort electr.
Sensor and monitoring
system
Energy supply
Hybrid techology
Applications
Industrial electronics
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Industrial electronics
Con-/inverter
Motor drive
Power supply
Switching power supply
Voltage distribution
Thyristor activation
control system
Sensor systems
Perspective - Powerflex
Embedded wires into depth-milled „Semiflex-area“
Combination of Wirelaid 3D and Semiflex
– Transfer of signals through Semiflex area
– Transfer of currents through Wirelaid 3D
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Advantages of Wirelaid
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Introduction
WIRELAID versus
Standard
Design Guide
Example of use
Markets and target groups
Advantages of WIRELAID
Vorteile der Technologie
High currents without thick copper technology
– High currents within small areas
– Combination of power and signal processing electronics on one single layer
– Partial power management
– Thinner copper layers possible
Cost reduction
– Economical use of PCB area
– Reduction of layers
– Reduced efforts with soldering process
– Omission of connectors
Reliability
– Electrical connection without cable or connector
– Improvement of heat dissipation
Reduced system costs
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I appreciate your attention.