Panasonic Kxtg1070 Service Manual

© 2006 Panasonic Communications Co., Ltd. Allrights reserved. Unauthorized copying and distribu-tion is a violation of law.

ORDER NO. KM40610223CE

Telephone Equipment

KX-TG1070FXBKX-TG1070FXCKX-TG1072FXBKX-TGA107EXBKX-TGA107EXCDigital Cordless PhoneBlack VersionBlue Version(for Central Europe)

2

KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC

3


TABLE OF CONTENTSPAGE

1 Safety Precaution ------------------------------------------------ 41.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 42.1. Battery Caution--------------------------------------------- 42.2. About Lead Free Solder (Pbf: Pb free)--------------- 4

3 Specifications ----------------------------------------------------- 64 Technical Descriptions ----------------------------------------- 7

4.1. Block Diagram (Base Unit) ------------------------------ 74.2. Circuit Operation (Base Unit) --------------------------- 84.3. Block Diagram (Handset)-------------------------------- 94.4. Circuit Operation (Handset)----------------------------104.5. Signal Flow-------------------------------------------------11

5 Location of Controls and Components ------------------125.1. Controls -----------------------------------------------------12

6 Installation Instructions ---------------------------------------126.1. Connections------------------------------------------------126.2. Battery-------------------------------------------------------13

7 Operation Instructions-----------------------------------------147.1. Guide to Telephone Settings---------------------------147.2. Handset Registration ------------------------------------147.3. For Service Hint-------------------------------------------14

8 Service Mode -----------------------------------------------------158.1. Engineering Mode----------------------------------------158.2. How to Clear User Setting------------------------------198.3. How to Set When Replacing Unit---------------------20

9 Troubleshooting Guide ----------------------------------------229.1. How to Replace the Flat Package IC----------------23

10 Disassembly and Assembly Instructions ---------------2510.1. Disassembly Instructions -------------------------------25

11 Schematic Diagram ---------------------------------------------2711.1. For Schematic Diagram---------------------------------2711.2. Schematic Diagram (Base Unit_Main) --------------2811.3. Schematic Diagram (Base Unit_Operation) -------3111.4. Schematic Diagram (Handset) ------------------------32

12 Printed Circuit Board-------------------------------------------3512.1. Circuit Board (Base Unit) -------------------------------3512.2. Circuit Board (Base Unit_Page key) -----------------3712.3. Circuit Board (Handset) ---------------------------------39

13 Exploded View and Replacement Parts List -----------41

4


1 Safety Precautions1.1. For Service TechniciansICs and LSIs are vulnerable to static electricity.When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil and ground them.2. Ground the soldering irons.3. Use a conductive mat on the worktable.4. Do not touch IC or LSI pins with bare fingers.

2 Warning2.1. Battery Caution

1. Danger of explosion if battery is incorrectly replaced.2. Replace only with the same or equivalent type recommended by the manufacturer.3. Dispose of used batteries according to the manufacture’s Instructions.

2.2. About Lead Free Solder (Pbf: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-tains lead.We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder.

Caution• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C). • Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

5


2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’sspecific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.2.2. How to Recognize that Pb Free Solder is Used(Example: Handset P.C.B.)

(Component View)Note:

The location of the “PbF” mark is subject to change without notice.

U4

RF

U3

> E

P-G

W <

PbF

35-006057-005-200

Marked

6


3 Specifications

Note:• Specifications are subject to change.

Connections:The unit will not work during a power failure. We recommend you connect a standard telephone on the same line for power pro-tection.

Note for Service:• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.• Analog telephone connection: Telephone Line

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4 Technical Descriptions4.1. Block Diagram (Base Unit)

AN

T

RF

Mo

du

le

EE

PR

OM

U3

U2

Cry

stal

3.3V

3.3V

37

614

415

Q60

5

R-D

ATA

T-D

ATA

D1~

D4,

Q7

32 64

17, 1

850

, 512,

52

DC

6VC

harg

e C

onta

ct

13.8

24M

Hz

Lin

ear

Reg

ula

tor

U1

Cu

rren

tL

imit

er

Po

wer

DC

6V

Bas

eB

and

Co

ntr

olle

r

Sp

eech

Net

wo

rkT

EL

Lin

eIn

terf

ace

Tel

Lin

e

Lo

cato

r b

utt

on

KX

-TG

1070

/107

2 B

LOC

K D

IAG

RA

M (

BA

SE

UN

IT)

8


4.2. Circuit Operation (Base Unit)The base-station consists of base band controller, speech network, tel-line interface, RF module, linear regulator, EEPROM,crystal and so on. Refer to Block Diagram (Base Unit) (P.7).

4.2.1. Base Band ControllerThese are parts to control all function of the base-station, we used the Philips XS which is controller for DECT. These devicesinclude all control circuits of the base-station for RF module, tel-line interface, ADPCM codec, series regulator and so on.

4.2.2. Power SupplyThe power supply consists with CM1117 voltage regulator ICs. CM1117 generate DC 3.3V voltage from DC 6V voltage from adaptor. DC 3.3V are used for RF module & I/O port, DC 2.5V &DC1.8V are used for the base band controller and the circumference circuits.

4.2.3. Speech Network The TR circuit is used for speech network. The function of this connects tel-line interface and the base band controller.

4.2.4. TEL Line InterfaceThe function of this connects tel-line and speech network. Also, the tel-line interface include the ring detect circuit, caller-ID cir-cuit.

4.2.5. EEPROMThis is 8K bits memory. The each kind of value to set-up at power-on, redial memory, speed-dialing memory, and so on arestored in this device.

4.2.6. RF ModuleReceiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected isdemodulated into RX_DATA signals. And signals is passed to the base band controller.Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RFcontrol interface. And then this signal is radiated from antenna.Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) ofthe RF control interface.

4.2.7. Current LimiterThe current limiter is circuit to supply the proper current to charge batteries of the handset from DC 6V voltage.

9


4.3. Block Diagram (Handset)

An

ten

na

RF

Mo

du

le

2.4V

, 2-c

ell

Sw

itch

ing

Reg

ula

tor

Ch

arg

er

Ch

arg

er C

on

tact

Cry

stal

13.8

24M

Hz

Bat

tery

EE

PR

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U3

U4

Bas

e B

and

Co

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r

LC

D D

rive

rU

2L

CD

KE

YP

AD

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Pie

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MIC

KX

-TG

A10

7 B

LOC

K D

IAG

RA

M (

HA

ND

SE

T)

614

415 2 52

16, 1

750

, 51

32, 3

3

29, 3

0

54, 5

5, 5

6

57~6

2, 6

4, 1

R-D

AT

A

T-D

AT

A

Q10

10


4.4. Circuit Operation (Handset)The handset consists of Base Band Controller, LCD, RF module, keypad, regulator, charger, EEPROM, crystal, earpiece, ringer& microphone, and so on.

4.4.1. Base Band ControllerThe base band controller controls all function of the handset, Philips XS for the base band controller is used.This device include all control circuits of the handset for RF module, LCD controller, keypad interface, earpiece, microphone,ADPCM codec, switching and series regulator and so on.

4.4.2. ChargerThe base-station supply DC 6V power to the charger and the charger charges the batteries to use this power. The signal on thecharger circuit is generated when the handset is to being charged this signal is used to control the charger circuit and for auto-matic off-hook by cradle-off when an incoming call is coming.

4.4.3. 2.4V 2 cell & 3.3V output from internal switching regulatorThe battery is (2.4V / 2cell) directly supplied to switching regulator which controlling by base band controller and step up the DC3.3V to the RF module & I/O port. DC 2.5V & DC1.8V are used for the base band and the circumference circuits.

4.4.4. RF ModuleReceiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected isdemodulated into RX_DATA signals. And signals is passed to the base band controller.Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RFcontrol interface. And then this signal is radiated from antenna.Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) ofthe RF control interface.

4.4.5. LCDThe LCD consists of 7-segment, 12 digit display and 13 icon which controlling by the LCD display driver.

4.4.6. KeypadThe keypad consists of 12 dialing keys and 8 function keys.

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4.5. Signal Flow4.5.1. Talk mode:Rx audio signal from line interface at “LINERX_P” path into B/S MCU (pin 32, 33) and then signal from B/S RF transform, H/S RFreceive signal forward to MCU, H/S MCU from (pin 32, 33) receive path output audio signal to receiver.

Tx audio signal from MIC receive audio signal at mic path into H/S MCU and then audio signal from H/S RF transform, B/S RFreceive signal forward to MCU, B/S MCU audio signal from (Pin 30, 29) at “LINETX_P” path transmit to line interface out of PSTN.

4.5.2. Ringer detect:Telephone line have ringer signal from tip ring into Base, and then Base transistor Q8 turn on and ringer data signal for Base MCU(Pin 58_IOGP16) detect and the handset buzzer have product “Melody tone”.

4.5.3. Type I CID receive:CID signal from tip ring couple CID signal at (CID1_P, CID1_N) path into Base MCU (Pin 29, 30) detect, Handset display show thetelephone no.

12


5 Location of Controls and Components

5.1. Controls5.1.1. Base Unit

5.1.2. Handset

5.1.3. Charger

6 Installation Instructions6.1. ConnectionsBase Unit

Note:• Use only the included AC adaptor and telephone line cord.• Connect the AC adaptor securely to the AC outlet.

Charger

Note:• Never install telephone wiring during a lightning storm.• Do not connect the AC adaptor to a ceiling-mounted AC out-

let, as the weight of the adaptor may cause it to become dis-connected.

Location• For maximum distance and noise-free operation, place your

base unit:- Away from electrical appliances such as TVs, radios,

personal computers or other phones.- In a convenient, high and central location.

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6.2. Battery6.2.1. Battery Installation

Note:• Use only the included rechargeable batteries HHR-55AAAB

or HHR-4EPT.

6.2.2. Battery Charge

6.2.3. Battery Strength

6.2.4. Panasonic Ni-MH Battery Performance

Note: • It takes 10 hours to fully charge the batteries, however, you

can use the handset if remains on the display whilecharging.

• It is normal for batteries not to reach full capacity at the initialcharge. Maximum battery performance is reached after afew complete cycles of charge/discharge (use).

• Actual battery performance depends on a combination ofhow often the handset is in use and how often it is not in use(standby).

• Even after the handset is fully charged, the handset can beleft on the base unit or charger without any ill effect on thebatteries.

• The battery strength may not be displayed correctly after youreplace the batteries. In this case, place the handset on thebase unit or charger and charge for at least 10 hours.

14


7 Operation Instructions7.1. Guide to Telephone Settings

7.2. Handset Registration

7.3. For Service Hint

15


8 Service Mode8.1. Engineering Mode8.1.1. Base Unit

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Note:(*1) Refer to Handset Registration (P.14).(*2) When you enter the address or New Data, please refer to the table below.

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [ ] + 11 1 B [ ] + 2. . C [ ] + 3. . D [ ] + 4. . E [ ] + 59 9 F [ ] + 6

17


8.1.2. Handset

18


Note:(*1) When you enter the address or New Data, please refer to the table below.

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [ ] + 11 1 B [ ] + 2. . C [ ] + 3. . D [ ] + 4. . E [ ] + 59 9 F [ ] + 6

19


8.2. How to Clear User Setting

20


8.3. How to Set When Replacing UnitIf base unit or handset has a defect, replace with new base unit or handset. Refer to the following procedures.

Note:• BS=Base unit, HS=Handset• To register handset, refer to Handset Registration (P.14)

21


Note:(*1) Refer to How to Clear User Setting (P.19)

22


9 Troubleshooting GuideIf your telephone does not work properly, try to solve the problem according to the following table.

Note:(*1) Refer to Handset Registration (P.14).

23


9.1. How to Replace the Flat Package ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), asoldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

9.1.1. Preparation• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.

• FluxRecommended Flux: Specific Gravity → 0.82.Type → RMA (lower residue, non-cleaning type)Note: See About Lead Free Solder (Pbf: Pb free) (P.4)

9.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder isleft at the joint on the board, the new IC will not be attached properly.

24


9.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

9.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

25


10 Disassembly and Assembly Instructions10.1. Disassembly Instructions10.1.1. Base Unit

26


10.1.2. Handset

27


11 Schematic Diagram11.1. For Schematic Diagram11.1.1. Base Unit (Schematic Diagram (Base Unit_Main))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

11.1.2. Handset (Schematic Diagram (Handset))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.2. The schematic diagrams may be modified at any time with the development of new technology.

28


11.2. Schematic Diagram (Base Unit_Main)

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CE

JTA

G I

NT

ER

FAC

E

VD

D3V

2 VD

DC

VD

DIN

T

VD

DO

VD

D3V

2

VD

DC

12P C

39

SC

L

VC

CW

PA

0A

1A

2G

ND

1 2 3 45678

SD

A

SC

L

BU

ZZ

ER

LINE_INUSEPARA_DETAON2

BP

HO

NE

_RLY

TD

OT

DI

TC

KT

MS

SD

A

DI_

SP

I

VS

SIO

4A

OP

2

LIN

ER

X_P

LIN

ET

X_P

VD

DA

AIP

2A

IN2

VR

2_C

TR

L

VR

1_C

TR

LV

BG

PV

SS

A

VS

SO

XTA

L2

XTA

L2

XTA

L1

XTA

L113

.824

MH

zX

TL

- AT

- 4

9

VR

2_C

TR

L

PO

WE

R_C

HK

VR

1_C

TR

L

AN

T0_

SW

AN

T1_

SW

RF

_SIG

[0]

RF

_SIG

[1]

VA

NLI

VB

ATV

MIC

IOGP24 / KB9VDDIO1

JTAG_TMS

IOGP13IOGP14 / BIF

VDDC2VSSC2

VSSINTPWR_SWITCH

VR3_CTRLAIP2BAIN2B

AD3AD2

AON2

JTAG_TCKJTAG_TDI

JTAG_TDORF_SIG[3]SIF_DATARF_SIG[2]VSSC1

VSSRSSIR_DATAT_GFSK / T-DATA

VDDO

VDDC1VDDINTREF_CLK

RF_SIG4 / IOGP28SIF_CLK

VD

DIO

3

IOG

P0

/ SC

L_IIC

IOG

P31

/ D

I_S

PI

IOG

P32

/ D

O_S

PI

IOG

P33

/ S

CK

_SP

I

IOG

P15

/ K

B0

IOG

P16

/ K

B1

IPG

P17

/ K

B2

IOG

P18

/ K

B3

IOG

P19

/ K

B4

IOG

P20

/ K

B5

VS

SIO

1IO

GP

21 /

KB

6

AC

DC

_LO

AD

IOG

P34

/ C

S_S

PI

IOG

P1

/ SD

A_I

IC

DO

_SP

IS

CK

_SP

IC

S_S

PI

RE

V2_

WP

RIN

G D

ET

OF

F_H

OO

KT

BR

38 /

600

EB

RR

EV

1_M

BR

PAG

E

C88

100N

C13

210

0N C54

100N

C53

100N

C81

100N

C12

38p

2

C7

8p2

J1

12

6463626160595849

1718192023242526272829303132 2122

12

123

13

4

14

5

15

6

16

78

11109

4748

3334353637383940414243444546

50 52 53 54 5655 5751

C14

5

TP

16

T_G

MS

K

T_E

NA

BLE

RF

_S_D

ATA

RF

_S_E

NR

F_S

_CLK

SLI

CE

_CT

R

R_D

ATA

P

RS

SI

RF

_CLK

_RE

F

TP

17T

P4

R61

1K

1KR

86

100N

PAG

E1

Pag

e K

ey

1V8

/ 2V

5

SC

LS

DA

TP

8

C61T

P5

1KR47 1%

1K3

R46

4K7

R41

100N

C83

C72

C40

C60

TP

3

TP

22

TP

15

TP

35C

9

C84

C77

C78C

86

100N

100N

R77

2K2

TP

34

TP

36

TP

33

TP

37

C65

C63

C59

R37

100N

C19

4

4K7

R40

1%

C15 1N

8p2

8p2

R66 8k2

8p2

8p2

8p2

8p2

8p2

8p2

8p2

8p2

8p2

TP

11

C45

100N

C19

010

0N

C90

100N

D5

I

TP

40

+++

I

+

+

TP

41E

C10

C79

12P

TP

42

TP

12

R74

R60 NC

510R

C44

12P

Q9

VD

D2V

5

VR

1_C

TR

L

PO

WE

R_C

HK

Pow

er fa

ilure

if V

DD

3V2

< 2

.8V

VR

2_C

TR

L

100U

/ 6V

3

R42

R43 1K

Q13

47K

47K

C19

38p

2

1KD

9

C93

C

B

E

TP

21

TP

28

TP

27

TP

26

TP

25

TP

20

TP

19

TP

18

100P

100P

SD

A

SC

L TD

O

TD

I

TC

K

TM

SC11

9C

118

+6V

100N

C14

410

0NC

143

12P

R51

10R

C96

C10

5

C10

3

C10

7

C10

9

C10

6

C10

8

8P2

8P2

8P2

2533

825

341

8P2

8P2

8P2

C75

8P2

C94

8P2

C95

15O

P

4U7

R44

10R

R45

100R

R59

R48

TP

39EC

210

0U

GN

D

GN

D

VB

GP

VM

IC

VD

DA G

ND

GN

DG

ND

GN

D

GN

D

CID

1_P

CID

1_N

GN

DG

ND

C51

10P

C46

100N

10P

C50

Y1

GN

D

R10

1

R98

R99

R10

5

R10

0

OR

OR

OR

OR

OR

CID

_PC

ID_N

EC

310

U6V

3

GN

D

GN

DG

ND

GN

D

GN

D

GN

D

GN

D GN

D

GN

D

TP

38

TP

13

TP

1

C41

C74

R72

20K

R73

C73

TP

220

K

100n

100n

C14

133

0P

C14

233

0P

R35

390K

R34

390K

C42

C43

C52

C82

100N

C5

100N

C47

100N

GN

DG

ND

GN

D

N.C

.N

.C.

N.C

.N

.C.

N.C

.

N.C

.

N.C

.C

410

0N

8p2

C12

1C

124

C99

C49

C56

2P7

100N

EE

PR

OM

30


C17

11U TP

29

TP

53 CR

D

CR

D + J7

2

II

J71I

11

6V_U

NR

EG

GN

D

Cha

rge

LED

J8

GN

D

N.C

N.C

N.C

R10

7

R10

8

C17

7

C17

C13

C16

C14

C17

6

Q29

L310

uHL210

uH

N.C

N.C

R10

927

R1/

4W

N.C

C

B

E

N.C

.N

.C.

N.C

HA

ND

SE

T B

ATT

ER

Y C

HA

RG

ER

Ant

enna

par

t TP

31 11

TP

32

AN

T1

AN

T0

OR

C16

9

OR

C17

0

100p

FC

130

1pF

C87

1pF

C20

2p7

C10

1

TP

7

TP

14

AN

T1

AN

T

AN

T0

AN

T0_

SW

AN

T1_

SW

12P

12P

12P

12P

12P

C15

22P

42P

42P

4C

120

C15

3C

76

12P

C18

112

PC

156

1KR65

1K

D7

R67

NC

C55

NC

C80

22N

L10

C91

C92

C15

5C

154

1000

UE

C61

8p2

EC

62

VD

D3V

2

N.C

+6V

PW

RJ2

GD

12

10U

10U

+6V

6V_U

NR

EG

L5 L6

GD

123P

INP

WR

J1

GN

D

N

OU

T1

OU

T2

N.C

C64

8p2

R49 3R

R71

750R

R70

470R

EC

6310

0U

470U

EC

65

10V+

+

+

C66

100N

C67

8p2

C12

6

6V_U

NR

EG

VD

D3V

2V

DD

PA

3V2

U1

For

TG

1090

Onl

y

R4

TB

C16

6T

B

TB

1 3 45678

2

TP

46

DO

_SP

IS

I

SC

K

RE

SE

T

CS

SO

GN

D

VC

C

WP

DI_

SP

IVD

D3V

2

VD

D3V

2

SC

K_S

PI

CS

_SP

I

Opt

ion

21A

udio

Fla

sh

U6

Fla

sh

CO

B2

T_GMSK

147

46

45

44

43

42

41

40

39

38

37

36

35

34

33

2

3

4

5

6

7

9

10

11

12

13

14

15

16

8

R_DATAP

RF_CLK_REF

RF_S_DATA

RF_S_EN

RF_S_CLK

SLICE_CTR

RSSI

VD

DPA C48

C68

EC

163

VD

D3V

2

T_E

NA

BLE

C16

210

0N10

0N10

0U8P

2

RF

AN

T

C14

8

TP

30

1

4.7p

F

4832 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

49 50 51 52 53 54 55 56 57 58 59 60 61 62 63

KX

-TG

1070

/107

2FX

SC

HE

MAT

IC D

IAG

RA

M (

Bas

e U

nit_

Mai

n 3/

3)N

.C: N

o C

ompo

nent

s

31


11.3. Schematic Diagram (Base Unit_Operation)

J1 KEY11

12

2

3

KX-TG1070/1072 SCHEMATIC DIAGRAM (Base Unit_Operation)

32


11.4. Schematic Diagram (Handset)

KX

-TG

A10

7 S

CH

EM

AT

IC D

IAG

RA

M (

Han

dset

_Mai

n 1/

3)N

.C: N

o C

ompo

nent

s

TP

101

TP

102

TP

104

TP

103

TP

5

TP

12

TP

10

L1

D6

I

+

I

+

I

+

I

+

I+

I +

+

++

+

Q5

Q9 B B

CC

E E

Q1

D4 D1

C25

100N

C72

100N

C85 NC

D3

NC

L3 27U

H

L2

TP

43

TP

11

TP

9T

P8

TP

4

D5

SL5

SL6 SL7

SL8

27U

H

TP

105

R34 1K

R4

15K

R24 NC

R28 OR

R43 1K

R42

15K

3V3

2V5

1V4

22U

EC

2647

u / 4

V

EC

1920

0u /

4V

EC

647

u / 4

V

EC

247

u / 4

V

VB

AT

PW

R_S

W

VD

D3V

3

VB

AT

VR

2_C

TR

L

VB

AT

FIL

1

Bat

tery

Fus

e T

race

VB

AT

SL

1

3.5V

MA

X

C26

12p

Q10

B

C E

R15 NC

R10 OR

C19

100n

R35

680R

C8

100N

C7

12P

C44

12P

C45

100N

C84

R50

R53 6k8

6k2

4U7

TP

108

Q6

U2

B

C

2V

DD

OU

T

GN

D

NC

NC

1 354

E

R44

TP

7

10R

C9

100N

R47

30K

1%

R46

18K

1%

R45

100R

R7

10R

C87 1N

C17 1N

Z1

R26

10K

R27

430R

SL

2

SL

3

SL

4

CH

AR

GE

_CT

RL

/ CR

AD

_DE

T

ES

D_T

EE

TH

/ 56

37

ES

D_T

EE

TH

/ 56

37

CH

AR

GE

CO

NT

AC

TS

ES

D_T

EE

TH

/ 56

37

ES

D1

ES

D3

11

1

1

1 1

1

1

1 1 1 1

11

2

1 1 1

ES

D_T

EE

TH

/ 56

37E

SD

4

ES

D2

VR

1_C

TR

L

VD

DC

VD

D2V

5

VD

D2V

5V

DD

A

2V5

VB

AT

BA

T_C

HK

Pow

er f

ailu

re i

f V

BA

T <

2V

VD

DO

VD

DIN

T

VB

AT

33


RX

TX

OP

TIO

N F

OR

TG

1090

ON

LY

U3

U4

BB

IC

U6

(MIC

)

U7

U1

EE

PR

OM

VD

D3V

3

C39

100N

TP

109

C76

12P

TP

112

TP

113

TP

114

TP

115

TP

116

TP

117

TP

118

TP

21T

P27

TP

119

TP

120

TP

121

TP

123

TP

124

GN

D

12P

C15

12P

C78

12P

C81

12P

C79

12P

R161K

C80

C33100N

100N

C36

100N

C54

100N

TP

130

TP

1

TP

6

TP

129

TP

132

TP

134

TP

136

TP

131

TP

133

TP

128

C50

10P

C52

100N

C67 NC

C66 NC

C70 12

pC

412

p

C2

10N

C82 NC

C83

12P

C28

NC

C75

TP

135 N

C

Z3

NC

II+ +

+

+

Z2

NC

C73

N.C

C41

22N

C43

12P

C1

10N

C74 N.C

C90 12P

C89

100N

C3

12P

C21

47U

/ 4V

TA

NT

TC

5

1K2

TP

29

TP

15

TP

3

R1

1K2

R2

100N

R14

62K

C5

NC

C63

100N

C91

4U7

C64

100N

C51

10P

R12

N.C

.C

4212

P

C29

12P

C53

330N

C27

12P

C57

12P

C58

12P

C59

12P

EC

1

SP

K1

SP

K2

10u

/16V

C56

100N

C71

NC

C30

330N

C20 OR

C22 1U

R13

N.C

R3

N.C

C65

12P

C55 1N

R19

4K7

C62

NC

R22

47K

TP

142

R23

N.C

R21

TP

137

TP

138

TP

140 T

P14

1

TP

139

TP

143

OR

R39

OR

R11

1K

Y1

13.8

24M

Hz

TP

16

C46

C16

C18

C20

C24

C37

C38

C40

12P

12P

12P

12P

12P

12P

12P

TP

26

TP

25T

P24

TP

23

TP

20

TP

18

AT

E I

NT

ER

FA

CE

JTA

G I

NT

ER

FA

CE

TP

19

C77

R62

NC

R61

OR

12P

R40 1K

R41

1K

C35

100N

TP

156

TP

110

TP

111

TP

127

C31

12P

C23

12P

C34

C47

12P

100N

C32

12P

C61 NC

C60 NC

R33 OR

R32 OR

12P

C11C12

12P

C6

12P

C49

NC

RE

C

TP

126T

P12

5T

P13

TP

14

R5

OR

R30

OR

R60

NC

R56

OR

C48

100N

SC

LS

DA

SC

LS

DA

SC

LS

DA

VC

CW

PA

2G

ND

1 2 3 4

8 7 6 5

A0

A1

VD

D3V

3

VD

D3V

3

VD

D3V

3

VD

DC

VD

DO

VDDINT

GN

D

GN

DG

ND

GN

DG

ND

GN

D

GN

DG

ND

GN

DG

ND

GN

D

GN

D

RE

C+

/ S

PK

_AM

P+

RE

C

/ SP

K_A

MP

I

I

RE

C+

/ S

PK

_AM

P+

RE

C

/ SP

K_A

MP

I

I

GN

DG

ND

GN

D

12

GN

D

GN

D

GN

D

GN

DG

ND

GN

D

GN

DG

ND

GN

D

CD

FC

2

FC

1

VIN

VC

C

GN

D

VO

2

VO

1

1 2 3 4

8 7 6 5

GN

D

GN

D

GN

DGN

DG

ND

GN

DG

ND

GN

D

GN

DG

ND

GN

D

GN

D

GN

D

KB

IO9

TD

O

TD

I

TC

K

TM

S

VB

AT

SD

A

SC

L

CH

AR

GE

_CT

RL

/ CR

AD

_DE

T

LCD

_CS

/ T

CO

M_B

LLC

D_S

CL

LCD

_SI

49

123456789

10111213141516

48474645444342414039383736353433

32 31 30 29 28 27 26 25 24 23 22 21 20 19 1718V

SS

IO1

IOG

P0

/ SC

L_IIC

LCD

_BL

TD

DT

DI

TC

KT

MS

AM

P_E

N /

BE

EP

AO

P2

VR

2_C

TR

LH

AN

DF

RE

E_B

L

VM

ICV

R1_

CT

RL

VD

D3V

3

T_G

MS

KA

MP

_EN

/ B

EE

P

BA

T_C

HK

VD

DA

AIP

2A

IN2

VR

2_C

TR

LV

AN

LIV

BA

TV

MIC

VR

1_C

TR

LV

BG

PV

SS

AR

F_S

IG [0

]R

F_S

IG [1

]V

SS

OX

TA

L2X

TA

L1

R_D

AT

AP

RS

SI

RF

_CLK

_RE

FT

_EN

AB

LER

F_S

_DA

TA

RF

_S_E

NR

F_S

_CLK

SLC

_CT

R

IOG

P1

/ SD

A_I

ICV

DD

IO3

VD

DIO

4

IOGP24 / KB9

IOGP13IOGP14 / BIF

VDDIO1JTAG_TMSJTAG_TCKJTAG_TDI

JTAG_TDORF_SIG4 / IOGP28SIF_CLKRF_SIG [3]SIF_DATARF_SIG [2]VSSC1VDDC1VDDINT

VSSC2VDDC2

VSSINT

VR3_CTRLPWR_SWITCH

AIP2BAIN2B

AD3

AON2AD2

REF_CLKVSSRSSIR_DATAT_GFSK / T-DATAVDDO

IOG

P31

/ D

I_S

PI

IOG

P32

/ D

O_S

PI

IOG

P33

/ S

CK

_SP

IIO

GP

34 /

CS

_SP

IIO

GP

15 /

KB

0IO

GP

16 /

KB

1IO

GP

17 /

KB

2IO

GP

18 /

KB

3IO

GP

19 /

KB

4IO

GP

20 /

KB

5

IOG

P21

/ K

B6

50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

KB

IO0

KB

IO1

KB

IO2

KB

IO3

KB

IO4

KB

IO5

KB

IO6

VD

D3V

3V

DD

3V3

VD

DC

PW

R_S

W

VD

DA

VM

IC

KX

-TG

A10

7 S

CH

EM

AT

IC D

IAG

RA

M (

Han

dset

_Mai

n 2/

3)N

.C: N

o C

ompo

nent

s

34


LCD

IN

TE

RF

AC

E (

3V

2 )

TR

IAN

GLE

KE

YP

AD

( 2

8 k

eys

max

)

Key

Ass

ignm

ent

RF

7 -

Seg

men

t LC

D

C K13

K20

Off

- H

On

- H

PW

R

PB

Dow

n

Up

OK

K21

K27

K5

K4

K3

K1

K7

K19

K10

K12

K16

K11

K15

K6

K25

K24

K23

K221

23

45

6

78

9

0#R

CO

B1

48

GN

D

GN

D

GN

D

GND

GND

T_GMSK

GND

R_DATAP

RF_CLK_REF

RF_S_DATA

RF_S_EN

RF_S_CLK

SLC_CTR

RSSI

T_ENABLE

GND

GND

VB

AT

EC

8

R31 2R

+

+12

P

C68

C69

100N

220u

/ 4V

EC

447

u / 4

VC

1310

0NC

1412

P

GN

D

GN

D

VD

D3V

3

VD

D3V

3

KB

IO0

KB

IO1

KB

IO2

KB

IO3

KB

IO4

KB

IO5

KB

IO6

KB

IO9

VD

D3V

3

Dow

nK19

K27

Rig

ht d

ot /

M

K13

Left

dot

/ C

K12

# 5

K20

SP

KK22

*

K21

RD

K6

K5

K4

K3

K2

K1

TC

OM

# 2

# 3

# 0

Up

Pho

ne

K23

# 7 K

25#

1

K24

# 4

K7

#

K15

# 9 K

16#

6

K11

# 8

K10

OF

F

LCD

_CS

/ T

CO

M_B

L

LCD

_SC

L

LCD

_SI

1 1 1 1 1 1

BU

Z1

C88

C15

7

12P

I

+

+4U

7

R94

2R2

R54

R52

1M

R49

100K

NC

R11

027

RD

10 Q8

R95

100K

C14

712

P R48

470R

TP

154

TP

36

TP

38

TP

39

TP

40

TP

42

TP

44

TP

155

Q20

B

CE

12

G

SD

AM

P_E

N /

BE

EP

49 50 51 52 53 54 55 56 57 58 59 60 61 62 63

32

AN

T1

C10

TP

2

OP

75

R58

31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

1

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

VD

DA

KX

-TG

A10

7 S

CH

EM

AT

IC D

IAG

RA

M (

Han

dset

_Mai

n 3/

3)

35


12 Printed Circuit Board12.1. Circuit Board (Base Unit)12.1.1. Component View

KX-TG1070/1072 CIRCUIT BOARD (Base Unit (Component View))

C45C44

C30

C29

C2

C119

C118

C57C3

C662

C69C90

U3

U6

Y1

C154C155

C152

C148

C30

C87

ANT1

C120C153

C92C91C76

C19

C129

C79

C83

R65

R50

R33R31

R62

R90

R69

R4

R45

R51

R41R40

R89R57

R93

R54R43

R42

R48

R74 R60

R109

EC163

EC4

EC10

COB2

EC3

EC1

EC

63

EC

65

EC

61

EC2

L10

TP7

L1

J7

J8

J1

L4

L7

L6

TP14

ANT0

RF

TP541 2 21TP52

TP40

TP42

TP41

TP49

TP60

TP63

TP46

TP59

TP39

D4

RL1

VAR1

PWRJ1PJ1 PWRJ2

D3

D1

Q11

Q13Q9

Q14

Q8

Q12

Q605

Q2

Q3

Q607

Q15

Q24

BUZ1

PbF

35-0

0605

5-00

3-20

0>E

P-G

W<

C16

9

C18

1 C15

6D

7

C55

C80

C17

0

C10

1

C20

C97

C54 C99

C71

C93

EC

658

C66

3

C65

7

C14

4

C16

6

C14

3

C89

C61

C88

C66

4

C58

R67

R64

9

R99

R88

R87

R56

R63

6

R44

R10

1R

98

R10

5

R91

R85

R12

R64

0 R17

R9

R83

R53

R59

L3 L2

L5

D61

0

D60

6D

9

D5

D2

36


12.1.2. Flow Solder Side View

C56

C49

C70

R100

TP30

TP32

TP21

TP20

TP19

TP28

TP27

TP26

TP4

TP23

TP1

TP2

TP8

TP11

U1

U2

PAGE1

TP12

TP6

TP16

TP24

TP9TP53

TP29

TP10

TP48

TP47

TP5

TP25TP18

TP31

D10

D603

Q10

Q30

Q6

Q28

Q7

Q606

Q601

Q29

Q20Q604

Q5Q1

Q4

R97

TP17

TP13

D60

8D

6

C126

C62

C64

C66

C67

C659 C35

C78

C4

C86

C9C77

C145

C41

C5

C52

C8

C6 C661

C1

C12

C22

C10

C11

C669

C21

C176

C34

C32

C142

C141

C42

C192

C177

C25

C33

C36

C31

C171

C28

C26

C132

C7

R49

R55

R71

R70

R7

R659

R68

R95

R73

R35

R34R72R104

R82

R14R16R21

R13

R10

R84R11

R637

R648

R632

R96

R23

R647

R24R63

R66

R81

R107

R665

R28

R631

R26

R92

R80R25

TP33

TP66TP15

TP74

TP34

TP38

TP37TP22

TP75

TP70

TP68

TP65

TP35

TP36

TP72

TP71TP73

TP79

TP78

TP69

TP55

TP45

TP44

TP43

TP58

TP62

TP61

TP57

TP56

TP51

C85

C67

0 C66

6C23

C69

3

C38C

59

C63

C65

C72

C66

5

C19

4

C19

3C

40

C60

C84

C47

C82

C18 C24

C27

C43

C65

6

C37

C13

C17

C16

C14

C68

C48

C53

C12

4

C95

C12

1

C68

8

C66

8

C39

C19

0

C94

C75

C10

6

C10

7

C10

8

C10

9

C10

3

C10

5

C16

2

R19

R18

R10

8

R20

R75

R79

R67

8

R76

R78

R69

1

R69

0

R1

R2

R30

R68

2

R27

R10

2

R10

3

R15

R94

R3

R32

R36

R63

3

R77

R52

R64

R38

R22

R8

C73

C74

C46

C96

C51

C50

C15

C81

C12

3

R46

R47

R58

R37

R63

9

R64

6

R63

5

R64

2

R64

4

R6

R63

8

R29

R5

R86

R61

R39

TP67

TP76

TP77

TP3

KX-TG1070/1072 CIRCUIT BOARD (Base Unit (Flow Solder Side View))

37


12.2. Circuit Board (Base Unit_Page key)12.2.1. Component View

TP1

KEY1

TP2

KX-TG1070/1072 CIRCUIT BOARD (Base Unit_page key (Component View))

38


Memo

39


12.3. Circuit Board (Handset)12.3.1. Component View

C1

C2

C10

C49

C12C11

COB1

C25

C20C37C40C42C69

C68

C13

C14C18

C16C15 C38 C24

C147

C56

C59R52

C57

C55C58

C72

C7C8

C26C19

C45

C44

C36

C71

C22

C27

C65C30

C80C33C78

C90C89C52

C85C74

C41

C43 C73

C76

C35

C77

C48

C39

C83

C91

C17

C87

C23

C4 C70C9

C82C64 C66

C63

R32

R30 R5

R33

R31

R24R4

R95R22

R94

R54

EC2

EC6

EC4

EC1BUZ1 EC19EC26

EC8

R42R43

R110

R8

R6

R7

R44

R45

R49

R59

R34

R18 R9R23

R3

R12

R13

R62

R60

R14

R56

R47

FIL1R2

R10

R27

L1

Y1

U1

U4

RF

U3

Z2

Z3L2

TP2ANT1

TP14TP125

TP110

TP111

TP126

> EP-GW <

PbF

35-006057-005-200

TP8

TP10

TP103

TP101

TP5

TP154

TP104

TP105

TP155

TP149TP144

TP147TP12

TP145

TP118

TP16TP119

TP124

TP123

TP151

TP1

TP127

TP142

TP130

TP150

TP141TP143

TP121

TP140

TP137

TP129

TP128

TP156

TP114

TP115

TP117

TP27

TP4

TP108TP131

TP135

TP11TP7 TP152

TP136

TP29SL7 SL8 SL3

SL4

SL2SL5

SL6

SL1

TP15

TP43

TP109

TP153TP113

D10

D4

D1

C84

D5

Q1Q5

Q9

Q4

Q2

Q3

Q7

Q20

Q8

Q10

U2Q6

C28

C75

C6

C88 C1

57

SPK1 SP

K2

C54

C81

C62

C61

C79

C46

C60

C29

C53

C50

C51

C5

C67

C3 C21 C3

2

C34 C4

7

C31

R58

R28

R37

R39

R29

R48

R38

R11

R16

R19

R21

R20

R46 R3

5

Z1

R50

R53

R1

R15

R41

R61

R40

R26

L3

TP13

TP12

0

TP14

8

TP11

6

TP10

2TP

9TP

146

TP6

TP13

8

TP13

9TP

3TP

132

TP13

3TC

5TP

134

TP26

TP21

TP25

TP24

TP23

TP20

TP11

2

TP18

TP19

D6

D3

KX-TGA107 CIRCUIT BOARD (Handset (Component View))

40


12.3.2. Flow Solder Side View

KX-TGA107 CIRCUIT BOARD (Handset (Flow Solder Side View))

2

U7

FM7

FM4

FM5

1

U6

TP22

PbF

TP44

TP17

TP

38

TP

39

TP

40

TP

36

TP

35

TP

34

TP

33

TP

32

TP

28

TP

30

TP

42

K13 K6 K27

K20 K4 K21

K2 K19 K10

K25 K5 K3

K24 K12 K16

K23 K11 K15

K22 K1 K7

> EP-GW <35-006057-005-200

41


13 Exploded View and Replacement Parts List1. RTL (Retention Time Limited)

Note:The marking (RTL) indicates that the Retention Time is limited for this item.After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time.The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing partand product retention. After the end of this period, the assembly will no longer be available.

2. Important safety noticeComponents identified by the mark indicates special characteristics important for safety. When replacing any of these com-ponents, only use specified manufacture’s parts.

3. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plas-tics.

Note:(*1) HANDSET without BATTERY COVER ASS’Y(*2) You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

G/NKXTG1070FXBKXTG1070FXCKXTG1072FXBKXTGA107EXBKXTGA107EXC

Ref. No. Part No. Part Name & Description Remarks

A1 PQZBG1070FXB BASE UNIT (RTL) (for KX-TG1070FXB/1072FXB)

A1 PQZBG1070FXC BASE UNIT (RTL) (for KX-TG1070FXC)

A2 PQZHGA107EXB HANDSET (RTL) (for KX-TG1070FXB/1072FXB) (*1)

A2 PQZHGA107EXC HANDSET (RTL) (for KX-TG1070FXC) (*1)

A3 PQWETGA107CE CHARGER UNIT with AC ADAPTOR (RTL) (for KX-TG1072FXB)

A4 PQWATG1070CE AC ADAPTOR (for Base Unit)

A5 PQQX15467Z INSTRUCTION BOOK (*2)

A6 8060094500 LID, BATTERY COVER ASS'Y (for KX-TG1070FXB/1072FXB) ABS-HB

A6 8060094600 LID, BATTERY COVER ASS'Y (for KX-TG1070FXC) ABS-HB

Panasonic Kxtg1070 Service Manual

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Transcript of Panasonic Kxtg1070 Service Manual