Painted sheet metal
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Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231. SELECTWE PATTERNING ON A DIELECTRIC SUBSTRATE U.S. Patent 5,830,533. Nov. 3, 1998 C. W.C. Lin and R.L. German, assignors to MicroeEectronics and Computer Technology Corp., Austin, Texas A method of selectively patterning metal on a dielectric substrate com- prising depositing a seed layer on a dielectric substrate wherein the seed layer is autocatalytic to an electri- cally conductive metal whereas the dielectric substrate is nonautocata- lytic to the metal; overlaying a resist mask on the seed layer wherein the resist mask has a pattern, which covers portions of the seed layer whereas a plurality of openings in the resist mask expose other por- tions of the seed layer; etching the exposed portions of the seed layer; removing the resist mask thereby exposing the unetched portions of the seed layer, which correspond to the pattern of the resist mask; and depositing the metal on the un- etched portions of the seed layer without depositing the metal on the dielectric substrate and without us- ing a mask, wherein the deposited metal corresponds to the pattern and the seed layer provides adhe- sion between the dielectric substrate and the deposited metal. ELECTROSTATIC PAlNTlNG OF POLYMERS U.S. Patent 5,830,541. Nov. 3, 1998 R. Carswell et al., assignorsto The DOWChemical Co., Midland, Mich. A process of electrostatically paint- ing a cured urea and/or urethane group containing polymer wherein the polymer is formed into a shaped article, coated with a conductive pre- paratory substance, and then elec- trostatically painted, the improve- ment comprising preparing the polymer from a polymer formulation including materials that include or form urea groups, urethane groups, or mixtures thereof and a nonvola- tile metal salt conductivity inducing material, wherein the nonvolatile metal salt excludes metal salts of thiocyanates. COATING COMPOSITION CONTAINING VERY FINE MICA IJ.S. Patent 5,830,567. NOV. 3, 1998 S. Panush, assignor to BASF Corp., Southfield, Mich. A nonmetallic coating composi- tion comprising a polymeric binder and a pigment comprising a mica in an amount so that mica produces added color without pro- ducing an opalescent or metallic effect or color travel. PAINTED SHEET METAL IJ.S. Patent 5,830,fiRO. Nov. 3, 1998 TJ. Flammer et al., assignorsto Mercedes Benz AC, Stuttgart, Germany A painted sheet metal part with an anticorrosion bonding layer based on polyacids and a method for applying such a bonding layer. MULTlLAVER COATING U.S. Patent 5,83O,(iRl. Nov. 3, 1998 Y. Masuda et al., assignors to Kansai Paint Co. Ltd., ?Japan A method for forming a multi- layer coating film, which com- prises applying a colored clear- coating containing a color pigment and/or a glittering mate- rial on a film of an aluminum flake containing metallic coating. ANODICALLV OXIDIZED SCANDIUM-DOPED ALUMINUM WlRlNG U.S. Patent 5,830,786. Nov. 3, 1998 H. Zhang et al., assignorsto Semiconductor Energy Laboratory Co. Ltd., Kanagawa, ?Japan A process for fabricating an imu- lated gate field effect transistor com- prising forming a metallic intercon- nection comprising aluminum on an insulating surface; oxidizing a surrounding of the metallic inter- connection used in the electronic circuit by anodic oxidation; and then exposing the metallic inter- connection to a laser treatment. ELECTROLESS DEPOSITION APPARATUS 1J.S.Patent 5,830,806. Nov. 3, 1998 Y. Shacham-Diamand et al., assignorsto Cornell Research Foundation, Ithaca, N.Y.; Sematech Inc., Austin, Texas; and Intel Corp., Santa Clara, Calif A method and apparatus for pro- cessing a semiconductor wafer us- ing electroless deposition that sub- jects the wafer to more than one processing fluid in a sealed process chamber while retaining the wafer in the sealed process chamber and allowing the processing of wafers to proceed in the absence of air. COMPOSITION FOR COATING REMOVAL U.S. Patent 5&?0,836. Nov. 3, 1998 P.E. Smith et al., assignorsto Eldorado Chemical Co. Inc., San Antonio, Texas A composition capable of sottening- to-release at about ambient temper- ature a polymeric coating when ap- plied to the coating comprising hydrogen peroxide or organic perox- 82 Metal Finishing
Transcript of Painted sheet metal
Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.
SELECTWE PATTERNING
ON A DIELECTRIC SUBSTRATE
U.S. Patent 5,830,533. Nov. 3, 1998 C. W.C. Lin and R.L. German, assignors to MicroeEectronics and Computer Technology Corp., Austin, Texas
A method of selectively patterning metal on a dielectric substrate com- prising depositing a seed layer on a dielectric substrate wherein the seed layer is autocatalytic to an electri- cally conductive metal whereas the dielectric substrate is nonautocata- lytic to the metal; overlaying a resist mask on the seed layer wherein the resist mask has a pattern, which covers portions of the seed layer whereas a plurality of openings in the resist mask expose other por- tions of the seed layer; etching the exposed portions of the seed layer; removing the resist mask thereby exposing the unetched portions of the seed layer, which correspond to the pattern of the resist mask; and depositing the metal on the un- etched portions of the seed layer without depositing the metal on the dielectric substrate and without us- ing a mask, wherein the deposited metal corresponds to the pattern and the seed layer provides adhe- sion between the dielectric substrate and the deposited metal.
ELECTROSTATIC PAlNTlNG OF POLYMERS
U.S. Patent 5,830,541. Nov. 3, 1998 R. Carswell et al., assignors to The DOW Chemical Co., Midland, Mich. A process of electrostatically paint- ing a cured urea and/or urethane group containing polymer wherein the polymer is formed into a shaped article, coated with a conductive pre-
paratory substance, and then elec- trostatically painted, the improve- ment comprising preparing the polymer from a polymer formulation including materials that include or form urea groups, urethane groups, or mixtures thereof and a nonvola- tile metal salt conductivity inducing material, wherein the nonvolatile metal salt excludes metal salts of thiocyanates.
COATING COMPOSITION CONTAINING VERY FINE MICA
IJ.S. Patent 5,830,567. NOV. 3, 1998 S. Panush, assignor to BASF Corp., Southfield, Mich. A nonmetallic coating composi- tion comprising a polymeric binder and a pigment comprising a mica in an amount so that mica produces added color without pro- ducing an opalescent or metallic effect or color travel.
PAINTED SHEET METAL
IJ.S. Patent 5,830,fiRO. Nov. 3, 1998 TJ. Flammer et al., assignors to Mercedes Benz AC, Stuttgart, Germany A painted sheet metal part with an anticorrosion bonding layer based on polyacids and a method for applying such a bonding layer.
MULTlLAVER COATING
U.S. Patent 5,83O,(iRl. Nov. 3, 1998 Y. Masuda et al., assignors to Kansai Paint Co. Ltd., ?Japan
A method for forming a multi- layer coating film, which com- prises applying a colored clear- coating containing a color pigment and/or a glittering mate- rial on a film of an aluminum flake containing metallic coating.
ANODICALLV OXIDIZED SCANDIUM-DOPED
ALUMINUM WlRlNG
U.S. Patent 5,830,786. Nov. 3, 1998 H. Zhang et al., assignors to Semiconductor Energy Laboratory Co. Ltd., Kanagawa, ?Japan A process for fabricating an imu-
lated gate field effect transistor com- prising forming a metallic intercon- nection comprising aluminum on an insulating surface; oxidizing a surrounding of the metallic inter- connection used in the electronic circuit by anodic oxidation; and then exposing the metallic inter- connection to a laser treatment.
ELECTROLESS DEPOSITION APPARATUS
1J.S. Patent 5,830,806. Nov. 3, 1998 Y. Shacham-Diamand et al., assignors to Cornell Research Foundation, Ithaca, N.Y.; Sematech Inc., Austin, Texas; and Intel Corp., Santa Clara, Calif
A method and apparatus for pro- cessing a semiconductor wafer us- ing electroless deposition that sub- jects the wafer to more than one processing fluid in a sealed process chamber while retaining the wafer in the sealed process chamber and allowing the processing of wafers to proceed in the absence of air.
COMPOSITION FOR COATING REMOVAL
U.S. Patent 5&?0,836. Nov. 3, 1998 P.E. Smith et al., assignors to Eldorado Chemical Co. Inc., San Antonio, Texas
A composition capable of sottening- to-release at about ambient temper- ature a polymeric coating when ap- plied to the coating comprising hydrogen peroxide or organic perox-
82 Metal Finishing
