PACS Instrument Intermediate Design Review (IIDR)
description
Transcript of PACS Instrument Intermediate Design Review (IIDR)
System Engineering 1
PACS IIDR ESTEC 01/02 March 2001
PACS Instrument Intermediate Design Review (IIDR)
Reinhard Katterloher
System Engineering
DDVP, Model Philosophy, Critical Areas
System Engineering 2
PACS IIDR ESTEC 01/02 March 2001
Status of Instrument Design
• Detailed interface requirements have been finalised
• Subsystem design has been finalised• Detailed system design has been
finalised• Design for on-board software has been
finalised• Design of EGSE and OGSE concept have
been finalised
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PACS IIDR ESTEC 01/02 March 2001
Status of H/W Documentation at IIDR
• All Specifications Documents related to components, subunits and units are issued
• Interface Requirements Doc. and all ICDs are issued• The Instrument Requirement Doc. is issued• The Instrument Science Requirement Doc. is issued• DDVP is updated to final instrument design• Test Plan (instrument AIV and calibr.) is issued (draft) • IID-B update issued
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DDVP and TP Main Contents
• DDVP describes the development approach according to the system level requirements, the overall qualification and verification concept at subunit/unit/ instrument level. No further issues are intended.
• Individual DDVPs are issued for components, subunits and units. They contain the relevant detailed information and cover the DIV program (environmen-tal and performance) until delivery of items to MPE.
• TP deals in detail with that part of DDVP which is related to all AIV activities (environmental and performance/calibration) on Instrument Level. Schedules and Test Facilities are included.
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Subsystem Verification (Qualification of Units)
X = test rs = warm resonance
search S = qualif. by similarity () = not a deliverable
QM
1B
OL
C/A
AV
M D
EC
/ME
C
AV
M S
PU
(+A
VM
2)
AV
M D
PU
CQ
M F
PU
(QM
2 B
OL
C/A
)
(QM
DE
C/M
EC
)
(QM
SP
U)
(QM
DP
U)
PF
M F
PU
PF
M B
OL
C/A
PF
M D
EC
/ME
C
PF
M S
PU
PF
M D
PU
FS
FP
U
FS
BO
LC
/A
FS
DE
C/M
EC
FS
SP
U
FS
DP
U
(Cryo-) Vibration X X S X X X X X X rs X X X X
Thermal Cycle X X X S X X X X X X X X X X X
Vacuum Cycle X X X S X X X X X X X X X X X
Thermal Range X X X S X X X X X X X X X X X
EMC (Instrument Level) X X X X X X X X X X
EMC (Satellite Level) X X X X X X
Physical Measurements X X X X X X X
Contamination Control X X X X X X X
Functionality/Performance X X X X X X X X X X X X X X X X X X X
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General Instrument AIV Sequence
Instrument Units manufactured byPACS Consortium
Partners
AIV on Unit level GEN-AIV-T01
Delivery Readiness Review
(acceptance tests passedat manufacturers site)
GEN-AIV-T02
Delivery of Unitsto
MPE
GEN-AIV-T03
Integration and Instrument Level Test (ILT-AVM/CQM/PFM/FS)Responsibility of MPE
(cryovibration/functional and performance test/spectral calibration
at TBD / MPE / LENS using special test equipment at different test sites)
GEN-AIV-T04
Deliveryto ESA
GEN-AIV-T05
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Instrument Units (Deliverables)
• 1 cryogenic FPU mounted on OB• 8 warm electronics boxes mounted on SVM
- 1 DPU (prime and redund.)- 2 SPU (1 prime, 1 redund.)- 4 analogue electronics boxes DEC1, MEC1 (prime), DEC2, MEC2 (redund.)- 1 analogue box BOLC
• 1 preamplifier box BOLA mounted on CVV• 1 set of interconnecting harnesses
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Instrument Block Diagram
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Thermal Mathematical Model
• Upgrade of TMM performed after implementation of bolometer assembly and according to design progress.
• New steady state conditions and transient behavior (temperatures and heat fluxes) of all inner parts of the FPU available.
• Predictions are reliable, if the PACS TMM is combined with the S/C cryostat TMM.
• An FPU cooldown time of more than 5 days is expected
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PACS IIDR ESTEC 01/02 March 2001Thermal Mathematical Model
Schematic
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Structural Mathematical Model
• Structural Analysis repeatedly performed after final FPU design. Impact of improvements on parts of FPU structure is being investigated
• Resonances above 100 Hz achieved• Values for resonance amplifications will be
available very soon giving final loads on individual subunits (chopper, grating, detectors, bolometer assembly, filterwheels, sources etc.)
• Results under agenda point FPU Mechanics
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Redundancy Concept
• WE units redundancy features- fully redundant: DPU, SPU, MEC- partly redundant: BOLC- not redundant: BOLA, DEC (several features to improve reliability)
• FPU redundancy features (no full redundancy)- Detectors (modules, supply groups, subarrays) - neither optics nor mechanisms are redundant (redundant windings and sensors)
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Redundancy Scheme (Wiring)FPFPU
Blue Photo-conductor
Red Photo-conductor
BlueBolometer
RedBolometer
Grating
Chopper
FilterWheels
CalibrationSources
Temp.Sensors
Herschel Cryostat
MEC1
Blue DEC
Red DEC
BOLC
BOLA
DSPModule
I/FModule
Base PSU
MEC2
DSPModule
I/FModule
Base PSU
Nominal SPU
Blue SPU
Red SPU
RedundantSPU
Blue SPU
Red SPU
DPU
NominalDPU
Redund.DPU
Partially Redundant Unit
Fully Redundant Unit
S/C
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Grounding Concept and EMC/EMI
• A final grounding concept has been achieved, detailed diagrams are shown in document PACS-ME-LI-006
• EMC/EMI study has started at MPE to identify and analyse critical points of system design. Modeling will provide EMC improvement.
• Grounding and EMC issues will be presented under agenda point Grounding Scheme
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Model Philosophy
• Deliverable Models to ESA are AVM, CQM, PFM, FS cold FPU (refurbished CQM) and electronics spare kits.
• For qualification of warm electronics units a QM model is required. But, a specific PACS SPU QM will not be built, qualification is done within Planck Proj.
• AVMs will not be returned to the PIs together with the CQM.
• For the test and calibration program (ILT) on the refurbished CQM FS-FPU (and for the benefit of further S/W development), all QM WE units are needed on instrument level (missing QMs need to be replaced by AVMs).
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H/W Deliverables (...) means not a deliverable
Development Models
AVM QM PFM FS
PACS
FPU
(Grating ) (Chopper ) (Detector ) (Bolometer)
Simul. CQM PFM Refurbished CQM
PACS
Warm Electronics
(DPU EQM) (DEC/MEC LM)
(SPU EM) (BOLC EM) (BOLA EM)
DPU DMC SPU
BOLC BOLA WIH
(DPU) (DMC)
(AVM2?) (BOLC) (BOLA)
DPU DMC SPU
BOLC BOLA WIH
Kit Kit Kit Kit Kit
(WIH)
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Critical Areas
Critical Areas regarding technology issues:
• CRE redesign and manufacture of complete QM-FEE (=> pretests on basic circuits)
• Grating assembly performance (=> development model, investigation of dry lubricants of bearings)
• Bolometer subarray manufacture• Chopper (=> lifetime model)• Black Paint
(=> sample performance and qualification program)
• Temperature Sensors (=> qualification program)
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Critical Areas ctd.
Critical Areas with respect to AIV and schedule:
• CRE redesign/manufacture/delivery loop• Detector modules and array/baffle
assembly • Detector module testing (little/no margin)• Bolometer Unit AIV• ILTs (little/no margin)
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CRE Risk Analysis
• Increased progress in CRE development makes a need for replacement of CREs by TIAs in the Photodetector Modules very unlikely
• CQM detector arrays will be fitted with CREs
• TIA performance proven during QM detector module pretests at MPE
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PACS IIDR ESTEC 01/02 March 2001Impact of TIA-Arrays on PACS
performance• In case the CRE performance is not
adequate for PACS FM , the impact is- two 25x16 (CRE) arrays to be replaced by two 4x16 (TIA) arrays- heat dissipation 35 mW, linear 1x4 on sky
• Re-definition of spectrometer calibration and observation, redesign DEC, S/W redesign DEC, SPU, DPU
• TIA concept is not an alternative solution, PACS efficiency in observation time degraded
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Summary Slide • Redundancy Concept• Redundancy Scheme (Wiring)• Grounding Concept and EMC/EMI• Model Philosophy• H/W Deliverables (...) means not a deliverable• Critical Areas• Critical Areas ctd.• CRE Risk Analysis• Impact of TIA-Arrays on PACS performance• Summary slides• PACS Instrument Intermediate Design Review (IIDR)
• PACS Instrument Intermediate Design Review (IIDR)• Status of Instrument Design• Status of H/W Documentation at IIDR• DDVP and TP Main Contents• Subsystem Verification (Qualification of Units)• General Instrument AIV Sequence• Instrument Units (Deliverables)• Instrument Block Diagram• Thermal Mathematical Model• Thermal Mathematical Model Schematic• Structural Mathematical Model