P Ì * (LFCSP) : Ñ Æ 0 ¸ 3 · p n " : ¸ 3 LFCSP ¦PCB p n À ñ ¦ Í J Æ ¦ ¸ 3 8 ": È H...
-
Upload
nguyenkhuong -
Category
Documents
-
view
216 -
download
0
Transcript of P Ì * (LFCSP) : Ñ Æ 0 ¸ 3 · p n " : ¸ 3 LFCSP ¦PCB p n À ñ ¦ Í J Æ ¦ ¸ 3 8 ": È H...
................................................................................................... 1 ................................................................................................... 1
...................................................................................... 2 ........................................................................................... 5
................................................................................................... 7 ........................................................................................... 9 ........................................................................................ 10
.................................................................................... 12 ........................................................................................ 14
(LFCSP)LFCSP JEDEC MO220 MO229
LFCSP (CSP)
/ (PCB)
PCB 1 PCB
2Sn/Pb 100% Sn
(LFCSP)
Gary Griffin
1.LFCSP
Rev.0 | Page 1 of 16
Rev.0 | Page 2 of 16
2. LFCSP
3. LFCSP (JEDEC MO-220)
4.
LFCSPLFCSP PCB
LFCSP 3
ADI
( 4)( M S L ) 3 ( M S L J E D E C
J-STD-20)
LFCSP
PCB
PCB
SMT
PCBPCB
LFCSPPCB
(FR-4) LFCSP(CTE) PCB
PCB
LFCSP PCBIPC-SM-782
IPCADI
PCB
LFCSP PCB 5
PCB
(MMC) (LMC)MMC LMC
PCB 0.05 mm0.05 mm
5. PCB
6.
I
(Cu)
IPC/EIA J-STD-001
http://www.analog.com/Analog_Root/Packages/Packages_Home/
DMIN
II XMAX bMAX 0.5mm
III TT TS
IPC-SM-782
I.LFCSP
II.XMAX
III.TT T
S
Rev.0 | Page 3 of 16
Rev.0 | Page 4 of 16
GDMIN
CLL
≥ 0.1 mm GDMIN
0.2 mm
0.2 mm
LFCSPPCB PCB
PCB
PCB
CPL
0.25 mm
“ ”7 7 mm ×
7 mm 48 θJA
0.3 mm
ADMAX = [( ) × (–1 )] +
0.3 mm 0.33 mm1.0 mm 1.2 mm 8 7 mm x 7 mm 48
LFCSP
9 6 mm x 6 mm LFCSP50% θJA
7.
8.PCB
9.
Rev.0 | Page 5 of 16
10.NSMD SMD /
11. (A) 0.5 mm(B) 0.4 mm
PCB(SMD) (NSMD)
NSMD SMD NSMD
10
120 15050 65
75 PCB0.5 mm
PCB 0.25 mm 0.4 mm
11
100
LFCSP
50 75 μm
= / = /
LFSCP
= LW/2T (L + W) = W/T
L W T0.66 1.5
PCB 1:1
0.4 mm 0.5 mm
PCB
50% 80%12
Rev.0 | Page 6 of 16
12.7 mm x 7 mm LFCSP
14. PCB
13.
RFLFCSP
PCB
(LPI) “ ”13
100
(a) (b)
(c) (d)
0.4 mm 0.5 mm 0.125mm0.15 mm
0.2 mm
LFCSP “ ”3
2D 3D80% 90%
LFCSP
IV
IV. (μm)
Rev.0 | Page 7 of 16
(PTH)PTH
PCB
5050%
75%
PCB
PCB
603 / 15 JEDEC J-STD-20C
15.
X
PCB LFCSP zX
LFCSP
zPCB
LFCSPPCB
1.
2 .
3. PCB
4.
5.
6.
7.
Rev.0 | Page 8 of 16
16. LFCSP
17.PCB
18.
PCB 125
PCB
16PCB
0.5 kg/cm2
PCB
1. —17
2. —
LFCSP
LFCSP 125
18A B PCB
Rev.0 | Page 9 of 16
22. LFCSP
23. LFCSP
20. LFCSP
19 20
1. 2. 3. 125
LFCSP3 25 45
LFCSP
50%50%
2122
LFCSP( 23 ).
PCB50 100 x y
21. / “ ”
Rev.0 | Page 10 of 16
24. θJA
24. θJA
7 mm × 7 mm LFCSP θJA
ANSYS7 mm x 7 mm 44 LFCSP 3.81
1S2P 1 2JEDEC JESD51-5
76
0.5 W 2.5 W 0 1.0 2.5 m/sθJA
θJA 24 θJA
1 m/s
1 W25
(ANSYS)AUTOCAD
ANSYS
LFCSPMaxwell Q3D Extractor
SPICE
100 MHz25
150100 MHz
15 FR-4JEDEC4
Rev.0 | Page 11 of 16
V. 7 mm × 7 mm × 1.4 mm LQFP VI. 7 mm × 7 mm × 0.9 mm LFCSP
15 mms
(l × w × t)
(l × w × t)
(l × w × t)
(l × w × t)
( )( )
( )( )
V VI 48 LQFP 7 mm × 7 mm × 1.4 mm 48 LFCSP 7 mm × 7 mm × 0.9 mm
L11 (nH) L12 (nH) C11 (pF) C12 (pF)
VII 8 LFCSP 3 mm × 2 mm × 0.85 VIII8 TSSOP 3 mm × 3 mm × 0.9 mm
Rev.0 | Page 12 of 16
VII. 3 mm × 2 mm × 0.85 mm 8 LFCSP
VIII. 3 mm × 3 mm × 0.9 mm 8 TSSOP
(l × w × t)
(l × w × t)
(l × w × t)
(l × w × t)
( )( )
( )( )
LFCSPLFCSP I/O
15/15/15/15 /
7mm×7mm LFCSP sn63/Pb37 sn95.5/ ag4.0Cu0.5
PCB / IPC-SM-782SnPb
IX
Rev.0 | Page 13 of 16
IX. ( IPC-SM-785)
X. 7 mm × 7 mm LFCSP
XI.
1–3
5
7-20
300 ohm OPENCoffin
Manson (Norris Landzberg )IX
/
26 XI
26.
(63.2%)
0.1%
50%
9.6031
0.9828
1697
827
1634
Rev.0 | Page 14 of 16
1. Sample application note for microCSP by Analog Devices (Report AN-617)
2. Application Notes for Surface Mount Assembly of Amkor’s Microleadframe (MLF) Packages, September 2002
3. Electrical Report from Amkor Technology: 7.0mm37.0mm31.4mm, 48 Lead LQFP, 3D Electrical Parasitic Parameters (Report EM-99-19), February 1999
4. Electrical Report from Amkor Technology: 7.0mm37.0mm30.9mm 48 Lead MLP2, 3D Electrical Parasitic Parameters (Report EM-99-03), February 1999
5. Electrical Report from Amkor Technology: 3.0mm33.0mm30.9mm 8 Lead TSSOP, 3D Electrical Parasitic Parameters (Report EM-98-57), October 1998
6. Electrical Report from Amkor Technology: 3.0mm 32.0mm 30.85mm 8 Lead MLF, 3D Electrical Parasitic Parameters (Report EM-2000-011), July 2000
7. Reliability Report from Analog Devices: Evaluation of Reliability of SnPb and SnAgCu Solder Joints In 737mm LFCSP Package, March 2003
8. Thermal Report from Amkor Technology: 7 mm square body, 44 lead MicroLeadFrame Packages(TM-00-11), April 2000
9. Lead Frame Chip Scale Package Rework Guidelines, Analog Devices
10. http://www.amkor.com/services/electrical /FAQ_3Dsoftware_data.pdf