ORMECON CSN Immersion Tin - INTERCONTIfiles.interconti.cz/200000656-55c3b56b53/ORMECON-CSN.pdf ·...
Transcript of ORMECON CSN Immersion Tin - INTERCONTIfiles.interconti.cz/200000656-55c3b56b53/ORMECON-CSN.pdf ·...
A Platform Specialty Products Company. 2
HASL OSP Imm Silver Imm Tin ENIG ENEPIG
Planarity No Yes Yes Yes Yes Yes
Solderjoint Cu-Sn Cu-Sn Cu-Sn Cu-Sn Ni-Sn Ni-Sn
Relative Cost $ $ $$ $$ $$$ $$$
IPC Shelf Life No Specification No Specification 12 months 12 months 12 months 12 months
Reflows 6 4 6 2 6 6
Contact E-Test, ICT Difficult E-Test, ICT, Keypad E-Test E-Test, ICT, Keypad E-Test, ICT, Keypad
Press Fit Good Good Good Good Good Good
Au Wirebond No No No No No Yes
Al Wirebond No No Yes No Yes Yes
Final Finish OverviewAdvantages & Disadvantages
A Platform Specialty Products Company. 3
Processability
A Complete Value Chain Solution
Visibility
Manufacturability
Dependability
Reliability
ORMECON CSN Delivers Value Throughout The Supply Chain
A Platform Specialty Products Company. 4
High Crystallinity & Reduced Copper Diffusion: lower
internal stress, less oxidation for improved appearance, more
free tin
Effective Whisker Protection: easy controllable whisker reducing additives in the pre-dip
Eliminated Tin Melting Risk: Ag content maintained at sufficiently low levels to prevent tin layer melting
Effective Mousebite Reduction: Optimal process control and replenishment ensures minimal mousebite
Reduction in Surface Discolouration: combination of post-
treatments for contamination removal. Reduced scrap for visual
defects
Lead-Free Solderability: Consistent solderability during
multiple assembly steps
Robust Process, Long Life: Stable plating quality within a wide process window
ORMECON CSN At a Glance
A Platform Specialty Products Company. 5
Whisker & Mousebite Reduction
ORMECON CSN
Vertical and horizontal
operations.
MacDermid Enthone technology
in the pre-dip
Lower temperature process
Less soldermask degredation
Robust, long bath life
CLEANER
MICROETCH
PRE-DIP
TIN PLATE
POST-TREATMENT
ORMECON CSN Process
A Platform Specialty Products Company. 6
Technology & Reaction Mechanism
ORMECON CSN
Technology of the Ormecon CSN pre-dip controls the copper
oxidation reaction allowing for improved tin layer properties
Cu2+
Sn0Sn2+
Cu0
Cu will deposit on
Sn
Sn will NOT deposit on
Cu
Cu0
Sn2+
Thiourea changes
oxidation potential of
Cu to below Sn
General deposition rule:
The more noble metal will deposit on the less noble metal.
2Cu + Sn²+ ------> Sn + 2Cu+
A Platform Specialty Products Company. 7
Product Line
ORMECON CSN
CLEANER
MICROETCH
PRE-DIP
TIN PLATE
POST-TREATMENT
ORMECON CSN ProcessPC 7086
Alkaline for optimized
surface cleaning
Usually Customer Own
For oxide removalOMP 7001 R
Deposition of a wet
Organic Metal / Ag nano
layer. Influences whisker
growth and tin deposition
mechanism.
CSN 7004-1
CSN 7004-2
CSN 7004 R1 V3
CSN 7004 R2 V3
CSN 7004-2 V3
Components for MU &
replenishment
Deposition of a high
crystalline structured tin
layer
RAD 7000 C
Removes polar
compounds. Reduces
ionic contamination
RPT 7000 C
Removes non-polar
compounds. Reduces
surface discolouration
A Platform Specialty Products Company. 8
Process Advantages
ORMECON CSN
Competitive Immersion Tin Supplier
Acid
Cleaner Rin
se
Micro Etch Pre-DipImmersion Tin
Sn + Ag (+Cu)Rin
se
DryFinal rinsing section
MacDermid Enthone with Organic Metal Silver Pre-dip
Cleaner
Rin
se
Micro Etch
Rin
se
DryFinal rinsing section
Pre-Dip
Ag
Immersion Tin
Sn (Cu)
Three metals in one bath very difficult to control, complicated
replenishment
Contain competing immersion reactions (e.g. ImSn and ImAg) which will
yield inconsistent coating composition and plating thickness
Annual new make up required
Ag and Sn separated independent monitoring, easier maintenance &
process control, simple replenishment
A precise quantity of the secondary metal is applied prior to the immersion
tin coating providing the most consistent Ag/Sn ratios pad to pad and board
to board
A Platform Specialty Products Company. 9
Stability & Tin (IV)
Robust Process
Sn deposition rate of CSN 7004 is NOT affected by Sn(IV) while the
other ImSn process is strongly affected above 2 g/l of Sn(IV)
The other Sn process requires costly procedures to remove the Sn(IV)
ORMECON CSN
Classic (CSN 7004)
Other MSA ImSn
Tin
th
ick
nes
s [
µm
]
A Platform Specialty Products Company. 10
Stability & Tin (IV)
Robust Process
CSN has a higher throughput at higher Sn(IV) concentrations
Throughput Veriation
0%
20%
40%
60%
80%
100%
0 1 2 3 4 5
Sn (IV) Concentration (g/L)
CSN
Other supplier
A Platform Specialty Products Company. 11
Three metals in one bath very difficult to control
Ag deposits together with Sn
Too much Ag in Sn layer causes Sn layer to melt during assembly
Subsequent assembly steps become more difficult
Competitive Immersion Tin Supplier
Acid
Cleaner Rin
se
Micro Etch Pre-DipImmersion Tin
Sn + Ag (+Cu)Rin
se
DryFinal rinsing section
Ag is deposited and controlled separately to the Sn
Amount of Ag deposited significantly less than competitor
A lower Ag content in the Sn layer reduces the Sn melting risk
Solderability is maintained
MacDermid Enthone with Organic Metal Silver Pre-dip
Cleaner
Rin
se
Micro Etch
Rin
se
DryFinal rinsing section
Pre-Dip
AgImmersion Tin
Sn (Cu)
Advantage of ORMECON CSN Technology
Eliminate Tin Melting Risk
A Platform Specialty Products Company. 12
Advantage of ORMECON CSN Technology
Eliminate Tin Melting Risk
ORMECON CSN Classic
Results After 2nd Reflow
Competitive ImSn
Results After 2nd Reflow
ORMECON CSN has reduced tin melting
Improved wetting performance during the second lead free reflow cycle
Less scrap for second side dewetting
A Platform Specialty Products Company. 13
Solder Spread Comparison
Lead-Free Solderability
Solder spread decreases with increasing lead free reflow cycles
Spread is higher for ORMECON CSN compared to a competitor process
ORMECON CSN
A Tin
Reflow status fresh 1x reflow 2x reflow 3x reflow 4x reflow 5x reflow
Sn - thickness 0.94 µm 0.22 µm 0.11 µm 0.05 µm 0.04 µm 0.03 µm
Spreading 257% 114% 108% 107% 101% 97%
Reflow status fresh 1x reflow 2x reflow 3x reflow 4x reflow 5x reflow
Sn - thickness 1.13 µm 0.32 µm 0.26 µm 0.22 µm 0.13 µm 0.11 µm
Spreading 286% 98% 105% 101% 95% 93%
A Platform Specialty Products Company. 14
Disadvantage of Depositing Ag and Sn Together
Lead-Free Solderability
With Ag in the immersion Sn bath, the competing interactions (e.g. immersion Ag and Sn) yielded inconsistent silver concentration and solderability.
* Preconditioned with 1x lead free reflows
No Ag Ag 1 Ag 2
A Platform Specialty Products Company. 15
Cu
Sn
Solder mask
Cu
Sn
Solder mask
dark field view bright field viewmouse bite
* A specialized test coupon (mouse bite coupon) can be used to evaluate the mousebite
Effective Mousebite ReductionWhat is Mousebite?
A Platform Specialty Products Company. 16
Mousebite was monitored in a cross test on both ORMECON CSN
and A lines
Company spec: < 7 µm surface & < 10 µm hole
Average Result: ORMECON CSN (IML Line) 1.8 µm
A Line 3.3 µm
Effective Mousebite ReductionComparison Study at Customer Z
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
MB of IML line
MB of A line
A Platform Specialty Products Company. 17
ORMCEON CSN Technology
Effective Whisker Protection
The OM-Ag nano layer is incorporated into the Sn coating
Reduction in the internal stress due to inter-diffusion between Cu and Sn, which is the driving force for whiskers
Without OMP
7001 Predip
With OMP
7001 Predip
24.15 µm 5.94 µm
* 6 weeks in ambient condition
A Platform Specialty Products Company. 18
The silver in ORMECON CSN is only 0.3% and evenly distributed. The concentration is not highest at the surface but collects in two regions; one just under the surface (0.2 µm) and the other around the transition to the intermetallic phase (0.85 µm)
Tiefe [μm]
0 0,5 1,0 1,5 2,0 2,5 3,0
Massekonz. [%
]
0
10
20
30
40
50
60
70
80
90
100 Sn
Sn
Sn Sn
Ag
Ag
Ag AgCu
Cu
Cu Cu
P P P PS S S SC C C CN N N N
OO O ONa Na Na Na
Proben-Nr 12_273_4BeschreibungAuftrag 2K12609-4
Sn - s(100%)Ag - s(1%)
Cu - s(100%)P - s(1%)
S - s(1%)C - s(1%)
N - s(10%)O - s(10%)Na - s(1%)
Ag scale = 5%
ImSn Supplier A
PCB Shop O
Tiefe [μm]
0 0,5 1,0 1,5 2,0 2,5 3,0
Massekonz. [%
]
0
10
20
30
40
50
60
70
80
90
100
Sn
Sn Sn Sn
Ag
Ag Ag Ag
Cu
Cu Cu Cu
P P P PS S S SC C C C
N N N NO
O O ONa Na Na Na
Proben-Nr 12_273_1
BeschreibungAuftrag 2K12609-1
Sn - s(100%)
Ag - s(5%)Cu - s(100%)
P - s(1%)
S - s(1%)C - s(1%)
N - s(10%)
O - s(10%)
Na - s(1%)
Tiefe [μm]
0 0,5 1,0 1,5 2,0 2,5 3,0
Massekonz. [%
]
0
10
20
30
40
50
60
70
80
90
100
Sn
Sn
Sn Sn
Ag
Ag
AgAg
Cu
Cu
Cu Cu
Proben-Nr 12-273_6BeschreibungAuftrag 2K12609-6
Sn - s(100%)Ag - s(1%)
Cu - s(100%)
Ag scale = 1%
ORMECON CSN
PCB Shop S
Tiefe [μm]
0 0,5 1,0 1,5 2,0 2,5 3,0
Massekonz. [%
]
0
10
20
30
40
50
60
70
80
90
100 Sn
Sn
Sn Sn Ag Ag
Ag AgCu
Cu
Cu Cu
P P P PS S S SC C C CN N N N
OO O ONa Na Na Na
Proben-Nr 12_273_3
Beschreibung
Auftrag 2K12609-3
Sn - s(100%)Ag - s(1%)
Cu - s(100%)
P - s(1%)
S - s(1%)C - s(1%)
N - s(10%)
O - s(10%)Na - s(1%)
Comparison with Supplier A
Effective Whisker Protection
The silver content in the tin layer of Supplier A tin layer is much higher (3%) and is distributed as a gradient. It decreases continually from the surface, where the highest concentration can be found.
A Platform Specialty Products Company. 19
All samples with different OM-Ag thickness show a maximum whisker length well below 50 µm after 32 weeks of testing
40-6020-403-20
70
60
50
40
30
20
10
0
OM-Ag (um)
Maxim
um
len
gth
(u
m)
Boxplot of Maximum Whisker Length (um)
ORMECON CSN Whisker Observation Data
Effective Whisker Protection
A Platform Specialty Products Company. 20
Post-Treatment combination effectively cleans surface.
Significant reduction in rejects and returns for visual defects.
Delivers consistent, reproducible coating no discolouration.
Fewer Visual Defects Reduction in Surface Discolouration
ORMECON CSN boards
Before Reflow
ORMECON CSN boards
After 3 X IR Reflows
A Platform Specialty Products Company. 21
Create Value With MacDermid Enthone and ORMECON CSN
ORMECON® CSN Classic
Suppliers NOT
using OM Technology
Bath Make UpExended life/Reduced make-up
frequencyRequire fresh make-up each
year
Whisker ControlOM-Ag complex predip independant of Sn bath
Ag integrated in Sn bath, difficult to control
High risk of tin melting
Deposition RateSn deposition rate not
impacted by Sn(IV)
Sn depostion rate reduced by Sn(IV); Sn(IV) reduction
required
Energy DemandLow (recommended process
temp: 68°C)Higher energy demand
(72°C)
Surface Cleanliness
RAD, RPT post-dips assure surface cleanliness
Post-dip in optional, high risk of surface discoloration