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Transcript of Oracle SPARC T7 a M7 servery
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Oracle’s SPARC T7 and M7 ServersNew Platform for Secure Computing
Petr SlačíkOracle Systems Sales [email protected]
Copyright © 2015, Oracle and/or its affiliates. All rights reserved. |
Safe Harbor StatementThe following is intended to outline our general product direction. It is intended for information purposes only, and may not be incorporated into any contract. It is not a commitment to deliver any material, code, or functionality, and should not be relied upon in making purchasing decisions. The development, release, and timing of any features or functionality described for Oracle’s products remains at the sole discretion of Oracle.
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Today2000s1990s
Realize the full potential of new hardware technology todayBreakthrough Hardware and Software Delivered Together
Software Functions on Chip
Oracle’s Software in Silicon
64-bit Computing Multicore, Multithread
HW SWHW SW
Hardware and Software Available Together
Open Systems Virtualization and Cloud
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6 Processors in 5 YearsOracle’s Microprocessors
201320112010 2013 20132015
16 x 2nd Gen cores4 MB L3 Cache
1.65 GHz
8 x 3rd Gen Cores 4 MB L3 Cache
3.0 GHz
16 x 3rd Gen Cores8 MB L3 Cache
3.6 GHz
12 x 3rd Gen Cores 48 MB L3 Cache
3.6 GHz
6 x 3rd Gen Cores48 MB L3 Cache
3.6 GHz
32 x 4th Gen Cores 64 MB L3 Cache
4.13 GHz
SPARC T3 SPARC T4 SPARC T5 SPARC M5 SPARC M6 SPARC M7
IncludingSoftware in Silicon
• Silicon Secured Memory• Encryption Acceleration• Query Acceleration• More…
}
Today
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Oracle SPARC Processor Roadmap
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SPARC M7 Processor Overview• Software in Silicon Acceleration
– Silicon Secured Memory– Encryption– In-Memory Query Acceleration– Inline Data Decompression
• 32 Cores @ 4.133 GHz• 256 HW Threads per Processor• Dynamic Threading supporting Critical Threads• Up to 16 of DDR4 Memory DIMMs per Processor• Up to 8-way Fully Connected Glueless SMP• Up to 16-way SMP with Switch ASICs • Technology: TSMC 20nm, 13ML• Oracle Core SW core factor 0.5
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Key improvements in microprocessor capabilityPressing the State of the Art
SPARC T5 SPARC M7 Improvement
More Cores 16 32 2XMore Threads 128 256 2XLarger Cache per Core 0.5 MB 2 MB 4XMore Memory Bandwidth 79 GB/s 160 GB/s 2XFaster Memory Access 163 ns 131 ns +20%More I/O Bandwidth 32 GB/s 145 GB/s 4XFaster Processor Frequency 3.60 GHz 4.13 GHz +15%
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SPARC M7 Processor-Based Servers
• SPARC M7 Processor: Software in Silicon, New Core• DDR4-2133 Memory: Faster and lower power consumption • DIMM Sparing: Standard feature for higher availability• NVMe Flash Drives for high performance• x16 capable PCIe 3.0 slots: More I/O Throughput• 2x more PCIe buses per processor for higher availability• On-board SAS3 with 2x throughput (for T7-1,-2,-4)• Solaris 11.3 or later required
– Solaris 10 9/10 and later in Guest Domains
Common Characteristics
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• Up to 8 processors directly connected (glueless)
• Scaling beyond 8 sockets with the directory/switch ASIC (glued)
• Dynamic congestion avoidance for data
• Coherence and Scalability Links• Link Level RAS in hardware
– CRC check and automatic message retry– Automatic lane retire (per direction)– Automatic link retrain and reinitialization– Built in PRBS testing during link training
SPARC M7 SMP Scalability
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More Memory Bandwidth
SPARC M7 vs. IBM Power8 SPARC M7 vs. x86 E5 v3Local Memory SPARC M7 is 2x faster SPARC M7 is 3x fasterRemote Memory SPARC M7 is 4x faster SPARC M7 is 4x faster
OracleM7
LocalMemory
168 GB/s
M7
RemoteMemory
111 GB/s
IBMPower8
LocalMemory
73 GB/s
Power8
RemoteMemory
30 GB/s
X86E5 v3
LocalMemory
57 GB/s
E5 v3
RemoteMemory
27 GB/s
• Modern computers connect memory directly to each processor• When architecture is unbalanced, access to remote memory is much slower than local
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DIMM Sparing
• Automatic retirement of a memory DIMM that is potentially failing• Used in presence of correctible errors, protects the system against potential future hard failures• Retirement is done dynamically while the system is running• Memory capacity remains unchanged and error protection intact• In a fully populated memory configuration, 1/16 of each memory DIMM is reserved to be used for
isolating one entire DIMM from the configuration• One of the 16 DIMMs can be remapped into each of the other 15 DIMMs
Increased Availability and Reliability
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New Platform for Secure ComputingWith Oracle’s Software in Silicon architecture
Security in Silicon
Wide key encryption and Silicon Secured Memory
Breakthrough hardware SQL acceleration and decompression for
Oracle Database In-Memory
SQL in Silicon
More cores, more threads, more bandwidth, lower latency – Extreme performance for apps and cloud
World’s Fastest Microprocessor
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Hardware Accelerated Cryptography32 Crypto Accelerators with the broadest set of ciphers
Clear Data In
Encrypted Data Out
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SPARC’s Long-Term Investment in Security
_x0004_2005 _x0004_2007 _x0004_2010 _x0004_2011
SPARC T1
SPARC T2
SPARC T3
SPARC T4, T5, M5, M6
RSADSA
AES DES 3DES
DSA ECC MD5 RC4
RSA SHA-1 SHA-256
AES CRC32c DES
3DESDH DSAECC
Kasumi MD5 RSA SHA-1 SHA-256 SHA-384 SHA-512
AES Camellia CRC32c DES
3DESDHDSA ECC
Kasumi MD5 RSA SHA-1SHA-224 SHA-256 SHA-384 SHA-512
2011-2015
Ten years of hardware accelerated encryption
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SPARC M7 advantage increases on highest security ciphersMuch Faster End-To-End Encryption
SPARC M732 cores
IBM Power86 cores
Intel X86 E5 v318 cores
4x Faster vs. X86
11x Faster vs. IBM Power
AES 128-CBC: Popular for Cloud, DB
SPARC M732 cores
IBM Power86 cores
Intel X86 E5 v318 cores SHA 512-1024: Important for Banking Operations
83 GB/s
22 GB/s
8 GB/s
84 GB/s
4.7 GB/s
2.4 GB/s
18x Faster vs. X86
35x Faster vs. IBM Power
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Oracle Database 12c Breakthrough: Dual Format Database
• BOTH row and column formats for same table
• Simultaneously active and transactionally consistent
• Analytics and reporting use new in-memory column format
• OLTP uses proven row format
Memory Memory
SALES SALESRow
FormatColumnFormat
SALES
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SQL In Silicon: In-Memory Query Acceleration
SPARC M7
Cache
SQLAccel
SQLAccel
SQLAccel
SQLAccel
Core Core Core Core
• Dedicated SQL accelerators built on chip– Independently process streams of compressed
data placed in system memory– Like adding 32 additional specialized cores to chip– Up to 170 Billion rows per second!
• Frees processor cores to run other applications, such as OLTP
• Decompresses data simultaneously to processing SQL functions– Like adding 64 additional specialized cores
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DAX: Data Analytics AcceleratorSPARC M7 In-Memory Database Advantages
Industry-leading SPARC M7 memory bandwidthDAX decompresses data at same rate as scan-onlyDAX performs one-step scans, range scans, and assists Bloom filter joins
SQL:select sum(lo_extendedprice*lo_discount) as revenuefrom lineorder, date_dim where lo_orderdate = d_datekey and d_year = 2012 and lo_quantity between 6 and 25 and lo_discount between 1 and 3
Processes:Decode values (DAX) & Sum aggregation (cores)
Hash Joins (cores) Bloom Filter Joins (DAX & cores)
Scans (DAX) Range Scans (DAX)
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Decompress at memory speed >120 GB/secSQL In Silicon: Accelerating Oracle Database 12c
One step
10Xfaster
DecompressMore than Doubles data size Read Software
scanRead Write
Writ
e
Read
DAX
Writ
e
Multiple steps
SQL: SELECT count(*) …WHERE lo_orderdate = d_datekey …AND lo_partkey = 1059538 AND d_year_monthnum BETWEEN 201311 AND 201312;
t
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Fast analytics for real-time decision makingSQL In Silicon
SPARC T7-1 Single-Chip Server32 Cores
363 Queries/min per Chip
5 x HP ProLiant DL380 G92-Chip Servers
180 Cores
33 Queries/min per Chip
1 TB Database compressed into 160 GB of memory
5x FasterIn-Memory
Query and Analytics
5x Fewer Servers10x Fewer Chips
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How you can use Software in Silicon with Oracle DB
• In-Memory Query Acceleration and Inline Decompression only available with “In-Memory Option”
• Oracle DB 12.1.0.2 BP7 + Solaris 11.3 or later required• DB 12.1.0.2 BP13 (Oct 2015) recommended• Oracle Applications certified for DB 12c supports DAX
– Performance will be application specific– Internal workloads have been heavily optimized with indexes over time– More Opportunities with Customer DB
In-Memory Query Acceleration and Inline Decompression (DAX)
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Solaris and SPARC VirtualizationNo-cost Virtualization for a More Efficient Datacenter
Physical Domains (PDoms)Oracle VM Server for SPARC (LDoms)
M-series T-Series
Oracle Solaris Containers/Zones
Oracle Solaris
Domain A Web
Oracle Solaris
Domain A
Domain C
App
AppDomain B
WebWeb
Sola
ris 8
Con
tain
er
DB
Sola
ris 9
Con
tain
er
App
Sola
ris C
onta
iner
Web
Sola
ris C
onta
iner
Domain A
Domain B
OLTP DB
OLTP DB
DW DB
App App
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SPARC T7-1, T7-2, and T7-4 Servers: Availability Features
Redundant, hot-swappable power supplies
Redundant, hot-swappable cooling fans
Hot-pluggable I/O adapters (SPARC T7-4)
Hardware RAID 0, 1, 10, and 1E integrated in disk
controller
SDRAM error protection, message retry in hardware, lane retire in
hardware, cyclic redundancy check (CRC), and DIMM sparing
ZFS with software RAID 5, 6, and 10 for file system
resilience Multiple PCIe root complexes for isolated I/O virtualization
Power-On Self-Test
Independent power domains on processor modules (SPARC T7-4)Dual integrated SAS HBAs or
NVMe PCIe switches for drive isolation (SPARC T7-2 and T7-4)
Hot-pluggable drives
Front and rear system indicator LEDs
Redundant I/O controllerswith MPxIO for storage devices and IPMP for network devices
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SPARC M7-8 and M7-16 Servers: Availability Features
Redundant, hot-swappable cooling fans
Hot-pluggable I/O adapters
Redundant, hot-serviceable SPs with automatic failover
Distributed, independent and redundant clocking
Isolated PDoms
Dedicated PCIe buses for every slot for isolated I/O virtualization
CRC protected systems interconnect with message retry
and lane sparing in hardware
ZFS with software RAID 5, 6, and 10 for file system resilience
Interconnect: SEC/DED protection with inline correction Redundant, hot-swappable power
supplies, dual grid power input
Redundant I/O controllerswith MPxIO for storage devices and IPMP for network devices
Redundant and reconfigurable interconnect switch ASICs Redundant DC power on CMIOU
boards, CPU module, and switch unit
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SDRAM error protection, message retry in hardware, lane retire in
hardware, cyclic redundancy check (CRC), and DIMM sparing
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* Best 2-chip result
SPECjEnterprise * PeopleSoft HR+PayrollSPECcpu rates 1-chip (four benchmarks) PeopleSoft HR-onlySPEComp PeopleSoft Batch-onlySPECvirt2013 * PeopleSoft FMS BatchJava Workload FLEXCUBE UBSSAP-SD Oracle Communications ASAP TelcoE-Business OnlineE-Business Order-to-Cash Batch In Memory AggregationE-Business Payroll Batch NoSQL YCSBOracle Internet Directory GraphOracle Stream Explorer R statistics
SPARC M7: Setting 20 World Records in Performance
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General App+DB
Secure Cloud App+DB
Big Data / Mining
In Memory DB
1.9x
1.9x
2.0x
1.9x
2.1x
2.1x
2.6x
2.5x
2.7x
4.0x
3.1x
8.3x
2.40130673363095
3.96341463414634
10.8358208955224 10.8x
8.3x
HadoopGraph NoSQLR Statistics
In Memory QueriesReal Time EnterpiseIn Memory AggregationBusiness Intelligence
SecurityVirtualization 4-chipVirtualization 2-chip
Java + DBJavaPeopleSoftERP
2x to 4x Faster per Chip than Leading x86 E5 v3
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World record SPECjEnterprise resultBreakthrough Secure Computing
25,093.06 EjOPS
SECURE
22,543.34
21,504.30
2 x IBM S8248 x Power8
6 core
2 x X86 Server4 x E5 v3
2 x SPARC T7-12 x chips
EjOPS
EjOPS
Database & Network Encrypted
Unprotected Everywhere
Unprotected Everywhere
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SPARC T7 and M7 System Beta Success
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(1) Factory configured with one (up to 8 processors) or two (up to 4 processors each) static physical domains(2) 1, 2, 3 or 4 reconfigurable physical domains
SPARC T7 and M7 Servers
T7-1 T7-2 T7-4 M7-8 M7-16Processors 1 2 2 or 4 Up to 8 Up to 16
Max Cores 32 64 128 256 512
Max Threads 256 512 1,024 2,048 4,096
Max Memory .5 TB 1 TB 2 TB 4 TB 8 TB
Form Factor 2U 3U 5U Rack / 10U Rack
Domaining LDOMs LDOMs LDOMs LDOMs, PDOMs 1 LDOMs, PDOMs 2
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SPARC T5-2 SPARC T5-4 SPARC T5-8
Processor SPARC T5 3.6GHz
SPARC T5 3.6GHz
SPARC T5 3.6GHz
Max Processor Chips 2 4 8
Max Cores/Threads 32, 256 64, 512 128, 1024
DIMM Slots 32 64 128
Max Memory 256GB, 512GB, 1TB 1TB or 2TB 2TB or 4TB
Drive Bays 6 8 8
I/O Slots 8 LP x8 PCIe 3.0, 4 x 10GbE ports
16 LP x8 PCIe 3.0,4 x 10GbE ports
16 LP x8 PCIe 3.0,4 x 10GbE ports
Form Factor/RU Rack 3RU Rack 5RU Rack 8RUMax Power Consumption 1927W 2410W 4850W
SPARC T5 ServersProduct Line Overview
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Wor
seBe
tter
Near Linear PricingOracle’s Superior Systems Economics
Pric
e /
Perf
orm
ance
Wor
seBe
tter
Pric
e /
Perf
orm
ance
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SPARC T7-1 ServerSystem Details
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SPARC T7-1 Server: Overview• 2U chassis, fits into 900 mm deep rack• One SPARC M7 processor (32 cores/256 threads)• Up to 512 GB of memory
– 8 or 16 DIMMs, 16 GB or 32 GB each• Eight 2.5” SFF disk drive bays
– Up to 8 hot-swappable SAS HDDs/SSDs – Up to 4 hot-pluggable NVMe SSDs– Mixing SAS and NVMe drives supported
• One onboard SAS3 HBA (hardware RAID 0/1/10/1E)• One optional NVMe PCIe switch card (factory-installed)• Four 10GBASE-T ports (two onboard dual-port NICs)• 6 low-profile PCIe 3.0 x8 slots, or 2 x16 + 2 x8 slots (4 PCIe buses)• Front-load DVD drive• Local (front and rear USB, rear video) and remote KVMS• Four hot-pluggable redundant fan modules (top loading)• Two 1,000 W (output) hot-pluggable power supplies (1+1)
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SPARC T7-1 Versus SPARC T5-2 (1P) and SPARC T4-1
Feature SPARC T7-1 SPARC T5-2 (1P) SPARC T4-1Form Factor 2U, 737 mm (29”) deep 3U, 732 mm (28.8”) deep 2U, 715 mm (28.1”) deepProcessor 1x 4.13 GHz SPARC M7, 32 cores,
(32 cores, 256 threads)1x 3.6 GHz SPARC T5, 16 cores,
(16 cores, 128 threads)1x 2.85 GHz SPARC T4, 8 cores
(8 cores, 64 threads)Memory DDR4-2133, 16x slots,
Max. 512 GB w/ 32 GB DIMMsDDR3-1066, 16x slots,
Max. 512 GB w/ 32 GB DIMMsDDR3-1066, 16x slots,
Max. 512 GB w/ 32 GB DIMMsIntegrated Network Ports 4x 10GBASE-T 4x 10GBASE-T 4x 1000BASE-T Internal Storage 8x 2.5” hot-pluggable SFF bays
8x SAS 3.0 HDD and/or SSD, 4x NVMe SSDs6x 2.5” hot-pluggable SFF bays
6x SAS 3.0 HDD or SSD8x 2.5” hot-pluggable SFF bays
8x SAS 2.0 HDD or SSDRemovable Media DVD drive DVD drive DVD driveManagement Ports 1x Serial (RJ-45), 1x 100BASE-T,
1x VGA (HD-15)1x Serial (RJ-45), 1x 100BASE-T,
1x VGA (HD-15)1x Serial (RJ-45), 1x 100BASE-T,
1x VGA (HD-15)USB Ports 2xUSB 2.0, 2x USB 3.0 2xUSB 2.0, 2x USB 3.0 4xUSB 2.0PCI Express Slots 6x PCIe 3.0 (x8) low-profile slots,
or 4x PCIe 3.0 slots, 2 (x16) and 2 (x8) 8x PCIe 3.0 (x8) low-profile slots 6x PCIe 2.0 low-profile slots
Fans 4x redundant hot-swappable dual fan modules 6 x redundant hot-swappable fans 6x redundant hot-swappable dual fan
modulesPower Supplies (Nominal Output) 2x 1000 watt AC, 1+1 2 x 2000 watt AC, 1+1 2 x 1200 watt AC, 1+1
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SPARC T7-2 ServerSystem Details
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SPARC T7-2 Server: Overview• 3U chassis, fits into 900 mm deep rack• Two SPARC M7 processors (64 cores/512 threads)• Up to 1 TB GB of memory
– 16 or 32 DIMMs, 16 GB or 32 GB each• Six 2.5” SFF disk drive bays
– Up to 6 hot-swappable SAS HDDs/SSDs – Up to 4 hot-pluggable NVMe SSDs– Mixing SAS and NVMe drives supported
• Dual onboard SAS3 HBAs (HW RAID 0/1/10/1E)• One or two optional NVMe PCIe switch cards (factory-installed)• Four 10GBASE-T ports (two onboard dual-port NICs)• 8 low-profile PCIe 3.0 slots, 4 x16 + 4 x8 (8 PCIe buses)• Front-load DVD drive• Local (front and rear USB, rear video) and remote KVMS • Six hot-swappable redundant fan modules (top loading)• Two 2,000 W (output) hot-swappable power supplies (1+1)
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SPARC T7-2 Versus SPARC T5-2
Feature SPARC T7-2 SPARC T5-2Form Factor 3U, 753 mm (29.6”) deep 3U, 753 mm (29.6”) deep
Processor 2x 4.13 GHz SPARC M7, 32-cores, (64 cores, 512 threads)
2x 3.6 GHz SPARC T5, 16-cores, (32 cores, 256 threads)
Memory DDR4-2133, 32x slots, Max. 1TB w/ 32 GB DIMMs
DDR3-1066, 32x slots, Max. 1TB w/ 32 GB DIMMs
Integrated Network Ports 4x 10GBASE-T 4x 10GBASE-T
Internal Storage 6x 2.5” hot-pluggable SFF bays6x SAS 3.0 HDD or SSD, 4x NVMe SSDs
6x 2.5” hot-pluggable SFF bays6x SAS 3.0 HDD or SSD
Removable Media DVD drive DVD driveManagement Ports 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15) 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)USB Ports 2xUSB 2.0, 2x USB 3.0 2xUSB 2.0, 2x USB 3.0PCI Express Slots 8x PCIe 3.0 low-profile slots, 4 (x16) and 4 (x8) 8x PCIe 3.0 (x8) low-profile slotsFans 6x redundant hot-swappable fans 6 x redundant hot-swappable fansPower Supplies (Nominal output) 2x 2000 watt AC, 1+1 2 x 2000 watt AC, 1+1
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SPARC T7-4 ServerSystem Details
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SPARC T7-4 Server: Overview• 5U chassis, fits into 1,000 mm deep rack• Two or four SPARC M7 processors (up to 128 cores/1024 threads)• Up to 2 TB of memory
– 32 or 64 DIMMs, 16 GB or 32 GB each• Eight 2.5” SFF disk drive bays
– Up to 8 hot-swappable SAS HDDs/SSDs and/or hot-pluggable NVMe SSDs
– Mixing SAS and NVMe drives supported• Dual onboard SAS3 HBA (hardware RAID 0/1/10/1E)• Two optional NVMe PCIe switch cards*• Four 10GBASE-T ports (two onboard dual-port NICs)• 16 low-profile PCIe 3.0 slots, 8 x16 + 8 x8 (twelve PCIe buses)**• Local (front and rear USB, rear video) and remote KVMS• Five hot-swappable redundant fan modules (rear loading)• Four 3,000 W (output) hot-swappable power supplies (N+N )
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* Factory-configured or field add-on** Plus two internal slots for NVMe PCIe switch cards
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SPARC T7-4 Versus SPARC T5-4
Feature SPARC T7-4 SPARC T5-4Form Factor 5U, 31.5” deep 5U, 31.5” deepCPU 4x SPARC M7
4.13 GHz (1,024 threads)4x SPARC T5
3.6 GHz (512 threads)Memory DDR4-2133, 64x slots,
Max. 2TB w/ 32 GB DIMMsDDR3-1066, 64x slots,
Max. 2TB w/ 32 GB DIMMsIntegrated Network Ports 4x 10GBASE-T 4x 10GBASE-T Internal Storage 8x 2.5” hot-pluggable SFF bays
8x SAS 3.0 HDD or SSD, 8x NVMe SSDs8x 2.5” hot-pluggable SFF bays
8 x 2.5” SAS 3.0 HDD or SSDRemovable Media via rKVMS via rKVMSManagement Ports 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15) 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)USB Ports 4x USB 3.0 4x USB 3.0PCI Express Slots 16x PCIe 3.0 slots, 8 (x16) and 8 (x8)
Hot-pluggable low-profile slots with card carrier16x PCIe 3.0 (x8) slots
Hot-pluggable low-profile slots with card carrierFans 5 x redundant hot-swappable dual fan modules 5 x redundant hot-swappable dual fan modulesPower Supplies (Nominal Output) 4 x 3000 watt AC, N+N 2 x 3000 watt AC, 1+1
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SPARC M7-8 ServerSystem Details
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SPARC M7-8 Server: Overview• Two factory-configured options:
– One static physical domain with up to 8 processors– Two static physical domains, each up to 4 processors
• 2 to 8 SPARC M7 processors (up to 256 cores and 2,048 threads)• Up to 4 TB of memory
– 8 or 16 DIMMs per processor (16 GB or 32 GB DIMMs)• Up to 24 PCIe 3.0 (x16) slots
– 3 PCIe slots per processor, dedicated PCIe buses per slot• Redundant hot-swappable SPs with automatic failover• Redundant system clocks• Eight hot-swappable redundant fan modules• Six 3,000 W (output) hot-swappable power supplies (N+N)• Power input: 3-phase PDUs, or 1-phase direct• Factory mounted in a system rack (Oracle’s Sun Rack II 1242)• Optional: Standalone 10U chassis (1,200 mm deep rack)
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SPARC M7-8 Versus SPARC T5-8
Feature SPARC M7-8 SPARC T5-8Form Factor System rack: 600 mm wide, 1200 mm deep, 2 m (78 2/3”) high
Standalone: 10U, 813 mm (32”) deep chassis; Min. 1,200 mm deep rack8U, 800 mm (31.5”) deepMin. 1,000 mm deep rack
Physical Domains 1 or 2 1Processor SPARC M7, 32 cores, 4.13 GHz SPARC T5, 16 cores, 3.6 GHzMax. Processors/Cores/Threads 8/256/2048 8/128/1024Memory DDR4-2133, 128x slots; Max. 4 TB w/ 32 GB DIMMs DDR3-1066, 128x slots; Max. 4 TB w/ 32 GB DIMMsIntegrated Network Ports PCIe NIC cards 4x 10GBASE-T Internal Storage Up to 16 x Oracle Flash Accelerator F160 PCIe Card, hot-pluggable Up to 8 x 2.5” SAS 3.0 HDD or SSD, hot-pluggableRemovable Media via rKVMS via rKVMSManagement Ports Dual SPs, ports per SP: 1x serial (RJ-45), 1x 100BASE-T 1x Serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)USB ports - 4x USB 3.0
PCI Express Slots Up to 24x PCIe 3.0 (x16) slotsHot-pluggable low-profile slots with card carrier
16x PCIe 3.0 (x8) slotsHot-pluggable low-profile slots with card carrier
Fans 8 x redundant hot-swappable dual fan modules 10 x redundant hot-swappable dual fan modulesPower Supplies (Nominal Output) 6 x 3000 watt AC, N+N 4 x 3000 watt AC, N+N
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SPARC M7-16 ServerSystem Details
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Copyright © 2015, Oracle and/or its affiliates. All rights reserved. |
SPARC M7-16 Server: Overview• Reconfigurable: 1, 2, 3, or 4 PDoms• 4 to 16 SPARC M7 processors (up to 512 cores/4,096 threads)• Up to 8 TB of memory
– 8 or 16 DIMMs per processor (16 GB or 32 GB DIMMs)• Up to 48 PCIe 3.0 (x16) slots
– 3 PCIe slots per processor– One dedicated PCIe bus per slot
• Redundant hot-swappable SPs with automatic failover• Redundant system clocks• Redundant, hot-swappable fan modules• Sixteen 3,000 W (output) hot-swappable power supplies (N+N)• Power input: Dual 3-phase PDUs• Factory-mounted in Sun Rack II 1242 system rack
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SPARC M7-16 Versus SPARC M6-32
Feature SPARC M7-16 SPARC M6-32
Form FactorH: 78.7” (2,000 mm), W: 23.6” (600 mm), D: 47.2” (1,200 mm),
1,670 lbs. (749 kg)H: 78.7” (2000 mm), W: 35.6” (940 mm), D: 57.1” (1,451 mm),
3,700 lbs. (1,678 kg)Physical Domains 1, 2, 3, or 4 1, 2, 3, or 4Processor SPARC M7, 32 cores, 4.13 GHz SPARC M6, 12 cores, 3.6 GHzMax. Processors/Cores/Threads 16/512/4096 32/384/3072Memory DDR4-2133, 256x slots, Max. 8 TB w/ 32 GB DIMMs DDR3-1066, 1024x slots, Max. 32 TB w/ 32 GB DIMMsIntegrated Network Ports PCIe NIC Cards Base I/O CardsInternal Storage Up to 32 Oracle Flash Accelerator F160 PCIe Cards, hot-pluggable Up to 32 x 2.5” SAS HDD or SSD, hot-pluggable
PCI Express Slots Up to 48x PCIe 3.0 (x16) slotsHot-pluggable low-profile slots with card carrier
64x PCIe 3.0 (x8) slotsHot-pluggable low-profile slots with card carrier
Redundant, Hot-Swappable Fans 16 x dual fan modules in CMIOU chassis36 x fan modules in switch chassis 10 x redundant hot-swappable dual fan modules
Power Connections 3-phase/dual grid, total of 6 inputs cables 3-phase/dual grid, total of 6 inputs cablesPower Supplies (Nominal Output) 16 x 3000 watt AC (N+N) 12 x 7100 watt AC (N+N)
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ZS3 Mixed-use Storage• 160 TB (raw) storage for Virtual Machine and system data
QDR InfiniBand Unified Ultra-fast Network• 40GB/s QDR InfiniBand IO backplane
M7 Servers for Databases & Applications• 1 or 2 M7 Chassis per system (Elastic Configurations)• 2 Physical Domains per M7 chassis, 1 - 4 processors ea.• Up to 8TB RAM per rack
Exadata Storage Servers for Oracle Database From 3 to 11 per configuration (Flex. Config.) High Capacity (96TB raw disk ea.) Extreme Flash (12.8TB raw flash ea.)
SuperCluster M7: Hardware Architecture
SuperCluster M7
05/03/2023
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Scale Further to Multi-Rack
(3) Exadata Storage
Servers
(1) ZS3 StorageAppliance
(2) InfiniBand leaf switches
(1) InfiniBand spine switch
Low Cost Elastic Capacity on DemandSuperCluster M7: Elastic Configurations
Add Racks to Continue Scaling
Incrementally add Compute and/or Storage
M7 Chassis, Compute & Memory
Extreme Flash Storage
High-Capacity Storage 3
1
2
Start With Elastic Base Rack
Scale to Elastic Full Rack
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The world’s most advanced systems for enterprise workloads, with unique capabilities for information security, database acceleration, and Java acceleration
SPARC M7 Processor–Based Systems
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oracle.com/sparc
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Benchmark Disclosure Statement• Copyright 2015, Oracle &/or its affiliates. All rights reserved. Oracle & Java are registered trademarks of Oracle &/or its affiliates. Other names may be trademarks of their
respective owners• SPEC and the benchmark name SPECjEnterprise are registered trademarks of the Standard Performance Evaluation Corporation. Results from www.spec.org as of 10/25/2015.
SPARC T7-1, 25,818.85 SPECjEnterprise2010 EjOPS (unsecure); SPARC T7-1, 25,093.06 SPECjEnterprise2010 EjOPS (secure); Oracle Server X5-2, 21,504.30 SPECjEnterprise2010 EjOPS (unsecure); IBM Power S824, 22,543.34 SPECjEnterprise2010 EjOPS (unsecure); IBM x3650 M5, 19,282.14 SPECjEnterprise2010 EjOPS (unsecure).
• SPEC and the benchmark name SPECvirt_sc are registered trademarks of the Standard Performance Evaluation Corporation. Results from www.spec.org as of 10/25/2015. SPARC T7-2, SPECvirt_sc2013 3026@168 VMs; HP DL580 Gen9, SPECvirt_sc2013 3020@168 VMs; Lenovo x3850 X6; SPECvirt_sc2013 2655@147 VMs; Huawei FusionServer RH2288H V3, SPECvirt_sc2013 1616@95 VMs; HP ProLiant DL360 Gen9, SPECvirt_sc2013 1614@95 VMs; IBM Power S824, SPECvirt_sc2013 1371@79 VMs.
• SPEC and the benchmark names SPECfp and SPECint are registered trademarks of the Standard Performance Evaluation Corporation. Results as of October 25, 2015 from www.spec.org and this report. 1 chip resultsSPARC T7-1: 1200 SPECint_rate2006, 1120 SPECint_rate_base2006, 832 SPECfp_rate2006, 801 SPECfp_rate_base2006; SPARC T5-1B: 489 SPECint_rate2006, 440 SPECint_rate_base2006, 369 SPECfp_rate2006, 350 SPECfp_rate_base2006; Fujitsu SPARC M10-4S: 546 SPECint_rate2006, 479 SPECint_rate_base2006, 462 SPECfp_rate2006, 418 SPECfp_rate_base2006. IBM Power 710 Express: 289 SPECint_rate2006, 255 SPECint_rate_base2006, 248 SPECfp_rate2006, 229 SPECfp_rate_base2006; Fujitsu CELSIUS C740: 715 SPECint_rate2006, 693 SPECint_rate_base2006; NEC Express5800/R120f-1M: 474 SPECfp_rate2006, 460 SPECfp_rate_base2006.
• SPEC and the benchmark name SPEC OMP are registered trademarks of the Standard Performance Evaluation Corporation. Results as of October 25, 2015 from www.spec.org and this report. SPARC T7-4 (4 chips, 128 cores, 1024 threads): 27.9 SPECompG_peak2012, 26.4 SPECompG_base2012; HP ProLiant DL580 Gen9 (4 chips, 72 cores, 144 threads): 21.5 SPECompG_peak2012, 20.4 SPECompG_base2012; Cisco UCS C460 M7 (4 chips, 72 cores, 144 threads): 20.8 SPECompG_base2012.
• Two-tier SAP Sales and Distribution (SD) standard application benchmarks, SAP Enhancement Package 5 for SAP ERP 6.0 as of 10/23/15: SPARC T7-2 (2 processors, 64 cores, 512 threads) 30,800 SAP SD users, 2 x 4.13 GHz SPARC M7, 1 TB memory, Oracle Database 12c, Oracle Solaris 11, Cert# 2015050. IBM Power System S824 (4 processors, 24 cores, 192 threads) 21,212 SAP SD users, 4 x 3.52 GHz POWER8, 512 GB memory, DB2 10.5, AIX 7, Cert#201401. Dell PowerEdge R730 (2 processors, 36 cores, 72 threads) 16,500 SAP SD users, 2 x 2.3 GHz Intel Xeon Processor E5-2699 v3 256 GB memory, SAP ASE 16, RHEL 7, Cert#2014033. HP ProLiant DL380 Gen9 (2 processors, 36 cores, 72 threads) 16,101 SAP SD users, 2 x 2.3 GHz Intel Xeon Processor E5-2699 v3 256 GB memory, SAP ASE 16, RHEL 6.5, Cert#2014032. SAP, R/3, reg TM of SAP AG in Germany and other countries. More info www.sap.com/benchmark
• Additional Info: http://blogs.oracle.com/bestperf
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