Optimizing Inductor Winding Geometry for Lowest DC ...
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Optimizing Inductor Winding Geometry for Lowest DC-Resistance using LiveLink between COMSOL and MATLAB H. Schneider*, T. Andersen, J. D. Mønster, M. P. Madsen, A. Knott and M. A. E. Andersen Department of Electrical Engineering, Technical University of Denmark - DTU Elektro, Ørsteds Plads, building 349, DK-2800 Kgs. Lyngby, Denmark Introduction Conventional Wire Wound Inductor • Limited utilization of the winding space. • Manual manufacturing process for small core and thick wires. Case 1: Few turns, PCB layer thickness << Foil thickness Number of turns: 10, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm Winding angle configuration Bottom Opt. Top Starting point SP [%] 0 20 0 Outer Foil Segment F1 [%] 0 63 0 Top Foil Segment F2 [%] 0 37 100 Inner Segment F3 [%] 0 0 0 Bottom Segment F4 [%] 100 0 0 DC resistance [mΩ] 6.46 4.75 4.52 Improvement [%] Ref. 27 30 Hybrid Foil/PCB Wound Inductor • Fully automated process. From cutout of the foils to pick and placement of the winding assembly. • Good utilization of the winding space. • Low price due to mass production of the winding assembly • Short time to marked due the possibility of a distributed stock of the winding assembly. • Configurable winding configuration through PCB traces. • Different core materials can be used with the same winding assembly. 0 20 40 60 80 100 120 140 160 180 0 0.01 0.02 0.03 Resistance [Ohm] Solution index "k" Hybrid inductor - 2D simulation 0 20 40 60 80 100 120 140 160 180 0 0.5 1 Number of iteration: #1 sim time: 616.4726sec F1-outer F2-top F3-inner F4-bottom FS-start Case 2: Many turns, PCB layer thickness << Foil thickness Number of turns: 100, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm Winding angle configuration Bottom Opt. Top Starting point SP [%] 0 0 0 Outer Foil Segment F1 [%] 0 75 0 Top Foil Segment F2 [%] 0 25 100 Inner Segment F3 [%] 0 0 0 Bottom Segment F4 [%] 100 0 0 DC resistance [mΩ] 435 432 432 Improvement [%] Ref. 0.8 0.8 Case 3 Few turns, PCB layer thickness = Foil thickness Number of turns: 10, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm Winding angle configuration Bottom Opt. Top Starting point SP [%] 0 100 0 Outer Foil Segment F1 [%] 0 38 0 Top Foil Segment F2 [%] 0 21 100 Inner Segment F3 [%] 0 0.5 0 Bottom Segment F4 [%] 100 40.5 0 DC resistance [mΩ] 2.6 2.3 2.6 Improvement [%] Ref. 11 0 Optimization of the winding configuration Results Specification based geometric 3D model in MATLAB 2D continuity and import to COMSOL via LifeLink™ Import result from COMSOL into Matlab and plot results Problem: PCB layer thickness is a bottleneck for high power applications. Solution: Optimize the winding configuration by changing the angle of each segment of the winding. Technical University of Denmark, DTU Elektro, Ørsteds Plads, bygning 349, DK-2800 Kgs. Lyngby, Denmark [email protected] Introduction Optimization of the winding configuration Results
Transcript of Optimizing Inductor Winding Geometry for Lowest DC ...
Optimizing Inductor Winding Geometry for Lowest DC-Resistance using LiveLink between COMSOL and MATLAB
H. Schneider*, T. Andersen, J. D. Mønster, M. P. Madsen, A. Knott and M. A. E. AndersenDepartment of Electrical Engineering, Technical University of Denmark - DTU Elektro,
Ørsteds Plads, building 349, DK-2800 Kgs. Lyngby, Denmark
Introduction
Conventional Wire Wound Inductor • Limited utilization of the winding space.
• Manual manufacturing process for small
core and thick wires.
Case 1: Few turns, PCB layer thickness << Foil thickness
Number of turns: 10, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm
Winding angle configuration Bottom Opt. Top
Starting point SP [%] 0 20 0
Outer Foil Segment F1 [%] 0 63 0
Top Foil Segment F2 [%] 0 37 100
Inner Segment F3 [%] 0 0 0
Bottom Segment F4 [%] 100 0 0
DC resistance [mΩ] 6.46 4.75 4.52
Improvement [%] Ref. 27 30
Hybrid Foil/PCB Wound Inductor • Fully automated process. From cutout of the foils to pick
and placement of the winding assembly.
• Good utilization of the winding space.
• Low price due to mass production of the winding assembly
• Short time to marked due the possibility of a distributed stock of the winding assembly.
• Configurable winding configuration through PCB traces.
• Different core materials can be used with the same winding assembly.
0 20 40 60 80 100 120 140 160 1800
0.01
0.02
0.03
Resis
tance
[Ohm
]
Solution index "k"
Hybrid inductor - 2D simulation
0 20 40 60 80 100 120 140 160 1800
0.5
1
1.5
2Number of iteration: #1 sim time: 616.4726sec
F1-outerF2-topF3-innerF4-bottomFS-start
Case 2: Many turns, PCB layer thickness << Foil thickness
Number of turns: 100, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm
Winding angle configuration Bottom Opt. Top
Starting point SP [%] 0 0 0
Outer Foil Segment F1 [%] 0 75 0
Top Foil Segment F2 [%] 0 25 100
Inner Segment F3 [%] 0 0 0
Bottom Segment F4 [%] 100 0 0
DC resistance [mΩ] 435 432 432
Improvement [%] Ref. 0.8 0.8
Case 3 Few turns, PCB layer thickness = Foil thickness
Number of turns: 10, Segment thickness: F1, F2, F3 = 500 µm, F4 = 70um, Clearance = 1mm
Winding angle configuration Bottom Opt. Top
Starting point SP [%] 0 100 0
Outer Foil Segment F1 [%] 0 38 0
Top Foil Segment F2 [%] 0 21 100
Inner Segment F3 [%] 0 0.5 0
Bottom Segment F4 [%] 100 40.5 0
DC resistance [mΩ] 2.6 2.3 2.6
Improvement [%] Ref. 11 0
Optimization of the winding configuration
Results
Specification based geometric 3D model in MATLAB
2D continuity and import to COMSOL via LifeLink™
Import result from COMSOL into Matlab and plot results
Problem: PCB layer thickness is a bottleneck for high power applications.
Solution: Optimize the winding configuration by changing the angle of each segment of the winding.
COMSOL via LifeLink™
Technical University of Denmark, DTU Elektro, Ørsteds Plads, bygning 349, DK-2800 Kgs. Lyngby, [email protected]
Introduction
Optimization of the winding confi guration
Results Results
Introduction
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