Opportunities for Gigascale Integration in Three Dimensional Architectures James Joyner, Payman...
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![Page 1: Opportunities for Gigascale Integration in Three Dimensional Architectures James Joyner, Payman Zarkesh-Ha, Jeffrey Davis, and James Meindl Microelectronics.](https://reader035.fdocuments.net/reader035/viewer/2022070306/5519b85c55034660578b4891/html5/thumbnails/1.jpg)
Opportunities for Gigascale Integration in Three Dimensional Architectures
James Joyner, Payman Zarkesh-Ha, Jeffrey Davis, and James Meindl
Microelectronics Research CenterGeorgia Institute of Technology
SLIP Workshop 20009 April 2000
Supported by DARPA and SRC
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Motivation
• 10% of Interconnects = 80% of Wire Length.• KEEP INTERCONNECTS SHORT!!
0
0.2
0.4
0.6
0.8
1
1.2
1 10 100 1000 10000
Length in Gate Pitches
Per
cen
tag
e o
f C
um
ula
tive
Total Interconnects
Total Length
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Motivation
• Each gate has more neighboring gates.
2D 3D
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Motivation
• Reduction of gate pitch due to smaller wire-limited area.
2D 3D
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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3D Architecture Concepts
• Stratum - A layer of transistors with its tiers of interconnects.
• Tier - A pair of orthogonal metal levels with equal pitch.
Stratum 1
Stratum 2
Tier 2
Tier 1
Tier 2
Tier 1
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3D Architecture Concepts
• Stratal- to gate- pitch ratio r.
Stratum 1
Stratum 2g
s
p
pr sp
gp
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3D Architecture Concepts
Importance of r• Height of metal stack is at least as
great as the gate pitch (r > 1).• Substrate thickness for mechanical
stability.• Thermal/electrical insulation of strata.• r affects the probability of running an
interconnect vertically.
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3D Architecture Concepts
• Gate pair – two gates separated by a given manhattan length.
• Length in manhattan geometry.
4121
zyx llll
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Derivation of 3D Model
• Need two values.– Number of expected interconnects
between a gate pair (probability of occupation).• Use Rent’s Rule.
– Number of gate pairs (density of states).• Use discrete convolution.
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Derivation of 3D Model
Number of Expected Interconnects• Expression from Rent’s Rule.
A B C
B B
B
B
B
C
C
C
C
C
A B B C
2D
1D
pkNNNfi CBA ,,,,exp
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Derivation of 3D Model
• Manhattan sphere instead of circles.
1 2
2
2
2
3
3
3
3
3
33
3
4
4
4
4
4
4
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Derivation of 3D Model
• Edge effects.Horizontal
1 2
2
2
2
3
3
3
3
3
33
3
4
4
4
4
4
4
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Derivation of 3D Model
• Edge effects.Vertical
3
3
3
3
3
33
3
4
4
4
4
4
4
1 2
2
2
2
3 3
3
3
3
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Derivation of 3D Model
• Use of averaging to avoid both horizontal and vertical edge effects.
• A function for the number of starting gates must be defined.
lm
lmlN
s
tB
1
1
l
kBC kNlN
Number ofGate Pairs
Number ofStarting Gates
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Derivation of 3D Model
• Starting gate – a gate that can serve as the NA of a gate pair for a given length.
X
X
X
X X
X
X
X
X
1D
2D X
X
X
X
X
Length = 5
X
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Comparison with 2D
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04
Length in Gate Pitches
Inte
rco
nn
ec
t D
en
sit
y F
un
cti
on
3D Model
Davis Model
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Variable r
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04
Length in Gate Pitches
Inte
rco
nn
ect
Den
sity
Fu
nct
ion
r = 1
r = 50
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Variable Strata
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04
Length in Gate Pitches
Inte
rco
nn
ect
Den
sity
Fu
nct
ion
16 Strata4 Strata1 Stratum
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Wire Demand
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04
Length in Gate Pitches
Per
cen
tag
e o
f C
um
ula
tive
Total InterconnectsTotal Length S=1Total Length S=4Total Length S=16
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Optimization
Ln-1
Interconnect Distribution
1,2 nnt
mnmw LLDN
ApAe
2
2int1.14
nt
m
n
or
c
LN
A
p
c
f
Area Required
Delay Equation
•Solve equations simultaneously.•pn is pitch required such that wire length Ln meets delay.•Ln is limited by the available area for a tier and the pitch.
Ln
Dn
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Optimization
2
4
6
8
10
12
14
16
0 0.5 1 1.5
Area (cm^2)
Nu
mb
er
of
Meta
l L
evel 1 Stratum
2 Strata
4 Strata
2
4
6
8
10
12
14
16
0 0.5 1 1.5
Area (cm^2)
Nu
mb
er o
f M
etal
Lev
el
1 Stratum
2 Strata
4 Strata
Metal Levels Wire-Limited Area
•50% reduction in metal levels•39% reduction in area
•92% reduction in area
950 MHz
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Optimization
6
7
8
9
10
11
12
13
14
15
16
0 0.5 1 1.5 2
Area (cm^2)
Nu
mb
er
of
Meta
l L
evels
1 Stratum - 325 MHz
2 Strata - 1.25 GHz
4 Strata - 4.75 GHz
•14x increase in clock frequency•63% reduction in area
Wire-Limited Clock Frequency
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Limitations
Pad - Stratum 1
Pad - Stratum 2
AlignmentTolerance
Cross-section
Vertical Wiring Density
• Vertical interconnect pitch must be greater than alignment tolerance.
• Demonstrated alignment tolerance : 3 microns.
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Limitations
•Restrictions placed by density of vertical interconnects may require increased area.
•For frequency optimization, required alignment tolerance is 0.34 microns.
•Via aspect ratio may also add limitations on vertical wiring density.
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Outline
• Motivation• 3D Architecture Concepts• Derivation of 3D Model• Results of Model• Optimization of Interconnects• Wiring Density Limitations• Conclusions
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Conclusions
• A new model has been derived for interconnect distributions in 2D and 3D architectures.
• 14x increase in wire-limited clock frequency,• 92% reduction in wire-limited area,• or 50 % reduction in metal levels for 3D system.• Restrictions on vertical interconnect density may
compromise the advantages of 3D architectures.