of International Computers Ltdo's 1906Acomputer ...Th'isarticle isbased on a lecture given by C. D....
Transcript of of International Computers Ltdo's 1906Acomputer ...Th'isarticle isbased on a lecture given by C. D....
Operating efficiency increases with the processingpower of a computer, and therefore there is acontinuous market demand for larger computers.Meeting this demand poses difficult design problemsfor the computer manufacturer which can be solvedmost efficiently by using automation techniques.In this article, the author describes the automatlon .techniques employed in the design and manufactureof International Computers Ltdo's 1906A computer.
Automation of the designand manufacture of a largedigital computerby C. D. MAR SH, M.A., C.Eng., F.I.E.E.
IT IS GENERALLY true that the greater theprocessing power of a computer, thegreater its efficiency in terms. of cost percomputation (assuming that the formidable problems of feeding a large computer with an adequate flow of work aresuccessfully dealt with).In addition, as- experience and con
fidence in computing have grown, there hasbeen an insistent demand for the solutionof single problems which, while being toolarge for computers currently in use,could not successfully be partitioned intoa number of smaller problems.
As a consequence, there has arisen acontinuous requirement from the marketfor central processors which are bothfast and large. The 1906A computerspecification was a response to such ademand.
The ICL 1906A specification posedsome particularly difficult design problems. In order to meet the fast instructionexecution times called for, it was necessary to develop, in collaboration with anAmerican semiconductor company, afamily of integrated logic circuits with atypical stage delay of 2ns, which was, initself, an important exercise in international technical collaboration.The complexity of the specification
involved the connecting together of"40000 of these fast logic gates by 250000connecting wires. Since the speed of propagation of electrical signals in an insulated wire is only about 1ft in 2ns, theintrinsic speed of the circuits can only beutilised if the average length of the connecting wires is kept to a few inches. Inspite of the fact that the central-processor
1 Cutawayviewof 1906Acomputer, showing the logic circuits housed in the swinging doorframesElectronics & Power October 1970
cabinet measures 6ft 4in high by 3ft 8inwide by 27in long and its 800 cableformscontain 11 miles of coaxial cabling and 17miles of 'twisted-pair' cabling, criticallengths of logic-interconnection wire havebeen kept down, on average, to a lengthof 3in (equivalent to a delay of only0·5ns).
Furthermore, in order to avoid losingtime in the interconnections because ofmultiple reflections travelling back andforth along the wires (,ringing'), all interconnections had to be made in the formof correctly terminated transmission linesof constant impedance. This requirementinvolved the development of a multilayer interconnection plane ('12-layerplatter'), combining stripline techniqueswith a density of interconnection nothitherto attempted anywhere in commercial equipment.The degree of precision and mass of
data required in the manufacture of thesemultilayer interconnection platters demanded, in turn, the use of automaticartwork generators, numerically controlled drilling machines and automatictesting machines. The input to all thesenumerically controlled machines takes theform of punched paper tape or magnetictape produced by the design-automationsystem.The problem of designing and building
these multilayer interconnection planeshas demanded a major effort, not only incomputer-aided design but also in processtechnology allied to precision engineering.The design-automation system has been
developed as a means of turning thedesigner's pencil sketches of the detailedlogic of a computer into complete manufacturing information and documentation.A suite of simulation programs called
SIMBOL is used first to check the consistency
Th'is article is based on a lecture given by C. D. Marsh,G. Haley and G. Adshead to the lEE at Savoy Placeon the 13th March 1970.
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of the basic overall system designand to allow it to be subdivided intosmaller units that can each be handled byseparate logic-design teams.
The design-automation suite of programs then operates at the detailed logiclevel, checking that the circuit-loadingrules have not been transgressed and thatthe logic chains are complete. The programs are used to work out the optimumphysical location ·for each logic elementon the interconnection platters, afterwhich the positions of the wiring runs aredeveloped. When this latter phase is complete, the manufacturing information canbe produced. This output takes the form ofpunched paper tapes to drive the artworkgenerator, the numerically controlleddrills and automatic tester, and the lineprinter output to provide documentationfor production, test and maintenanceusers.
The system keeps an accurate controlover the vast amount of data generated inthe course of the design process, and hasmany built-in checking procedures thatallow the computer to warn the designerof errors and omissions in his basic work.Once these errors have been corrected, thecomputer can manipulate the data todevelop the physical basis for the design ina rapid and error-free manner. This job is
. too time consuming and complex forhuman beings to carry out successfully onsuch it large scale as is required for thiscomputer.
Hardware systemFig. I shows the 1906A computer.
Three bays house the logic circuits in theswinging door frames, while the cabinetsat each end provide cooling and filtrationfor the closed-circuit air-conditioningsystem. The row of cabinets at the rearhouses the power-supply system. Thememory system, which is not shown,occupies a third cabinet.The integrated circuits used are a
special type of emitter-coupled logic(e.c.i.) on single silicon chips, with up to100 components (30 transistors, plusdiodes and resistors) per chip. The 2 x1·5in plug-in modules, of which there areseven basic types (Fig. 2), carry the integrated circuits together with the thick-filmmultiple-line-matching resistors. Certainnonstandard functions, e.g, for voltagelevel conversion at interfaces, are made byhybrid techniques using a multiple-transistor fiatpack and thick-film resistors(shown unencapsulated in Fig. 2).20000 of these circuit mod Illes are
conceptually plugged into a continuousmultilayer interconnection plane 140ft2•in area. In practice, the largest plane whichcan conveniently be made is 13 x l6inlarge enough to carry 200 circuit modules,of which 94 (Fig. 3) are used in the computer. These planes are called 'platters'and are connected together (six or nine ata time) along their peripheries to form alarger plane by bridging connectorsclamped on to the gold-plated pad areas.Signals between door planes an! carriedby cableforms of coaxial cable or twistedpairs. The complete machine uses over800 cableforms, nearly half of which areused for engineer's monitoring purposes.
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2 Unencapsulated·integrated-circuit modules using special Motorola e.c.1.on singlesilicon chips
3 12-layer platter loaded with circuitmodules
Inside the platters, the signals arecarried between modules by the printedwiring on the two pairs of logic planes(Fig. 4). These planes are buried withinthe platter, accurately spaced from anearth plane to give a 75Q-impedancetransmission-line characteristic. Anorthogonal system is used. X and Ytracks are connected by 0·013in-diameterholes drilled in 0·030 in-diameter pads andthrough-hole copper plated. Theseconnections are called 'via' holes. Theplane carries about 1000 connections affdrequires 6500 accurately drilled holes.The X wires are 0·007 in wide and the Ywires are O'OlOin wide. (Spacing from theearth plane is 0·012in for the X wires and0·021 for the Y wires.)
Fig. 5 shows a cross-section of a bonded12-layer board showing the via holes.On the left is a module pinhole goingright through the board. The two outerlayers merely contain pads for solderingthe module connectors. The centre fourlayers carry various power supplies,
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which are isolated from the module exceptwhen it is desired to make a connectionto a power rail. On either side of the powerlayers are two groups of signal planes.Each group contains an earth plane forimpedance matching and an XY pair tocarry the logic signals. Some X and Ytracks are shown together with someinternal via holes.
Artwork]t will now be useful to present a broad
picture of the production processes involved in making the multilayer interconnection platters.The patterns to be etched on the various
copper layers of the platters must betransferred from photographic' negatives,known as 'artwork'.
High-accuracy artwork is produced bya precision XY plotter. This XY plotterhas a moving light source, controllednominally to within ±O'OOIin overthe bed from a magnetic or punchedtape. The light beam, controllable in widthand intensity by program, plots the artwork at full scale. In practice, mostartwork consists "Of a standard patternplus a variable part. To save plotting time(and expense !), the film is pre-exposedwith the standard pattern and only thevariable additions are plotted. Thevariable parts of each platter design need0·25million characters of paper-tapeinput to the plotter.All process stages involving the genera
tion or use of artwork must be carried outin a dust-free environment controlled towithin 50 ± 5% relative humidity and70 ± 2°C temperature.Before applying the artwork to the
copperclad laminates, the latter have tobe coated with a light-sensitive coatingknown as photoresist. Most printedcircuit production units use the wetapplication process, but, for the finesttolerance work on the logic layers, a dryfilm method has proved to be essentialto eliminate pinholes and blemishes.
Layup of platterAlthough there are 12 etched copper
layers in the platter (Fig. 6), they areassembled from seven laminates (fivedouble-sided and two single-sided). Thelaminates are separated by spacers impregnated with half-cured epoxy resinduring assembly in the accurately tooledlaminating jig. The assembled layers are :heated to 165°C under a pressure of3001bf/in2 in a steam-heated bondingpress to cure the epoxy resin and bondthe laminates (Fig. 6).The 5000 major via holes linking the
layers together are drilled (after bonding)on a 16-spindle numerically controlleddrill, which has a nominal accuracywithin ±0·002in.
In total, for each platter, 18000 holesmust be drilled in glass-fibre laminate toan accuracy of within 0·002-0·003 in. The6500 via holes in each logic layer have tobe drilled before bonding. Drill wear is amajor problem and drill consumption is650 per week.
At various stages during manufacture,it is necessary to test the layers, and amachine has been specially developed todo this automatically. Controlled by
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punched paper tape, this machine checksfor open- .and short-circuit conditionsbetween all possible pairs of points, andprints out the location of any errors found.The printed-error slip is attached to anyfaulty work and sent to the rectificationsection.During the development of the fore
going production techniques, many difficult technical problems have had to beovercome. In particular, one can note thealmost incompatible nature of many ofthe processes, as the two followingexamples show: artwork generation andhandling demand a closely controlleddust-free environment, while the associated stages of drilling and sanding generatea great deal of dust, swarf and fibres;accurate registration of the layers demands physical stability of the basiclaminates, but these are subject to asuccession of wet and dry chemical processes, culminating in an extremely brutalbonding process. The investment in plantand equipment to carry out these taskshas totalled £0·75million over three years.
Computer·aided·design process'The first main process of design in
volves breaking down the planning·specification into a system structure(Fig. 7). This means defining a set ofblocks of manageable proportions (such'as a floating-point-unit, store contro!),each block being made the responsibilityof a group of logic designers, who go onto construct the inner details of the logicconnections.The computer-aided design falls into
two broad categories. First, the simulationlanguage SIMBOL is used to specify. thesystem structure and order code and tosimulate real programs. This operationis to prove that the system structure isviable and that the detailed logic of eachblock agrees with its system specification.Secondly, the other group of programs
forms a design-automation suite knownas SYSTEM.67. This suite is concerned withthe problem of converting detailed logicinto a physical form, deriving the interconnection patterns and generating allthe . relevant production-informationdocumentation. An 'information expansion' is associated with the process. Inthis case, a product specification of10000 characters of information is expanded into 200million characters ofproduction information.Once the logic engineer has completed
his system-design studies with the aid ofthe simulation program, he is left with aspecification of a group of logic. Thislogic group could be, for example, afloating-point unit occupying nine platters. Ultimately, this group will be definedin detail on 80 sheets of logic drawings.The logic designer roughly sketches out
the basic logic. This sketch is then passedto a technical clerk who codes the logicalinformation into the computer inputlanguage. This information is thenpunched on paper tape and fed intothe computer. Alternatively, the logicdesignermay describe his logic in the formof Boolean equations without drawing alogic sketch. Where there are repeatedslices of logic, various MACRO facilitiesElectronics & Power October 1970
4 Pair of logic layers for carrying signals betweenmodules inside the platter
outer module pad
monitor or power logic layer
5 Cross-section of a bonded12-layerboard showing the 'via' holes
6 Lay-up of a platter377
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may be stored in the computer and calledup as requested to minimise the datainput.The main elements of the system are
represented in Fig. 8. All information isinput to the logic files in the form ofmodifications. Even brand-new drawingsare considered as a modification to anempty file. This is a very fundamentalpoint; it ensures that all possible ramifications of any change are considered.Documentation is always kept in step,and any errors are indicated at the timeof the modification. .The engineer can ask for about 40
different types of information printoutfrom the files. Perhaps the most usefulprintout is the error listing, which listserrors or inconsistencies in the design discovered by the computer's checkingroutines. If the designer has broken therules, he soon knows about it! Thesecomputer programs can detect over 30different classes of logic error that mayexist on the file.One of the major design processes is
'placement', or the problem of decidingthe location of the logicelements throughout the computer. Each logic elementmust be associated with a particular circuit on a particular plug-in module on aparticular platter.
Basic choiceThe basic partitioning choice of which
groups of elements are to go on whichplatter is made by the logic designer;thereafter the computer takes over. Thecomputer program then considers 500-~OO elements at a time, and collectstogether groups of similar elements thatcan form one plug-in module. Thisgrouping is achieved by scanning roundthe logic diagrams for similar elementsthat have been drawn close together andfinding the most interconnected clusters.An interconnection matrix is then set
up, storing the links between the modulesthat are candidates for the 200 modulepositions. Several cycles of various algorithms involving such manipulativetechniques as 'elastic contraction' and'pair swopping' are used, and eventuallya fairly good layout of modules isachieved.Once the physical placement is com
plete, the interconnection paths can bedeveloped; this is called 'tracking'. Thetracking operation is the job of fitting upto 2000 wires into the two logic layers ofthe multilayer board. An exhaustive'maze-running' technique is employed(based on Lee's algorithm), which willonly reject a wire if neither plane canpossibly accommodate it. In most cases,only a few wires cannot be accommodated, and these are added as hand wiresin the final production stages.From the production file, a large quan
tity of numerical-control tape is generatedto drive the X Yplotters, drillingmachinesand platter tester, and also to generateassembly- and production-control docu-mentation is printed. 'Throughout, ,all the files store informa
tion in a form which preserves previoushistory. Consequently, any drawing ordocument may be reproduced as it378
productspecification10k characters
/ \system structure-- / \detailed logic
/ \interconnections design/ I "<, automation
manufacture test documentati~n I(200 millioncharacters)
standarddata I
sirnufction
=htechnology
production
documentation
7 Design process
8 Design-automationsystem
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9 Calcompplotter drawinga logic diagramonline from a computer
existed in the past, and, more importantly,the changes to any document betweenany two dates in the past may be deducedand printed out when required.A graph plotter attached to the com
puter draws the finalised logic diagramsdirectly from the computer files (Fig. 9).The drawing produced is used by thedesigner as a record of his work, and alsoby the systems test and maintenanceengineers. The diagrams give an accuratepicture of the version of the computerthat is actually being built. Each weekabout 200 high-grade master drawingsand 300 design copies are produced.
During the course of various operations, the programs need to refer to hardware constants such as dimensions, pinnumbers of modules etc. All these data,which are fixed for a particular project,are kept on sets of tables.' Each file has ahardware code definition which allowsthe programs to refer to the relevanttables. To date, over ten types of hardware models using completely differenttechnologies have been constructed usingthe same set of programs. These programstotal nearly 0·5 million instructions whichare held, togetherwith the tables, in an overlay structure on disc or drum memories.
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10 Computer operations room
About half this total of instructions(200000)was needed for the design of theparticular machine under discussion. Therunning of these programs is controlledby a special operating system allowingmixed__batch_processing and__onlineoperation.
Design operations roomThe design of each platter, together
with the issue of all production information, takes about 20h of computer time.In addition, there is the simulation load,other projects and program developmentto consider; a complex of three large compatible processors with suitable peripherals is dedicated to c.a.d. problems,and 4000reels of tape are in use. The totalcapital investment in design automationat this location is about £i million.These machines are run 24h a day on a
3-shift basis. Great emphasis is placed onreducing turn-round time, and very fewjobs take longer than 24h. Any designengineer handing in a new logic sketch at,say, 4 p.m. would expect full feedbackfirst thing next morning. Some of thecoding and data-preparation operationsare performed on the evening shift, andthe jobs are run on the night shifts. Atpresent, an online job-control system isused to keep track of over 1000 jobsa week. In this context, a 'job' consumes between 3min and 2h of computertime.The design-automation department has
a staff of about 50, and half of these areinvolved in the operating, data-control,data-preparation and coding areas. Theremainder are engineer/programmers involved in generating new programs andimproving the current ones.It is difficult to define the programming
development effort because there is aworld of difference between producingElectronics & Power October 1970
the first programs capable of designing aplatter and producing a working program suite consuming hundreds of hoursa week of computer time. In many problem areas, it is difficult to say where the.engineering leaves off. and the programming starts. The current library ofprograms of 0·5million instructionsrepresents the writing of about 40-50instructions per man per day over the lastfour years; but the general developmentgoes back over seven years or more.One aspect of the system described can
be called its 'amplification ratio'. For mostareas of the machine, about 200charactersof output are generated for each designcharacter input by the design engineer.Where there were large repeated slices oflogic, this ratio has reached as high as7000: 1.
Benefits from automationAccuracy of design information is of
particular importance in a digital computer. The logic paths are so complex thata large computer never operates twiceunder exactly the same conditions. In thepast, minor errors in wiring in even asmall computer have not shown up duringmonths of rigorous testing, but havecome to light after a year or more ofoperation at a customer's Site, when aparticular combination of input data andprogram steps has occurred.Consequently, it is of fundamental
importance to check the logic designthoroughly. When one bears in mind thatthe design information of the 1906Aamounts to 200 million characters, it willbe realised that manual methods ofchecking and data transcription couldnot be contemplated.The use of a computer simulation
technique, followed by a computer checkout of the detailed logic design, reduces
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the possibility of an undetected designerror to a negligible value.Owing to the complexities of a com
puter, changes in the logic design areinevitable as development proceeds. It isimp-ortant to be able to process designchanges quickly and generate new manufacturing information and its attendantdocumentation simultaneously; and thishas been one of the prime aims in thedevelopment.
Manufacturing-technique accuracyThe importance of generating and
maintaining error-free design informationhas been stressed earlier. It is equallyimportant to ensure that the computeris built exactly to the design information.Wrongly placed wires have been a costlyhazard in computer manufacture formany years, but, with the high frequenciesinvolved in nanosecond pulses, the length,positioning and screening of the wiresare equally important.An automated method of manufacture
ensures that each computer built is notonly interconnected correctly, but that itis exactly identical to the prototype in theimportant minor details of wire lengthand positioning. This fact, when coupledwith the rigorous pretesting of the plugin circuit modules, leads to a short andpredictable system commissioning cycle.The benefits of this time reduction, interms of predictable delivery dates andminimal work in progress, are obvious.But the savings accruing from a 'get it
right first time' approach cannot easilybe measured in financial terms. The gainin electronics reliability, and generalincrease in confidence in the quality of thedesign and manufacture, are powerfulfactors in gaining the rapid market acceptance that is so important in selling largecomputer systems in the world market.
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