Multichannel readout system of inner tracker for NICA-MPD Rogov Victor AFI, JINR, Dubna Afi.jinr.ru.
O Inner Tracker UpgradeG. Darbo – INFN / Genova Milano, 10 February 2015 Inner Tracker Upgrade X...
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oInner Tracker UpgradeG. Darbo – INFN / Genova Milano, 10 February 2015
Inner Tracker Upgrade
X Workshop ATLAS Italia10 – 12 February 2015
G. Darbo – INFN / Genova
Indico: https://agenda.infn.it/conferenceDisplay.py?confId=8955
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20152
Inner Tracker Project
ATLAS ITk project taking off:• Project kick-off meeting (4 Nov ‘14) chaired by Leo;• 93 Institutes and 21 countries joined ITk;• 6 Italian Institutes already in ATLAS (BO, CS,GE, LE,
MI, UD) – Trento asked to join ATLAS and then ITk.
ITk Institute Board (IB)• Under Leo, the search committee to find the first
chair of the ITk-IB has been formed: C Buttar, Marina Cobal, Abe Seiden (chair), Nobu Unno, Norbert Wermes and Dave Charlton hope new chair for first IB meeting.
• First ITk-IB meeting (26th Feb) in ITk-week, where we will discuss various items including the effort tables collated by Leo and a discussion of the critical gaps in coverage for certain areas.
Country Number of institutions
Australia 3
Canada 7
CERN 1
China 1 (cluster)
Czech Republic 3
Denmark 1
France 6
Germany 10
Italy 6: BO, CS, GE, LE, MI, UD
Japan 7
Netherland 1
Norway 2
Poland 2
Russia 1
Switzerland 2
Spain 2
Slovenia 1
Sweden 2
South Africa 1 (cluster)
Taiwan 1
United Kingdom 12
United States 21
Total 93
Trento raised formal request to join ATLAS
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20153
ITk Descoping Scenario
• LHCC request a cost document for ATLAS Phase II with possible de-scoping – document ready for discussion on 15th Sep, draft to LHCC for June.
• ATLAS mandate a subgroup of the USC to study 3 scenarios: 275, 235 and 200 MCHF (old CHF rate!).
• For ITk too short time to focus on “preferred” layout (many under study see Layout TF).• Concentrate on LoI layout + extension at h = 4• For ITk should be considered as pure exercise: not what we are going to build,
but how performance goes with de-scoping• Effort must be coherent with CMS
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20154
ITk “275” layout
• LoI + VF extension to h = 4• Not clear if we can simulate rings in
time (presumably not…)• Should be possible to move to 25x100
pixel size (occupancy/rates)
CostStrips 95.7 MPixel 24.8 MCommon 11.0 MVF extension 12.0 MSavings (wrt LoI) -8.7 M–––––––––––––––––––––––––Total 134.8 M
Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20155
ITk “235” layout
WRT “275”:• VF extension only to h=3.2• Strip “stub” layer removed
Cost“275” 134.8 MVF to h=3.2 -6.0 MStub -2.0 M–––––––––––––––––––––––––Total 126.8 M
Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20156
ITk “200” layout
WRT “275”:• VF extension only to h=3.2• 1 strip barrel and 1 disk set removed• 2 strip barrel single layer (not stereo)
Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015
Cost“275” 134.8 MVF to h = 3.2 -6.0 M1 barrel+1disk -24.0 M2 barrel layers -7.0 M–––––––––––––––––––––––––Total 97.8 M
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20157
Layout TF Work Model
ITk Layout tasks force
• New Task Force (Claudia e Andy chairs), with mandate to define the ITk layout go down in options, by end 2015.
• Need help for simulation (interesting task for young people too).
To study: Local supports for layers 3-4
(inclined planes, like “alpine” less silicon and material)
Look at extra pixel layer(s) with cheaper technologies to replace strips.
Realistic simulation of services and routings.
R/O sizing based on detector characteristics.
Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20158
SLIM – Stiff Longeron for ITk Staves
IP Barrel Cells Tilted Cells
Connecting Structure
5th pixel layer inside the PST – HV-CMOS “optimized” – 2.5 m long at layer 5.
one slim stave is equivalent to two adjacent conventional staves
Ref.: S. Michal, ITk Pixel Design Group, 29/01/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 20159
SLIM – Material BudgetLower surface and consequently lower cost
22 % less for a 1.5 m stave at layer 5 39 % less for a 2.5 m stave at layer 5
Note: only structural cells studied
Ref.: S. Michal, ITk Pixel Design Group, 29/01/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201510
RD_FASE2Tracker R&D in CSN1
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201511
3D Sensors with FBK: TN + FBK
IBL like 3D sensor on 6” – FBK and Trento• 1st 3D test batch on 6” wafers finished, all wafers tested. • Test structures show good breakdown behaviour. • Defect rate higher than IBL (DRIE process, partially understood),
no totally good FE-I4! • One wafer will be bump-bonded at IZM/Selex with special
bump-mask: leave unconnected pixel column with low VBD
• Planning irradiation & test-beam with FE-I4/PSI46dig
ATLAS FE-I4 (13x) CMS Single chip (24x)(1E, 2E, 3E, 4E)
CMS Quads (6x)(2E, 3E)
MEDIPIX2 (4x)
NA62 test chip (20x)
275
µm
Partially etched junction columns
Column (10÷13 µm) partially filled with doped poly-silicon
Passing-through ohmic columns
250µ
m
Good IV Pixel columns:BB to FE-I4 pixel
Bad IV Pixel columns: disconnect from Pixel inputs
One FE-I4 tile: IV for 80 cols of 336 pixels
Ref.: G. Giacomini – R&D Phase II Italia
Proc
ess
x-se
ction
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201512
3D / Active Edge – RD_FASE2New generation of 3D sensors• Single-sided process on SiSi
DWB and SOI substrates – Substrates from IceMOS;
• 100÷130 µm thick active layer;• Technology suitable for new
RD53 Pixel chips (small 50x50 or 25x100 µm2 pixels) and low threshold (~1000 e-) operation;
• Design for 2x1016 neq/cm2;• Strategy: 3 technical batches
funded by CSN1 (ATLAS/CMS) + [1 batch of Active edge planar sensors]
Batch 1 – mechanical test• DRIE test of 100 ÷ 150 µm
narrow (5 µm) columns;• Test filling with poly.
P- Epi layer / P- High Ω•cm wafer
P++ Low Ω•cm wafer
-Vb
Charge Amp.Bump-bond
metal
Thin-down
Single side 3D process
p++ col
n++ col
SOI –
SiS
i DW
B
158
um
5.6 um
3.8 um
Ref.: M. Boscardin and S. Ronchin, FBK
100÷130µmOpt.: 200 nm oxide (SOI)
DRIE for ohmic columns
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201513
3D / Active Edge – RD_FASE2Batch 2 – substrates test
• p-type SiSi DWB wafers from IceMOS • 100 ÷ 130 µm high-R active sensor thickness • p-spray & p-stop isolation • Started in Sept. 2014, completed in Nov. 2014 • Good electrical characteristics – from CV
measurements depletion is in accordance with nominal thickness of active (device) substrate.
Module assembly:• 5 wafers will be processed by IZM:
Substrate thinning Metallisation with mask of back BCB processing for HV isolation
• 1 wafer bump-bonded by Selex
Table: good tiles per wafers:• ATLAS (1) – Current limit 0.2 µA, VBD ≥ 100V• CMS (2) – Current limit 50 nA, VBD ≥ 100V
CMSATLAS
wafer # material thickness p-spray ATLAS (1)
CMS (2)
30 Si-Si 100 2.00E+12 9 / 10 20 / 30
33 Si-Si 100 2.00E+12 8 / 10 17 / 30
49 Si-Si 100 2.00E+12 8 / 10 20 / 30
63 Si-Si 130 2.50E+12 7 / 10 25 / 30
69 Si-Si 130 2.50E+12 10 / 10 26 / 30
74 Si-Si 130 2.00E+12 8 / 10 19 / 30
75 Si-Si 130 2.00E+12 7 / 10 14 / 30
80 Si-Si 130 1.50E+12 10 / 10 26 / 30
81 Si-Si 130 1.50E+12 8 / 10 26 / 30
1 FZ 275 2.00E+12
FE-I4
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201514
3D / Active Edge – RD_FASE2Batch 3 – 3D with new substrates• Test small pixels cells with FE-I4 – tricky layout
mixing small pixels and grounded/larger pixels (see example)
• Wafer layout and cell simulation in advanced stage – parameters extracted from batch 1 and 2 will be used for the new design
• About 2 month delay accumulated since start of the project: some concern with the DRIE machine at FBK (14 weeks asked for repair) – becoming difficult to have process finished before summer.
• Substrates• IceMOS SiSi substrates (baseline option):
already in house• Shinetsu epitaxial substrates: given-up (not
fulfilling specifications)• SOI substrates: we are going to order some
wafers (could be used given delay of DRIE).
2x50 + 2x450 4x50 + grid
50 µ
m45
0 µm
45
0 µm
450 fF
450 fF
50 fF
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201515
Thinking Towards ITk ModulesAssume ITk layer 1 & 2 with 3D• Need 3000 RD53 chips/single tile sensors to cover the ~1 m2 area.• Considering 25 tiles/wafer (6”), 50 % yield in sensors and 50 % in good tiles to
used modules: 600 wafers are needed• FBK + CNM (maybe SINTEF) are in the business – pre-production + production
from 2018 to 2021.• Requested exercise: evaluate feasibility and cost!
Considerations on bump-bonding• Complete qualification at Selex with 6” sensor wafers, FE-I4 like modules;• Discuss with Selex plans for R&D and involvement in ITk production:
R&D/Upgrade needs at Selex: qualify process for 120k bumps/chip, upgrade to 12” wafers (RD53 wafers).
Consider 8.2 m2 of hybrid pixels is Selex interested in part of it? • Direct playing with FBK and Selex make easier optimization of BB for 3D sensor
and “sell” the full package to the collaboration.
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201516
Steering R/O R&D ActivitiesTable-top ROD/BOC version (BO)• Use expertise on IBL ROD, no VME needs• Full SW/FW compatibility with PIT cards• Half ROD, up to 16 FE• Funded by CSN1
Possible activities on read-out• Expand existing FE-I4 R/O systems to
HV/HR-CMOS (see bottom fig.)• Common HW/FW/SW interface definition • Integrate mini-DCS in the read-out• GBT concentrator
FE
Generic R/O systemUSBPix
RCEROD/BOCPCIExpress
FPGALV
CTRLTX
RXMod TX/RX
Ref.: P. Morettini – R&D Phase II Italia – 23/1/2015
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201517
Evaporative CO2 cooling Milano
2014 Activities• Completed design of TRACI v.3
100 W transportable CO2 recirculating system Collaboration: CERN, NIKHEF, MILANO, SHEFFIELD,
OXFORD, LIVERPOOL Test on M PUMPS, Corbola (RO)
• Purchased all components: Being part of collaboration allows purchase sharing In Milano co-funded by LHCb and Dotazioni
2015 Plans• Assemble and Commissioning TRACI• Needed for LHCb and for ATLAS
• Finite Element Analysis of stave designs based onmini-piping – well known expertise of the MI group from IBL Ti pipe, 2 mm𝜙
• Test of prototypes with TRACI Need to build a setup based on TRACI,
similar to what done for IBL
17
TRACI
Thermal simulation (IBL)
Test setup (IBL)
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201518
RD_FASE2 – “Richieste 2015”
Legend:
ATLAS Common ATLAS / CMS
Attività Descrizione BO CS GE MI TN UD
3D
6" Wafer procurement (SOI, wafer bonding, epi) - - - - 10.0 -
PicoScope 6407 Digitizer with 1.5 GHz probes and accessories. - - - - 8.5 -
BB
6" dummy wafers - test deposition on 6" and high-density bumps (150 k-bumps/chip) - - - 20.0 - -
BB for 3D sensor test - - 24.0 - - -
MODUpgarde R/O Systems - 2.0 2.0 2.0 - 2.0
Module assembly and irradiation, RD on flex - - 10.0 - - -
MM-R/O Multi module R/O 15.0 - - - - -
CO2/µCH Develop µ-channel cooling - - - 10.0 - -
Total requested by ATLAS 15.0 2.0 36.0 32.0 18.5 2.0
105.5
Trento:• Request of 4 k€ of Travel Money
for test-beam participation and support.
Aggiornare con
assegnazioni
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201519
HVR_CCPDActivities on HV/HR-CMOS in CSN5 – BO, GE, MI
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201520
HVR_CCPD: The project
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201521
STM Chip
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201522
Hybridization
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201523
AIDA-2020 : Funded !AIDA-2020 Funded !• AIDA-2020 has been officially selected by the
EC with a funding of 10 M€.
The project has a ranking of 14.5/15 with• 5/5 excellence• 5/5 impact• 4.5 implementation
The grant agreement procedure is quite fast
Groups in ATLAS who havebeen funded:• Genova• Milano• Trento
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201524
Conclusions
ITk project moving ahead:• Kick-off meeting, Institute Board, …• De-scoping scenarios under study• Layout TF
RD_FASE2 • Activities on sensors/modules progressing… constructive activity with CMS
HVR_CCPD• Test chip submitted with STM• Hybridization work progressing, few devices assembled at Genova tested in TB
AIDA2020• Project approved, new resources and R&D framework for HL-LHC developments
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201525
SPARE SLIDES
Inner Tracker UpgradeG.Darbo – INFN / Genova Milano, 10 February 201526
Activities in ITkITk management looking at interest of Countries in ITk R&D’s
Table from discussion with Paolo. Comments?
For discussion