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NXP Semiconductors Secure Connections for a Smarter World

Plot workgroup meeting

June 26, 2014

NXP Semiconductors

The electronics industry is being driven by four mega trends that are helping shape our society:

Energy Efficiency, Connected Devices, Security and Health. Connecting to these trends and enabling

Secure Connections for a Smarter World, NXP Semiconductors (NASDAQ: NXPI) creates solutions for

the Connected Car, Cyber Security, Portable & Wearable and the Internet of Things.

Through our innovations, customers across a wide variety of industries – including automotive, security,

connected devices, lighting, industrial and infrastructure – are able to differentiate their products

through features, cost of ownership and/or time-to-market. With operations in more than 25 countries,

NXP posted revenue of $4.82 billion in 2013. Additional information can be found on www.nxp.com

Secure Connections for a Smarter World

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Connected Car Cyber Security Portable & Wearable Internet of Things

Strong innovation track record Our innovations are used in a wide range of applications (1/2)

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Automotive Identification Consumer Computing

In-vehicle networking

Car access & immobilizers

Car entertainment

Solid State Lighting

Telematics

Speed & Angular Sensors

Secure identity

Secure transactions

Tagging & authentication

TV

Satellite, Cable, Terrestrial

and IP set-top boxes

Satellite outdoor units

Tablet PCs

Note-/Netbooks

Desktops

Power supplies

Monitors and peripherals

Strong innovation track record Our innovations are used in a wide range of applications (2/2)

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Wireless infra Lighting Industrial Mobile

Wireless base stations

Point-to-point

CATV infrastructure

Broadcasting

Lighting drivers

(CFL, LED)

Lighting networks

Backlighting

Smart grid

White goods

Home / building

automation

Power supplies

Mobile devices

Portable power supplies

Personal health

Chargers

NXP Quality Lab Infrastructure lab locations

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Hong Kong/Guandong

Caen

Hamburg

RQC Nijmegen

Gratkorn

Cabuyao

RQC Kaohsiung

Seremban

RQC Bangkok

NXP Development Location

NXP Manufacturing Location

Manchester

Tokyo

Labs provide Quality Services to NXP Businesses & Operations

Higher level competences & capabilities are available in the Regional Quality Centers.

Singapore

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Manager RQC Leon Sintnicolaas

Capacity Management Ton Pörteners

Project Management Ronald Schravendeel

Q&R Development, Capex Nebojsa Jankovic

Reliability Competence Rene Rongen

RQC Bangkok

Keith Sarault

RQC Nijmegen

Peter Vullings

RQC Kaohsiung

Sharon Chen

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Manager RQC Nijmegen Peter Vullings

Secretary Support Ingrid Haefkens

F&A Linda Lengowski

HR Stijn Bonnes

Quality Systems Leon Winters

REL A&I

Group leader Jan Wijers

PMA CPA & SPA

Group leader Leon van Nimwegen

REL PSI / ESD

Group leader Ronald Minkhorst

PMA PME

Group leader Peter Vullings

Failure Analysis

FA A&M

Group leader Bas Bongers

FA TSG

Group leader Marcel vd Straaten

FA S&C

Group leader Johan Knol

Process & Material Analysis Reliability

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RQC Four Pillars

Failure Analysis

Process- and Material Analysis

Reliability

Problem Solving and Problem Prevention

EFA – Electrical Failure Analysis Techniques Fault localization using tester and various analysis techniques

EFA Techniques: – Electrical testing

– Electron-Beam testing (E-beam)

– Photo-emission Microscopy (PEM)

– Optical Beam Induced Resistance Change (OBIRCH)

– Time Resolved photon Emission (TRE)

– Resistive Interconnect Localization (RIL)

– Soft Defect Localization (SDL)

– Laser Assisted Device Alteration (LADA)

– Magnetic Current Imaging

– Charge Contrast in FIB/SEM

– Liquid Crystal diagnostics

– Microprobing

– Nano-probing in SEM/FIB chamber

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RQC Nijmegen Failure Analysis and Silicon Debug Analysis of design and manufacturing problems. Options for design modification.

Hamamatsu Phemos-1000 PEM

Semicaps SOM-3000 RIL / SDL / LADA

Agilent 93000 Electrical tester

TRE - Emiscope

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PFA - Physical Failure Analysis Techniques Physical FA-techniques

– Dual-beam Focused-Ion-Beam(FIB) for x-section and

circuit modification

– Parallel Electron Energy Loss Spectroscopy (PEELS)

– Hi-resolution Scanning Electron Microscopy (SEM)

– Hi-resolution Transmission Electron Microscopy (TEM)

– Scanning/Energy Filtering TEM (S/EF-TEM)

– Energy Dispersive X-Ray spectroscopy (EDX)

– Scanning Acoustical Microscopy (SCAT)

– (Confocal) optical microscopy

– Hi-resolution 3D X-Ray

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RQC Nijmegen Failure Analysis and Silicon Debug Analysis of design and manufacturing problems. Options for design modification.

FEI Vectra Vision &

FIB200/800/835 FIB

for x-sections and

front & backside

circuit modification

Hamamatsu C9107

Backside Polishing

Tecnai F-30 TEM

NSC PS103S

Chemical Decap

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Applications Device substrate characterization and crystal defect analysis

Composition analysis of devices, chemicals and materials

Contamination analysis; surfaces, chemicals, materials

Chemical and Physical Analysis Techniques – SEM/EDX, TEM/EDX, AFM and FTIR; composition of devices/solids

– XTT/XRT, SIRD, µPCD and preferential etch for substrate

characterization and analysis of crystal defects

– ICP-OES, GFAAS , (VPD)-ICP-MS and ToF-SIMS for analysis of

metallic (trace) contamination in solids and liquids

– IC for analysis of anionic contamination in solids and liquids

– GC-MS, HPLC, FTIR, TOC and ToF-SIMS for characterization of

organics and analysis of organic contamination

– Auger spectroscopy

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RQC Nijmegen Process- and Materials Analysis Chemical- and Physical Analysis capabilties and competences for fast root

cause analysis and prevention of quality problems.

IonTOF ToF-SIMS

HP - HPLC

VPD - ICPMS

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Reliability test Equipment:

– Operation open air

– Operation chamber

– Humidity biased (THB/HAST)

– Humidity unbiased (Precon/UHAST)

– Thermo mechanical (TMCL)

– Mechanical testing (Drop/Vibr,)

– Thermal test (LTSL/HTSL)

– Electrical robustness test (AMR/ESD)

– Analyses (SCAT)

RQC - Reliability

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