NXF 808 34 - BIELEC · J-STD 004B Surface Insulation Resistance test showing no conductive anodic...

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NXF-808-34 No Clean, VOC Free Soldering Flux Benefits J-STD 004B Flux type ORL0 Powerful wetting on all board finishes Water-based, non-flammable Exceptional cleanliness Wide process window Sustained activity for dual wave Superior hole fill No solder balling Rosin / resin free, non-tacky Description Nexus NXF-808 Soldering Flux is a water-based, VOC free spray flux formulated for lead free wave and selected soldering operations. NXF-808 provides excellent, defect free soldering of even the most difficult to solder components and board finishes, including OSP, ENIG, Ag, Sn and HASL. NXF-808 leaves the absolute minimal of non-greasy post soldering residue. Tested to Industry standards including J-STD 004B, Nexus residues can be considered safe to remain on an assembly when no-clean technology is appropriate to the assembly end-use. All NEXUS VOC Free fluxes offer the user to dramatically reduce wave soldering VOC emissions, whilst improving cleanliness and soldering performance against traditional alcohol –based no clean fluxes. Flux Packaging NXF-808-34 125 mL, 0.5 Litre, 1 Litre, 5 Litre, 10 Litre and 25 Litre containers Availability Warton Metals manufacture all Soldering Fluxes in the UK. Custom fluxes, packaging and modifications are available on request. Standard product list

Transcript of NXF 808 34 - BIELEC · J-STD 004B Surface Insulation Resistance test showing no conductive anodic...

Page 1: NXF 808 34 - BIELEC · J-STD 004B Surface Insulation Resistance test showing no conductive anodic filament (CAF) migration or dendritic growth after 168 hours at 40°C 90% relative

NXF-808-34 No Clean, VOC Free Soldering Flux

Benefits

J-STD 004B Flux type ORL0

Powerful wetting on all board finishes

Water-based, non-flammable

Exceptional cleanliness

Wide process window

Sustained activity for dual wave

Superior hole fill

No solder balling

Rosin / resin free, non-tacky

Description

Nexus NXF-808 Soldering Flux is a water-based, VOC free spray flux formulated for lead free wave and selected

soldering operations. NXF-808 provides excellent, defect free soldering of even the most difficult to solder components

and board finishes, including OSP, ENIG, Ag, Sn and HASL. NXF-808 leaves the absolute minimal of non-greasy post

soldering residue. Tested to Industry standards including J-STD 004B, Nexus residues can be considered safe to

remain on an assembly when no-clean technology is appropriate to the assembly end-use. All NEXUS VOC Free fluxes

offer the user to dramatically reduce wave soldering VOC emissions, whilst improving cleanliness and soldering

performance against traditional alcohol –based no clean fluxes.

Flux Packaging

NXF-808-34 125 mL, 0.5 Litre, 1 Litre, 5 Litre, 10 Litre and 25 Litre containers

Availability

Warton Metals manufacture all Soldering Fluxes in the UK. Custom fluxes, packaging and modifications are

available on request.

Standard product list

Page 2: NXF 808 34 - BIELEC · J-STD 004B Surface Insulation Resistance test showing no conductive anodic filament (CAF) migration or dendritic growth after 168 hours at 40°C 90% relative

Application

NEXUS NXF-808-34 can be applied by spray, wave or brush, for optimum results ultrasonic spray methods should be

used. A post preheat flux loading of 70-200 µg / cm2 has been shown to give good soldering performance, for single

wave operations, levels towards the lower end of the scale should be applied. Topside board temperatures can range

from 100ºC-135ºC depending on assemblies thermal requirement. The preheat temperature should be adjusted to

ensure complete water removal before contact with the solder wave, an experienced operator can often hear when

insufficient water is removed or if the preheat is set too high. Conveyor speeds between 1-1.5 m min-1, contact time with

the solder wave between 3 and 5 seconds, with a height between 1/2 and 2/3 of the board thickness are typically used.

The solder pot temperature can range between 255-270°C dependant on thermal demand and solder alloy choice.

NXF-808 gives excellent soldering results with all lead free alloys including SAC 405, 305, 0307 and Warton High Purity

SC100e - a cobalt doped, low cost SAC alternative which results in bright, shiny and strong solder fillets.

Cleaning

NEXUS NXF-808-34 is designed for no clean applications, however, post soldering flux residue can be removed if

necessary by using hot water followed with a deionised water rinse or Warton Metals ‘Surf Clean Saponifier Cleaning

Solution’ for efficient neutralisation of any acidic residue and removal of any additional handling contamination.

Selective soldering operation using NXF-808-34 Typical preheat profile for NXF-808 with a

peak temperature between 115-120°C

Storage

NEXUS NXF-808-34 offers a 24 month shelf life stored in un-opened containers below 40°C. Care should be taken to

avoid temperatures below 0°C as freezing may cause separation of the flux additives. Shelf life of open containers will

depend on the environmental conditions, ensure lids are replaced and tightened to avoid evaporation.

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-5

0

5

10

15

20

25

30

µs

Time

Ion chromatogram of NXF-808-34 flux in accordance to J-STD-004B,

TM 650 2.2.34, showing no evidence of halide in NXF-808-34

Ion chromatogram of halide analytical standard showing fluoride, chloride,

bromide, nitrate, sulphate and phosphate as low as 3 mg Kg-1

Test Data - NXF-808-34

Flux Classification

J-STD 004B

ORL0

Colour Clear

Solids Content % 5.2

Specific Gravity 25°C 1.014

Acid Value mg KOH/g 34

Flash Point None

Quantitative Halide

J-STD 004B

No Halide

Surface Insulation

Resistance J-STD 004B

Pass >100 MΩ

Electrochemical

Migration J-STD 004B

Pass

Electromigration

Resistance GR78 Core

Pass

Copper Corrosion 10 day

J-STD 004B, flux solids

Pass

Copper Mirror Corrosion

J-STD 004B

Pass - Type L

Typical batch properties for NXF-808-34

J-STD 004B Surface Insulation Resistance test showing no conductive anodic

filament (CAF) migration or dendritic growth after 168 hours at 40°C 90%

relative humidity

-2

0

2

4

6

8

10

µs

Time

Fluoride

Chloride

Phosphate Bromide Nitrate

Sulphate

NXF-808-34 Rosin test flux

J-STD 004B Copper mirror corrosion test, showing NXF-808-34 as a type L

No complete removal of the copper. 24 hours 23°C 50 % relative humidity

7 day continuous Surface Insulation Resistance test, testinging cycles

every 20 minutes at 5V. Showing no dendrite formation and far exceeding

J-STD 004B requirements of greater than 100 MΩ.

0

2

4

6

8

10

12

0 81

62

43

24

04

85

66

47

28

08

89

61

04

11

21

20

12

81

36

14

41

52

16

0

SIR

[lo

g(o

hm

)]

Hours at 40°C 90% RH

NXF-808-34 median Surface Insulation Resistance J-STD 004B

Pattern Down

Pattern Up

Control

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Compatibility

NEXUS NXF-808-34 is a compatible flux technology with all NEXUS Lead Free soldering materials along with other

specialist fluxes available from Warton Metals Ltd.

Rework and hand assembly

NEXUS NXW-78 No Clean, Lead Free Cored Solder Wire

Nexus NXG-900 Tacky Rework Flux

Future 315 Rework Pens

Solder Paste

NEXUS NXP-900 No Clean, Lead Free Solder Paste

NEXUS NXP-950 No Clean, Lead Free Solder Paste

The information supplied in this Data Sheet is designed only as guidance for use of the product and is correct to the best of our knowledge and belief, at the

date of publication. However, no guarantee is made to its accuracy. This information relates only to the specific material designated and may not be valid for

such material used in combination with any other materials or in any other process (2017).

Wetting performance test against a leading

competitor VOC free flux. NXF-808-34

reaches buoyancy before the competitor

material and offers a stronger wetting force.

Tested as per J-STD 004 wetting balance

test, IPC TM650 2.4.14.2

Safety

Read all safety data sheets before use

NXF-808-34

Competitor VOC Free