COMPLETE TEARDOWN

WITH:

• Detailed photos and cross-sections

• Precise measurements

• Material analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

NVIDIA Tesla P100 Graphics ProcessingUnit (GPU) with HBM2

Title: NVIDIA Tesla P100 GPU with HBM2

Pages: 130

Date: October 2017

Format: PDF & Excel file

Price: Full report: EUR 3,490

TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging

HBM2 greatly increases memory capacity and bandwidth over first generation HBM1technology. HBM1 was limited to 1GB of memory per stack of four dynamic random accessmemory (DRAM) die with maximum capacity of 256MB and 125GB/sec of bandwidth. Thatcompares to 8GB of memory per stack of eight stacked DRAM die with maximum capacity of1GB and 180GB/sec bandwidth for HBM2.

The single 55mm x 55mm 12-layer ball grid array (BGA) package of the NVIDIA Tesla P100includes more than 3,500 mm² of silicon area. Two industry leaders, TSMC and Samsung, hadto come together to deliver this much silicon area in a package.

TSMC is the main provider for the Tesla P100. Using its 2.5D CoWoS platform, itmanufactures the GP100 GPU die, featuring a 16nm FinFET process and 15.3 billiontransistors. It also produces a large silicon interposer on top of which the GPU is assembled atthe wafer-level with its four HBM2 stacks.

Samsung provides the HBM2 stacks. A 3D assembly process yields HBM2 stacks composed offour 1GB DRAM memory dies and one buffer die, connected with via-middle through-siliconvias and micro-bumps.

The report includes a complete physical analysis of the packaging process, with details on alltechnical choices regarding process, equipment and materials. Also, the completemanufacturing supply chain is described and manufacturing costs are calculated.

The report also compares the Tesla P100 with AMD’s Fury X, which uses HBM1 and 2.5Dassembly, to explain the interest in evolution through the HBM2 and CoWoS 2.5D platforms.Finally, it describes NVIDIA’s key module design and related process choices.

Targeted for High Performance Computing (HPC) anddeep learning, the NVIDIA Tesla P100 is the world'sfirst artificial intelligence supercomputing datacenter GPU. It uses various leading edgetechnologies, including 3D stacked memory with2.5D integration on a silicon interposer in a Chip-on-Wafer-on-Substrate (CoWoS) process.

Improving memory performance threefold over theNVIDIA Maxwell architecture, the Tesla P100accelerators are equipped with 12GB or 16GB ofsecond generation high bandwidth memory (HBM2).

TABLE OF CONTENTS

Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

• NVIDIA Tesla P100 Teardown

• Package

View, Dimensions &

Marking

Dies Size

• DRAM Die

View, Dimensions &

Marking

µBumps & TSVs

• Package Cross-Section

Laminate & Frame Cross-

Section

Interposer Cross-Section

GPU Cross-Section

HBM2 Stack Cross-Section

• Comparison with AMD Fury X

including SK-Hynix HBM1

Manufacturing Process Flow

• Global Overview

• GPU Process Description

Interposer Process Flow

• HBM2 Stack Process Flow

• CoWoS Process Flow

Cost Analysis

• Overview of the Cost Analysis

• Yields Hypotheses

• GPU Front-End & Die Cost

• Interposer Wafer & Die Cost

• DRAM Front-End Cost

TSV Manufacturing Cost

Micro-Bumping

Manufacturing Cost

• DRAM Die Cost

• Logic Die Cost

• HBM Stack Cost

• CoWoS Assembly

Manufacturing Cost

• Final Component Cost

Estimated Price Analysis

Performed byPerformed by

3D Package CoSim+

IC Price +

ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D PACKAGE COSIM+ AND IC PRICE+

System Plus Consulting offerspowerful costing tools toevaluate the production cost &selling price from single chip tocomplex structures.

IC Price+

The tool performs the necessarycost simulation of any IntegratedCircuit: ASICs, microcontrollers,memories, DSP, smartpower…

3D Package Cosim+

Cost simulation tool to evaluatethe cost of any Packagingprocess: Wafer-level packaging,TSV, 3D integration…

AUTHORS:

ting in 2011 to setup itslaboratory. He previously workedfor 25 years at Atmel NantesTechnological Analysis Laboratoryas fab support in physical analysis,and for three years at HirexEngineering in Toulouse, in adestructive physical analysis lab.

YvonLe Goff (Lab)

Y vo n ha s jo i n edSystem Plus Consul-

for Advanced Packaging, MEMSand Integrated Circuits. He haspublished more than 50 ReverseCosting reports on various MEMSdevices including inertial,pressure, microphones or RFsensors.

Romain Fraux

Romain is in chargeof costing analyses

RELATED REPORTS

ANNUAL SUBSCRIPTION OFFER

You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or

15 Reverse Costing® reports.

Up to 47% discount!

• MEMS & Sensors:

Accelerometer - Compass - Display /Optics - Environment - Fingerprint -Gyroscope - IMU/Combo - Light -Microphone - Oscillator - Pressure sensor

• Power:

GaN - IGBT - MOSFET - Si Diode - SiC

• Systems:

Automotive - Consumer - Energy -Medical - Telecom

Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &costing analyses in various domains.

• Imaging:

Infrared - Visible

• Integrated Circuits & RF:

Integrated Circuit (IC) - RF IC

• LEDs:

LED Lamp - UV LED - White/blue LED

• Packaging:

3D Packaging - Embedded - SIP - WLP

Performed by

More than 60 reports released each year on the following topics (considered for 2017):

Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with

Integrated DRAM and DSP

NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level

System-in-Package

TSMC Integrated Fan-Out (inFO) Package in Apple’s A10

Application Processor

Inside the Sony Xperia™ XZs and theXZ Premium, the latest Motion Eye™can be found, with the new IMX400CIS.

The first ultra-small multi-die lowpower module with boot memoryand power management integratedin a package-on-package compa-tible device for the IoT.

Reverse engineering and costing ofthe new inFO packaging technologyfrom TSMC used for Apple’s latestA10 application processor, found inthe iPhone 7 and 7 Plus.

Pages: 130Date: July 2017Full report: EUR 3,490*

Pages: 132Date: June 2017Full report: EUR 3,490*

Pages: 100Date: October 2016Full report: EUR 3,490*

ORDER FORM

Performed by

DELIVERY on receipt of payment:

By credit card:Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__|

Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__|

By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP

In EURBank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439

In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797

Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING

21 rue La Nouë Bras de Fer44200 Nantes – France

Contact: EMAIL: sales@systemplus.frTEL: +33 2 40 18 09 16

BILLING CONTACT

ABOUT SYSTEM PLUS CONSULTING

Name (Mr/Ms/Dr/Pr):......................................................................................Job Title:......................................................................................Company:......................................................................................Address:......................................................................................City: State:......................................................................................Postcode/Zip:......................................................................................Country:......................................................................................VAT ID Number for EU members: ......................................................................................Tel:......................................................................................Email:.....................................................................................

Date:.......................................................................................Signature:......................................................................................

First Name: ..................................................................Last Name: ...................................................................Email:............................................................................Phone:...........................................................................

SHIP TO PAYMENT

Please process my order for “NVIDIA Tesla P100 GPU with HBM2” Reverse Costing Report

Full Reverse Costing report: EUR 3,490*

Annual Subscription (including this report as the first of the year):

System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available.

Our services:

TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS

www.systemplus.fr - sales@systemplus.fr

o 3 reports EUR 8 400*o 5 reports EUR 12 500*

o 7 reports EUR 16 000*o 10 reports EUR 21 000*o 15 reports EUR 27 500*

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: October 2017

Ref.: SP17353

TERMS AND CONDITIONS OF SALES

1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consultingexcept in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and workedout without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged onthese initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commitsitself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to thenumber of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of aparticular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penaltyfor late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on thedelivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty issent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total

invoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequentlyany reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takesplace. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones(reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described inthe current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes allexternal event unpredictable and irresistible as defined by the article 1148 of the French Code Civil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costingtools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

Performed by