NE IMAPS Symposium Adams 050604-1

8/8/2019 NE IMAPS Symposium Adams 050604-1

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"AlSiC-Based HybridComposite Tool Kit"

By Richard W. Adams

and Mark A. Occhionero

Ceramics Process Systems

111 South Worcester St

Chartley MA 02712-0338

www.alsic.com

New England IMAPS 31 Annual Symposium

Thursday May 6, 2004


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"AlSiC-Based Hybrid Composite Tool Kit"

Abstract:AlSiC and multi-component structures provide unique

thermal management electronic packaging solutions for

microwave, microelectronics, power electronics, and

optoelectronics that result in improved product reliability. This

paper reviews volume AlSiC manufacturing applications today,

and then describes examples of a wide range of possibilities for

multi-component, multi-functional thermal management

structures.


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AlSiC Packaging for Electronics Thermal Management

- Basic Parameters

Controlled Thermal Expansion

Engineered CTE values - for component and assembly

compatibility = reliability

Engineered solutions can create typical CTE values 7-12 ppm/C

Thermal Dissipation

High isotropic thermal conductivity, typical = 200 W/mK

Lightweight

3 g/cm 3

Cost Effective Manufacturing Capability - net shape cast


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CPS AlSiC Fabrication - Defines Properties and Design

SiC to Al-metal ratio defines thermal expansion

1st - SiC preform with controlled and variable volume content

2nd - Infiltrate with Al-metal to form the AlSiC composite

Thermal conductivity determined by components Electronic Grade SiC 230 - 260 W/mK

A356.2 Casting Alloy 160 W/mK

Little influence of ratio of 2 components

net shape forming

preform is ~ smaller than final part

infiltration tool = final dimensions

eliminates costly machining

SiC preforminjection molded

AlSiC productinfiltration casting


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AlSiC - Metal Matrix Composite Material

SiC

SiC particles uniformly distributed

in continuous Al-matrix

C S AlSiC nstantaneous C

9

emperature ( C)

In

n

n

u

C

E

(

/C)

AlSiC-9

AlSiC-

AlSiC-

~ vol% SiC

~ vol% SiC

~ vol% SiC

See www.alsic.com


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AlSiC Tools

Marry Properties to Product Design

Design Functionality

Basic AlSiC

lids

baseplates

package system structures

AlSiC + Concurrent IntegrationTM

Cooling Tubes - active fluid HOPG / Diamond - passive transfer

Dielectric Ceramic Inserts - isolation


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Basic AlSiC Design Pick compatible AlSiC CTE

Seal rings

Substrates

Devices

Design rules for AlSiC casting

Draft Angles

Thicknesses

Radii

Al-Rich Areas for conventionalmachining

See www.alsic.com


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Basic AlSiC - lids

Simple to Complex GeometriesApplications:

MicroprocessorLids

DSP

Flip Chip Lids

Optical Lids

Volumes100 pcs - 40K/week

Price Volume/Complexity $ 2 - $ 5 in volumes of

~100K/yr


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Basic AlSiC - lids

Complex GeometriesProduct is net-shape fabricated -

no machining

multiple pedestals

angled features

radial alignment features

septums and walls

lower cost than machined

Aluminum alternative


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Basic AlSiC - Baseplates

Compatible CTE = unlimited

thermal cycling of package

AlN soldered to AlSiC

Design

Dome Shape - Side 1

Compressing a dome shape

against flat cold plate

maximizes heat transfer

Flat - Side 2

Attachment of flat substrates flat dielectric substrate surface

convex bow cooler plate surface

Thomas Schuetze, Herman Berg, OliverSchilling The new 6.5kV IGBT module: areliable device for medium voltageapplications, PCIM September 2001


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Concurrent IntegrationTM -High Density Interconnect HDI for

GaAs Microwave Transmit/Receive Packages

First, dense dielectric ceramic

ferrules are inserted into the

QuickCastTM infiltration tooling

along with the SiC preform.

Then, the Al-metal, that infiltratesthe SiC preform to form the AlSiC

composite, hermetically bonds and

fills the ferrules to form coaxial

feedthrus. This process is termed

Concurrent IntegrationTM.

Dielectric Feedthrus


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Concurrent IntegrationTM - AlSiC LED Submount

Alloy Metal InsertsProduct Features:

multiple pedestals

angled features

partially machined to expose Alloy

4 pads for assembly

Alloy 4 bonded direct to Al phaseof AlSiC

Alloy 4 pad


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Concurrent IntegrationTM - Optoelectronic AlSiC TE

Cooler Substrate with HOPG

High Thermal Conductivity Insert

Product Features:

Pyrolytic Graphite PG compressively

encapsulated within AlSiC

Thermal conductivity 1300 W/mK PG located near heat source/TE

cooler position.

Selective use of costly material

1350 W/mK

Heat source surface

1350 W/mKAlSiC laser diode TEC substrate system showing TEC

mount area top and the cross section showing the

HOPG insert in the AlSiC composite bottom .

HOPG 1300 W mK

AlSiC

AlSiC


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Concurrent IntegrationTM - Liquid Flow Thru Cooling

Cooling Tube or Heat Exchanger

Product Features:

Tube intimate within AlSiC casting SiC overmolded onto tube

Direct bond AlSiC to tube

Maximize heat transfer AlSiC to tube

Low cost one step assembly

CPS Patented process


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Metallurgical Bonding AlSiC to AlSiC

BAS

TOP

Heat sink and housing are joined by

Friction Stir Welding.

Frictio Stir Weldi g

Bonding of Engineered Al-Rich

Areas within AlSiC casting

Al Solder Bo di g Processes

Various commercially availableDesired Al Skin Present on

AlSiC


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QuickCastTM

High Pressure Precision Aluminum Casting Aluminum-only precision casting

Tolerances in the +/-0.003 Range

Low cost tooling

Rapid product introduction andmoderate production rate

Option for Concurrent IntegrationTM

Diamond, PG, etc inserts

High Output LED light housing

RV, Boats, Theater, Safety Lighting


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S mmary "AlSiC-Based Hybrid Composite Tool Kit"

Basic AlSiC Properties coupled with Concurrent IntegrationTM

AlSiC = Engineered CTE, Thermal Conductivity, Lightweight

CPS AlSiC =

Shape Complexity and Tight Tolerance - net shape

Attractive Value Proposition for many growing number of Applications

Concurrent IntegrationTM Presents Thermal Package Design

Options - limited only to your imagination

AlN, ZTA, Al2O3, Si3N4 Substrates/Ferrules, etc.

Stainless steel, alloy 4 , Titanium inserts

Tubes, Heat exchangers, welded pin fin coolers

High Thermal Conductivity Diamond, PG


18/18

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NE IMAPS Symposium Adams 050604-1

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