EF_to_NCPsMtg_Challenge3 - 1

Provisional draft

NCPs MeetingBrussels, 19 October 2006

ICT Work Programme 2007-08:ICT Work Programme 2007-08:Activities under Challenge 3Activities under Challenge 3

Erastos FilosDirectorate “Components & Systems”

European Commission, Brussels

EF_to_NCPsMtg_Challenge3 - 2

Provisional draft Presentation outline

• R&D in electronics & its key role for

Europe’s competitiveness

• Challenge 3 rationale

• Foreseen activities under Call 1

• Foreseen activities under Call 2

• Joint Technology Initiatives – a way to

implement ETP Strategic Research

Agendas

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Provisional draft The pervasiveness of electronics …

Electronics underpins everybusiness sector

World GDP

Electronic Equipment

Semiconductors

Investment: Materials & Equipment

Source: Future Horizons, IFS2005, Jan 2005

€ 30,050 bn

€ 1,050 bn

€ 210 bn

€ 38 bn

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Provisional draft

Electronics: Key to intelligent products

By 2010, electronics & software in cars will

account for up to 40% of their value

By 2010, electronics & software in cars will

account for up to 40% of their value

• Smarter products:• Electronic safety

• Driver customisation

• Resource-efficient products:• Fuel efficiency

• Info-mobility & traffic management

• ICT-enabled disposal

• Value-adding services: • Active safety features

• Remote diagnostics & assistance

• Infotainment & travelguidance

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Provisional draft Europe - losing the game ?

• Europe – a net importer of electronics

• Aggressive global competition: Asia 2/3 of world semiconductor market & 3/4 share in investment

• A typical semiconductor fabrication facility costs € 2.5 billion

0%

10%

20%

30%

40%

50%

60%

EU Japan US Asia

10 %

24 %18 %

Microelectronics investments

€ 27.9 billion in 2005

48 %

0%

10%

20%

30%

40%

50%

60%

EU Japan US Asia

10 %

24 %18 %

Microelectronics investments

€ 27.9 billion in 2005

48 %

Source: European Semiconductor Industry Association, 2005

Source: European Semiconductor Industry Association, 2005

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Provisional draft European microelectronics achievements

• World top-10 list of semiconductor companies:– 1990: 1 European company– 2004: 3 European companies– 2006: ?

• Equipment:– Wafer processing:

• 5 European SMEs on top 10 list• Europe’s big 2 (ASML and ASM Int’l)

on top 10– Assembly equipment:

• 2 European companies on top 10 list

• Consensus building in nanoelectronics – Strategic public-private partnership

VLSI Research 2003VLSI Research 2003

www.eniac.eu

EF_to_NCPsMtg_Challenge3 - 7

Provisional draft

To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration &

embedded systems capabilities

To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration &

embedded systems capabilities

Challenge 3:Components, Systems, Engineering

www.artemis-office.org

www.eniac.eu

www.smart-systems-integration.org

www.photonics21.de

R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international co-operation under the Intelligent Manufacturing Systems initiative cordis.europa.eu/ims

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Provisional draft Foreseen activities under Call 1:

3.3.1.1: Next-Generation Nanoelectronics

Components & Electronics Integration

3.3.1.2: Organic & Large-Area Electronics &

Display Systems

3.3.1.3: Embedded Systems Design

3.3.1.4: Computing Systems

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Provisional draft

Next-Generation Nanoelectronics Components & Electronics Integration

• Smaller, higher performance, lower cost:

−“More Moore”−Beyond CMOS

• Integration & diversification:

−SoC: Systems-on-Chip−SiP: Systems-in-Package

Technologymaterials, processes, metrology, interconnects, modelling, packaging, architectures

Designincreased complexity, changed performance, heterogeneity in SiP & SoC, productivity & “Design for Manufacturing”

ManufacturingCost-efficient, flexible production for silicon < 45 nm; for SoC & SiP; 450 mm wafer size; small batch/fast cycle time; equipment assessment

Call 1:€ 86 mn

CP, NoE, CSA

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Provisional draft

Organic & Large-Area Electronics & Display Systems

• Organic & large-area technologies:– Large-area & low-cost manufacturing – Advanced modelling, simulation & circuit design characterisation– Enabling functions:

• logic, memory, e-paper, systems-on-tags, RFIDs, lab-on-chip, lighting, signage, energy scavenging/storage & power management

• Advanced display systems:– Visualisation systems supporting

• Multi-viewer unaided, unrestricted 3D-viewing & natural interaction

– Signal acquisition, processing & representation for 3D-systems – Portable display systems

• Zero-power displays, ruggedised displays• Flexible/transparent devices• Energy-efficient micro-projectors• Lightweight high-resolution vision glasses

Call 1:€ 63 mnCP, NoE,

CSA

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Provisional draft Embedded Systems Design

• Target outcomes

– Theory & methods for embedded systems design• Key issues: heterogeneity, composability, predictability & adaptivity• International cooperation is encouraged

– Suites of interoperable design tools for rapid design & prototyping• Research will contribute to interoperability of tools from SME vendors;

consolidating tool developers’ joint R&D work; pen tool frameworks

• Expected impact– Increase system development productivity (at least 1 order of

magnitude)– Stimulate growth of European high-tech companies in the field– Reinforce S&T leadership in complex systems engineering

Call 1:€ 40 mn

CP, NoE, CSA

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Provisional draft Computing systems

• Target outcomes– Novel architectures for multi-core computing systems

• Architectures & system software for scalable & customisable on-chip computing systems incorporating multiple networked, symmetric or heterogeneous, fixed or reconfigurable processing elements

• Key issues: power & performance versatility; reliability & availability– Reference architectures for generic embedded platforms

• Key issues: composability, networking, robustness/security, diagnosis/maintainability, resource management, evolvability & self-organisation

• Expected impact– Inexpensive generic platforms with high European added value enabling

European supplier companies to increase market share– Develop European competences in the use of high-end computing for

the development of new applications– European excellence in computing architectures, system software &

platforms

Call 1:€ 25 mn

CP (STREP), NoE

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Provisional draft Foreseen activities under Call 2:

3.3.2.1: Photonic components & subsystems

3.3.2.2: Micro/Nanosystems

3.3.2.3: Networked Embedded & Control Systems

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Provisional draft

Components &Subsystems - Lasers & solid-state

sources- Image sensors- New sensors

Photonic Components & Subsystems

Application specific

- Broadband core networks- Broadband access & LAN- Medical diagnosis & prevention- Sensors for environment, safety

& security applications

Underlyingtechnologies

Complementary measures

Assessment ofprototypes

Core

Integration

Manufacturing

Design methodology & tools

Support measures

Networking, integration & structuring

Access:Expertise centres & foundries

Education:Young people & graduates

Consensus building: R&D strategies,int’ cooperation

Call 2: € 90 mnCP, NoE,

CSA

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Provisional draft Micro/Nanosystems

• Next generation smart systems Sensor- & actuator-based systems

• Nano-Bio-ICTechnologies convergence Biosensors, lab-on-a-chip, bioMEMS, autonomous implants

• Smart fabrics and interactive textiles Integration of intelligence in textile materials

• From smart systems to viable products Microsystems manufacturing technologies

• Innovative memory systems Emerging technologies for high density mass storage capacity

• Support actionsTechnology access, education and training, coordination & dissemination at EU level

Call 2:€ 83 mn

CP, NoE, CSA

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Provisional draft Networked Embedded & Control

Systems

• Target outcomes– Middleware platforms for embedded systems

• Key issues: composability, minimum power consumption, openness• Emphasis: programmability, reconfiguration, privacy & trust

– Cooperating objects and Wireless Sensor Networks• Spontaneous cooperation of objects in spatial proximity• Emphasis on new methods & algorithms, hardware/software

platforms for distributed execution & programming & tools for self-organising systems

– Control of large-scale complex distributed systems• Key issues: efficiency, robustness, safety, security• Applications: manufacturing plants, infrastructures

• Expected impact• Enable entirely new services & applications• Make large infrastructures more efficient, flexible & productive• 100% plant availability, reduce maintenance & accidents

Call 2:€ 47 mn

CP, NoE, CSA

EF_to_NCPsMtg_Challenge3 - 17

Provisional draft

A spiral model of innovation capitalising on the multiple

reciprocal relationships between public & private stakeholders at

various knowledge stages

A spiral model of innovation capitalising on the multiple

reciprocal relationships between public & private stakeholders at

various knowledge stages

European Technology Platforms

• Addressing major technological challenges in specific domains• Aiming to leverage public & private investment for R&D &

innovation• Involving key R&D stakeholders

— eg industry, the research community & public authorities

• Bundling fragmented R&D efforts towards agreed goals— Vision 2020 document & Strategic Research Agenda

30+ European Technology Platforms launched so far:

cordis.europa.eu/technology-platformscordis.europa.eu/technology-platforms

POLICY

POLICY

RESEARCH

RESEARCH

BUSINESSBUSINESS

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Provisional draft

1. Emergence & setting up: – „Bottom-up“ process with key stakeholders in a specific

domain– Key deliverable: Strategic vision document

2. Definition of a Strategic Research Agenda– Co-ordinated by an Advisory Council– Consensus-based– Deployment strategy

3. Implementation of the Strategic Research Agenda‐ Through collaborative research in FP7 & with other

resources, or‐ Through a Joint Technology Initiative (JTI) which integrates

funding sources, eg Framework Programme, transnational & nat’l research programmes, industrial funding, 3rd party private financeCommission Staff Working Paper, SEC(2005)800 of 10 June 2005 &

Status Report 2 of May 2006cordis.europa.eu/technology-platforms/further_en.html

Commission Staff Working Paper, SEC(2005)800 of 10 June 2005 &Status Report 2 of May 2006

cordis.europa.eu/technology-platforms/further_en.html

Joint Technology Initiatives:A way to implement a Strategic Research

Agenda

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Provisional draft For more information

European research on the web:http://cordis.europa.euhttp://cordis.europa.eu/fp7http://ec.europa.eu/comm/research/future/

Information Society and Media:http://ec.europa.eu/information_society/http://cordis.europa.eu/ist

Directorate G:http://cordis.europa.eu/ist/directorate_g

Contact:erastos.filos@ec.europa.eu