Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Nano and Microtechnologies of hybrid

bioelectronic systemsDr. Yael Hanein

Physical electronics, TAU 2004

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Computer used to be VERY big…

http://www.bell-labs.com/org/physicalsciences/timeline/

Integrated circuit technology

19991.2 GHz, 1.8V

42M Components

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Two revolutions:1. From vacuum tubes to SC devices

2. Integrated circuit

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Integrated circuit technology1947 Bell Labs

nanotechnology

2003

1980 1980 hybrid micro bioelectronicsystems

hybrid nano bioelectronicsystems

BioMEMS

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Moore’s law

Gordon Moore (co-founder of Intel) predicted in 1965 that the transistor density of semiconductor chips would double roughly every 18 months.

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Hybrid nano bioelectronicsystems

DNA, Dekker, Delft

CNT Field effect transisitor

Bio-electronics• Smaller, faster (~nm)• Built in self-assembly capabilities (DNA, Proteins)• Sensing through chemical modification

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Hybrid micro bioelectronicsystems

Neuronal recordingFromherz,

Lab on a chipMicronics

http://www.dupont.com/mcm/product/biosensors.html

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

VLSI

• IC technology• Semiconductor

Physics• Material science

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Insulators, conductors and SC

• Metals (conductors)

• Semi-conductors

• Insulators

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Insulators, conductors and SC

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Covalent and metallic bonds

Metallic bond

Covalent bonds

Energy levels in atoms

Si (14): 1s2, 2s2 2p6 = 10 (+4)

In the basic unit of a crystalline silicon solid, a silicon atom shares each of its four valence electrons with each of four neighboring atoms

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Doping

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Field effect transistor

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

IC Transistor

MaterialsProcesses• Deposition (Metals, Insulators, SC)• Doping• Patterning• Etching

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Structural properties • Single crystal materials – almost all atoms are located at well defined regular positions known as lattice sites• Amorphous materials – atoms have no long range order• Polycrystalline – a collection of small crystals randomly oriented with respect to each other.

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Crystals

• Miller indices (x,y,z)• (x,y,z) – plane• [x,y,z] – direction• x,y,z – the inverse of the points at which the

plane crosses the three axis• x,y,z – refers to all equivalent planes (100

in cubic symmetry

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Materials: SiliconFabrication: • Crystalline: Wafers • Polysilicon: thin film deposition• Amorpous : thin film depositionOptics:• Not an active optical material (indirect band gap)• Transparent at IR• <0.4 µm reflects 60% of incedent light

Chemistry/biology• Stable and resistant (brake fluid, biological medium)• Suitable for high purity gases • Benign in the body, does not release toxic substances.Cost:• Low – ultra pure electronic grade silicon wafers are available for IC

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Materials: Silicon

Slurry

Polishing table

Polishing head

Polysilicon Seed crystal

Heater

Crucible6. Edge Rounding

7. Lapping

8. Wafer Etching

9. Polishing

10. Wafer Inspection

1. Crystal Growth

2. Single Crystal Ingot

3. Crystal Trimming and Diameter Grind

4. Flat Grinding

5. Wafer Slicing

Materials: metals

Metal ρ (10-6 Ω×cm) ApplicationsAg 1.58 ElectrochemistryAl 2.7 Elect interconnects

Optical reflectionAu 2.4 High T elect interconnect

Optical refl IRelectrochemistry

Cr, Ti, TiW 12.9, 42, 75-200 Intermediate adhesion layerCu 1.7 Elect interconnectsITO 300-3000 Transparent interconnectsIr, Pt 5.1, 10.6 Electrochemistry

Bio-potential sensorsW 5.5 High T elect interconnects

Maluf table 2.3, 24

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Metal deposition

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Patterning - lithography

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Clean room class rating

MEMS

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

Motor

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein

MEMS

Nano and Microtechnologies of hybrid bioelectronic systems, Y. Hanein