N. J. DiNardo, M. VallièresDrexel University

J. M. Vohs, W. R. Graham, R. J. CompostoUniversity of Pennsylvania

F. Fontaine, T. CumberbatchCooper Union

Quantum Structure of MaterialsQuantum Structure of MaterialsA Multi-faceted Approach in TeachingA Multi-faceted Approach in Teaching

Introductory Solid State MaterialsIntroductory Solid State Materials

FIE 98

Key Motivating FactorsKey Motivating Factors

• New materials technologies - quantum, nanoscale

• New curricular mandates– Engineering up-front - Drexel's E4 Curriculum

– Inverted curricula - Capstone courses

– Interdisciplinary engineering practice - Materials

– Intra/inter-institutional projects - Gateway Coalition

– ABET 2000 criteria

• New nanoscale materials characterization tools - Scanning Probe Microscopes (SPMs)

• New instructional tools - computation, modules, www

• New materials technologies - quantum, nanoscale

• New curricular mandates– Engineering up-front - Drexel's E4 Curriculum

– Inverted curricula - Capstone courses

– Interdisciplinary engineering practice - Materials

– Intra/inter-institutional projects - Gateway Coalition

– ABET 2000 criteria

• New nanoscale materials characterization tools - Scanning Probe Microscopes (SPMs)

• New instructional tools - computation, modules, www

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ObjectivesObjectives

• Build upon the lower division experience

• Establish fundamental ideas of the electronic properties of materials based on an atomistic picture

• Combine coursework with– state-of-the-art laboratory experiences

– problem-solving and projects using computational tools

– computer-based teaching modules

• Demonstrate interdisciplinarity in Materials Engineering– Physics, Chemistry, Chemical Engineering, Electrical Engineering

• Recognize Gateway mission and ABET criteria

• Build upon the lower division experience

• Establish fundamental ideas of the electronic properties of materials based on an atomistic picture

• Combine coursework with– state-of-the-art laboratory experiences

– problem-solving and projects using computational tools

– computer-based teaching modules

• Demonstrate interdisciplinarity in Materials Engineering– Physics, Chemistry, Chemical Engineering, Electrical Engineering

• Recognize Gateway mission and ABET criteria

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BackgroundBackground

• The Gateway Coalition– Open new gateways for learning within an engineering

education focus ...

– NSF Engineering Directorate funding

• Project Collaboration– Drexel University - Physics

– University of Pennsylvania - Materials Science and Engineering, Chemical Engineering

– The Cooper Union - Electrical Engineering

• The Gateway Coalition– Open new gateways for learning within an engineering

education focus ...

– NSF Engineering Directorate funding

• Project Collaboration– Drexel University - Physics

– University of Pennsylvania - Materials Science and Engineering, Chemical Engineering

– The Cooper Union - Electrical Engineering

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The Gateway CoalitionThe Gateway Coalition

• Collaborative programs among several institutions with diverse institutional cultures

• Driving principle: Introduction of engineering and its functional core up-front - (Drexel E4 experience)

– Content Human resource development and broader experience

– Integrative aspects of the engineering process

– Concurrent learning

– Multidisciplinary emphasis

– Use of new instructional technologies

• Collaborative programs among several institutions with diverse institutional cultures

• Driving principle: Introduction of engineering and its functional core up-front - (Drexel E4 experience)

– Content Human resource development and broader experience

– Integrative aspects of the engineering process

– Concurrent learning

– Multidisciplinary emphasis

– Use of new instructional technologies

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Goals of CollaborationGoals of Collaboration

• Drexel University– build on lower division experience based on E4 model

– upper-division introduction to solid state materials

• University of Pennsylvania– add state-of-the-art student laboratory to existing

course

• Cooper Union– create post-solid-state project-based course to address

materials and process issues in Electrical Engineering

• Drexel University– build on lower division experience based on E4 model

– upper-division introduction to solid state materials

• University of Pennsylvania– add state-of-the-art student laboratory to existing

course

• Cooper Union– create post-solid-state project-based course to address

materials and process issues in Electrical Engineering

draw from common elements / facilities

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Curriculum DevelopmentCurriculum Development

• Drexel University– develop multi-component course in the electrical

properties of solid state materials

– initially directed to Materials Engineering juniors

• Penn– develop thin-film device fabrication and analysis

laboratory for sophomore engineering course

• The Cooper Union– develop web-based course in advanced topics in

engineering materials

• Drexel University– develop multi-component course in the electrical

properties of solid state materials

– initially directed to Materials Engineering juniors

• Penn– develop thin-film device fabrication and analysis

laboratory for sophomore engineering course

• The Cooper Union– develop web-based course in advanced topics in

engineering materials

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Drexel UniversityDrexel University

• Quantum Structure of Materials - The Course– Background

• ~10-20 Materials Engineering students per year other fields

• Course materials - introductory text, notes, reserve books, journals

• Pre-requisites - PFE, MFE, Materials (sophomore)

– Theory - ~1-D

– Nano-characterization Laboratory

– Research on recent topics in SPM and Nanotechnology– Scanning Probe Microscopy Module (Authorware®/Mac)

– Computational exercises

• Quantum Structure of Materials - The Course– Background

• ~10-20 Materials Engineering students per year other fields

• Course materials - introductory text, notes, reserve books, journals

• Pre-requisites - PFE, MFE, Materials (sophomore)

– Theory - ~1-D

– Nano-characterization Laboratory

– Research on recent topics in SPM and Nanotechnology– Scanning Probe Microscopy Module (Authorware®/Mac)

– Computational exercises

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TheoryTheory– Materials - an atomistic approach to electronic structure

– Classical physics *

– Modern Physics• Quantization of charge, light, energy

• Wave-particle duality

• Schrödinger equation in one-dimension / bound, unbound states *

– Solid State Physics• Atoms and molecules, Interatomic bonds *

• Free electron model Energy bands in solids *

• Semiconductors, Insulators

• Semiconductor and Optoelectronic devices

• Quantum structures

– Materials - an atomistic approach to electronic structure

– Classical physics *

– Modern Physics• Quantization of charge, light, energy

• Wave-particle duality

• Schrödinger equation in one-dimension / bound, unbound states *

– Solid State Physics• Atoms and molecules, Interatomic bonds *

• Free electron model Energy bands in solids *

• Semiconductors, Insulators

• Semiconductor and Optoelectronic devices

• Quantum structures * potential energy functions

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Nano-characterization LaboratoryNano-characterization Laboratory

• Burleigh Scanning Tunneling Microscope

• Digital Instruments MultiMode®

Scanning Force Microscope

• Burleigh Scanning Tunneling Microscope

• Digital Instruments MultiMode®

Scanning Force Microscope

Graphitesurface

note: Gateway Advanced Materials Laboratory

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Topics in SPM / NanotechnologyTopics in SPM / Nanotechnology

• Nanoscale Characterizationof Surfaces and Interfaces

• Journal / web-based research“Look up a recent article (in last three years) in Applied Physics Letters where Scanning Tunneling Microscopy (STM) was applied to a current problem in materials science and engineering. In about one page, discuss the application, how the STM was used, and the authors' results and conclusions. Refer to additional sources if necessary.”

• Nanoscale Characterizationof Surfaces and Interfaces

• Journal / web-based research“Look up a recent article (in last three years) in Applied Physics Letters where Scanning Tunneling Microscopy (STM) was applied to a current problem in materials science and engineering. In about one page, discuss the application, how the STM was used, and the authors' results and conclusions. Refer to additional sources if necessary.”

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Scanning Probe Microscopy ModuleScanning Probe Microscopy Module

Computational exercisesComputational exercises

• Energy Band Structure in 1-D

• Bound states and Scattering• Surface potentials• Junction phenomena

• Energy Band Structure in 1-D

• Bound states and Scattering• Surface potentials• Junction phenomena

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AttributesAttributes

• Beyond the textbook …– modern physics and physics of materials

• application of advanced science and engineering principles

• integration of structure and electrical properties

– state-of-the-art experimentation, computation• utilization of a broad range of methodologies

– research on current topics• integration of disciplines, life-long learning

• Connection with Freshman/Sophomore experience• Requirement for Materials Engineering ...

• Beyond the textbook …– modern physics and physics of materials

• application of advanced science and engineering principles

• integration of structure and electrical properties

– state-of-the-art experimentation, computation• utilization of a broad range of methodologies

– research on current topics• integration of disciplines, life-long learning

• Connection with Freshman/Sophomore experience• Requirement for Materials Engineering ...

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University of PennsylvaniaUniversity of Pennsylvania

• Growth of thin-film metal contacts on Si substrate– vacuum and ultrahigh vacuum techniques, thin film deposition

– sample preparation

• Thin-film, surface, and interface characterization– Rutherford Backscattering Spectrometry

• elemental depth profiling

– Auger Electron Spectroscopy• surface chemistry

– Scanning Tunneling Microscopy• surface morphology

• Electrical characterization of devices– i-v measurements of Schottky barrier

• Growth of thin-film metal contacts on Si substrate– vacuum and ultrahigh vacuum techniques, thin film deposition

– sample preparation

• Thin-film, surface, and interface characterization– Rutherford Backscattering Spectrometry

• elemental depth profiling

– Auger Electron Spectroscopy• surface chemistry

– Scanning Tunneling Microscopy• surface morphology

• Electrical characterization of devices– i-v measurements of Schottky barrier

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AttributesAttributes

• Beyond the textbook …– reinforcement of topics in modern physics

– experimentation - device fabrication• utilization of state-of-the-art methodologies

• direct relation to industrial processing and analysis

• Facility-driven

– exportable manual theory / analysis of real data

• Modes of delivery

– stand-alone laboratory

– enhancement to other materials-related courses

• Beyond the textbook …– reinforcement of topics in modern physics

– experimentation - device fabrication• utilization of state-of-the-art methodologies

• direct relation to industrial processing and analysis

• Facility-driven

– exportable manual theory / analysis of real data

• Modes of delivery

– stand-alone laboratory

– enhancement to other materials-related courses

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The Cooper UnionThe Cooper Union

• Modules in– Crystals and Wave Mechanics

– Carrier Distribution, Transport, Generation/Recombination

– Non-linear and Anisotropic Materials

– Optical Fibers

– Computer Modeling and Analysis• Related MATLAB computations

• Outside research

• Electronic Materials Experimentation– Fabrication and analysis of p-n junctions

• Modules in– Crystals and Wave Mechanics

– Carrier Distribution, Transport, Generation/Recombination

– Non-linear and Anisotropic Materials

– Optical Fibers

– Computer Modeling and Analysis• Related MATLAB computations

• Outside research

• Electronic Materials Experimentation– Fabrication and analysis of p-n junctions

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AttributesAttributes

• Beyond the textbook …– applied materials physics

• application of advanced science and engineering principles

• integration of structure, properties, processing, performance

– theory, computation• utilization of methodologies for theoretical analysis and prediction

– research on current topics• integration of disciplines, life-long learning

• Computation-intensive– computation facility

• Beyond the textbook …– applied materials physics

• application of advanced science and engineering principles

• integration of structure, properties, processing, performance

– theory, computation• utilization of methodologies for theoretical analysis and prediction

– research on current topics• integration of disciplines, life-long learning

• Computation-intensive– computation facility

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AssessmentAssessment - - Quantum Structure of MaterialsQuantum Structure of Materials

• Relevance– important whether or not applicable to current experience

• Level– challenging, particularly applying mathematics and physics

• Homework exercises and examinations– challenging but provides key understanding of concepts by

practice

• Text/notes– gaps in text presentations, need for auxiliary material

• Laboratory– supports hands-on learning

– relevance to industry / co-op

• Relevance– important whether or not applicable to current experience

• Level– challenging, particularly applying mathematics and physics

• Homework exercises and examinations– challenging but provides key understanding of concepts by

practice

• Text/notes– gaps in text presentations, need for auxiliary material

• Laboratory– supports hands-on learning

– relevance to industry / co-opbeyond the degree...

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Implementation IssuesImplementation Issues

• Institutional– unique curricular structures

– identification of needs and opportunities

– developing new courses / enhancing existing courses

– institutionalization

• Multi-institutional interactions– focus on common experiences– sharing facilities - SPM, RBS/AES

• distance, time, schedules

• ongoing support and planning

• Institutional– unique curricular structures

– identification of needs and opportunities

– developing new courses / enhancing existing courses

– institutionalization

• Multi-institutional interactions– focus on common experiences– sharing facilities - SPM, RBS/AES

• distance, time, schedules

• ongoing support and planning

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Closing remarksClosing remarks

• Active participation of students in new curricular initiatives

• Three unique capstone models with common attributes

– materials engineering

– computation / experimentation / research

• Evolving institutions in a changing world

– curriculum reform enveloping the courses• response - continual development, customization,

communication

– rapidly developing technologies • opportunities to better address real materials applications

• Active participation of students in new curricular initiatives

• Three unique capstone models with common attributes

– materials engineering

– computation / experimentation / research

• Evolving institutions in a changing world

– curriculum reform enveloping the courses• response - continual development, customization,

communication

– rapidly developing technologies • opportunities to better address real materials applications