MSE 2034 Dislocations and Strengthening Mechanisms
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Transcript of MSE 2034 Dislocations and Strengthening Mechanisms
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Theoretical strength of
crystalsis much greater
then their experimentalstrength
Dislocations and Strengthening
Mechanisms
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g
Plastic deformationcorresponds to the
motion of large
numbers ofdislocations
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dislocation density:
total dislocation length/unitvolume
number of dislocations/unit area
Carefully prepared crystal: 103/mm2
Heavily deformed crystal: 109/mm2
After heat treatment: 106/mm2
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Metals under plastic deformation emit
energy
95% heat
5% internal energy stored as strain
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Shear Stress
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gamma-irradiated LiF single crystal.
http://upload.wikimedia.org/wikipedia/commons/0/05/Dislocation_pile-up.jpg -
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Edge dislocation
Screw dislocation
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Edge dislocation
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Slip: process by which plastic deformation isproduced by a dislocation motion.
Slip plane: crystal plane along which thedislocation travels
Slip direction: direction of motion
Slip System = slip plane + slip
direction
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planeslipofarea
directionslipinforcetorque
F l
F cos l
planeslipofarea
F l
cos
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A2
planeslipofarea
F l
cos
A1
fphi
1
2cosA
Af
A2
A1 fcos2
1
AA
f
l
cos
cos2A
F22
coscos
cos
cosA
FA
F fl
f
l lfl
f
l coscoscoscos
cos
cos
22
A
FA
F
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fl coscos
(111)
FCC
xz
y]110[
]011[
]110[
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Slip Systems
Cu ductility of 45% elongation
Ti ductility of 25% elongation
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Zn
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Resolved shear stress
The most favorable slip system
fl coscosR
max)cos(cos(max) fl
R
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The most favorable slip system
max)cos(cos(max) fl R
Critically resolved shearstress: Minimum shear stress needed to start slip
This occurs at yield
max)cos(cos lf crssy
max)cos(cos flYcrss
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The most favorable slip system
max)cos(cos(max) fl R
Critically resolved shearstress: Minimum shear stress needed to start slip
This occurs at yield
max)cos(cos flYcrss
(max)Rcrss
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Minimum stress appears
atf=l=45
cos (45)= 1/2y2crss
fl coscosYcrss
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A single crystal of cadmium is oriented for a tensile test so its slip
plane makes an angle of 65 with the tensile axis. Possible slip
directions are 30, 48, 78.
a) Which of the slip directions is most favored?b) If plastic deformation begins at a tensile stress of 1.55 MPa, find
crss
a) cos 30= 0.87, cos 48= 0.67, cos 78=0.21
l= 30 most favored
b)
fl coscosYcrss
65
MPaMPacrss 57.065cos30cos55.1
At =1.0 MPa, will the system slip?
No
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Slip lines on copper
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Polycrystalline material
Before deformation afterdeformation
Equiaxial grains elongated grains
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Deformation by twinning
(mechanical)
Slip
twinning
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Strengthening in metals
Grain size reductionSolid-solution
Strain hardening
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Grain size reduction
Grain Size is regulated by
1. Rate of solidification2. Plastic deformation
3. Heat treatments
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Grain size reduction
Grain Boundary
barriers
Grain orientation
differentAtomic disorder at
boundaries
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Hall-Petch
Equation
y = 0 + kyd-.5
Grain sizereduction
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Strengthening in metals
Grain size reductionSolid-solution
Strain hardening
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Solid-solution- Ni and Cu
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Solid-solution Mechanism
Foreign atoms host atoms
compressive
lattice strain
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Strengthening in metals
Grain size reductionSolid-solution
Strain hardening
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Strain hardening
Work hardening Cold working
Process in which a ductile metal becomes harder
and stronger as it is plastically deformed.
Ad area after deformation
100%0
0
A
AACW d
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Strain hardening
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RecoveryRecrystallization
Grain Growth
Heat
Treatment
(annealing)
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Recovery Recrystallization Grain Growth
Recovery
Stored internal strain
energy relieved by
dislocation motion
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Recovery Recrystallization Grain Growth
Recrystallization
Formation of a new set
of strain-free crystals
within a previously cold
worked material.
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Recovery Recrystallization Grain Growth
Grain Growth
Increase in average
grain size of a
polycrystalline material.
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33% cold worked brass
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Recrystallization 3s at 580
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Recrystallization 4s at 580
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Complete recrystallization 8s at 580
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Grain Growth at 15 minutes at 580
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Grain Growth at 10 minutes at 700
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Recrystallization temperature
Temperature at whichrecrystallization reaches completion
at 1 hour.
Brass at 580oC complete
recrystallization at 8secRecrystallization temperature for
brass is 450 oC
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iron
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Grain Growth
Ktdd nn 0
N=2
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Ktdd nn 0
The average grain diameter for some metal alloy was measured as
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Time Grain diameter(min) (mm)
30 0.04991 0.071
The average grain diameter for some metal alloy was measured asfunction of time at 650C, which is tabulated below at two differenttimes:Give the equation.Calculate KWhat was the original grain diameter?What grain diameter would you predict after135min at 650C?
K=4/73E-5mm2/min
d0=.01mm
D135=7.98mm
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****Review for MSE 2034 Test 1
****All Quizzes and Homeworks********
Definitions and formulae:
Chapter 2 Fig 2.8; ionic bond, covalent bond, metallic bond, Van
der Waal Bond
Chapter 3
crystal structure, unit cell (repeating unit undertranslation), simple cubic, face centered cubic,coordination number, body centered cubic, hexagonalclosest packing, atomic packing factor, grain, lattice,diffraction, nl=2d sinq, diffraction angle = 2q
Chapter 4
vacancy, NV = N exp(-QV/kT), alloy, substitutionalpoint defect, interstitial, point defect, edge dislocation(Burgers vector perpendicular to dislocation line),screw dislocation (Burgers vector parallel todislocation line), twin boundary
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Review for MSE 2034 Test 1
Chapter 5
diffusion, self-diffusion, inter diffusion or impuritydiffusion, vacancy diffusion, interstitial diffusion,diffusion flux J = M/At, Ficks first law J = -D(dC/dx), D= D0 exp(-Qd/RT)
Chapter 6
stress, strain, Youngs modulus (modulus ofelasticity), Poissons ratio, yield strength, tensilestrength, ductility, resilience, toughness, hardness
Chapter 7
slip system, slip plane, slip direction, critical resolvedshear stress, lattice strain, strengthening by grain sizereduction, solid solution hardening and strainhardening, recovery, recrystalization, Recrystalizationtemperature, grain growth, R= cosq cosl ; y = 0 +
kd-1/2
, dn
- d0n
= k t
Relate Yield strength to three
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Relate Yield strength to three
strengthening processes