Motorola Moto X XT1058 - Newegg...The Motorola Moto X XT1058 smartphone (AT&T version) features a...

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.Copyright © 2014, TechIngsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

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Product Description

The Motorola Moto X XT1058 smartphone (AT&T version) features a 4.7-in. AMOLED display with 720p (1280 x 720) resolution, 16M colors, and a multitouch capacitive touchscreen with Corning Gorilla Glass 2 overlay. It runs the Android 4.2.2 “Jelly Bean” operating system on a 1.7 GHz dual-core Qualcomm Snapdragon S4 Pro processor with 2 GB RAM. It also features 16 GB of internal memory (no microSD slot for additional storage) and two cameras. The rear-facing 10 MP BSI CMOS camera has autofocus, LED flash, and 1080p HD video capability. The front-facing 2 MP webcam also has 1080p HD video capability. Connectivity is provided by WiFi 802.11a/b/g/n/ac (2.4 GHz & 5 GHz), WiFi Mobile Hotspot, Bluetooth 4.0 + LE, EDR & A2DP, microUSB 2.0 (MDL), NFC, DLNA, FM radio, and GPS/GLONASS. Sensors include a 3-axis MEMS accelerometer & 3-axis MEMS gyroscope, 3-axis electronic compass, ambient light/proximity sensor, and preasure sensor. The Moto X XT1056 is powered by a 3.8 V, 2200 mAh Li-ion battery that provides a listed 13 hours of use time and 576 hours of standby.

Motorola Moto X XT1058Quad-Band GSM/EDGEW-CDMA/HSPA+ (850 / 900 / 1900 / 2100 MHz)LTE (700 / 850 / 1700 / 1900 / 2600 MHz)Sample Report

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Survey ReportMotorola Moto X XT1058 Sample Report

Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

Product Type SmartphoneBrand MotorolaProduct Name & Model # Moto X XT 1058Official Release Date 08/23/2013Retail Price $579.99Weight (grams) 135.5Product Dimensions (mm) 129.4 x 65.3 x 11.2

Operating System Android 4.2.2 “Jelly Bean”

Communications Quad-Band GSM/EDGE, W-CDMA/HSPA+ (850/900/1900/2100 MHz), LTE (700/850/1700/1900/2600 MHz)

Connectivity WiFi 802.11a/b/g/n/ac (2.4 GHz & 5 GHz), WiFi Mobile Hotspot, Bluetooth 4.0 + LE, EDR & A2DP, microUSB 2.0 (MHL), NFC, DLNA, FM Radio, GPS/GLONASS

Battery Life Use Time: 13 hrs.; Standby Time: 576 hrs.Processor 1.7 GHz Dual-Core Qualcomm Snapdragon S4 Pro (MSM8960; Krait 300) w/ 2 GB RAMInterface Multitouch Capacitive TouchscreenStorage Internal: 16 GB; External: N/A

Sensors 3-Axis MEMS Accelerometer & 3-Axis MEMS Gyroscope, 3-Axis Electronic Compass, Ambient Light/Proximity Semsor, Digital Barometric Pressure Sensor

Battery 3.8 V, 2200 mAh, Li-ion Display 4.7" AMOLED; 1280 x 720 Pixels; 16,777,216 Colors; Gorilla Glass 2Main Camera 10 MP BSI CMOS, Autofocus, LED Flash, 1080p HD Video CapabilitySecondary Camera 2 MP CMOS, 1080p HD Video Capability

Key Subsystems

Product Features

Product Description

Product Details



Product Details Major Components Antenna Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Pkg Ref. # PkgQty Brand Name Part Number Pkg Description Form Pin Count Length

(mm)Width(mm)

Height(mm) Die Ref # Die Qty Brand Name Part Number Description Length

(mm)Width(mm) Each Total

1 1 Qualcomm MSM8960DT Snapdragon S4 Pro Baseband / Applications Processor BGA-POP (UF) 976 14.00 14.00 0.85 1.1 1 Qualcomm HG-11-N8895-200 Snapdragon S4 ProBaseband / Applications Processor 10.10 9.11 $26.020 $26.020 2 1 SK Hynix H9TKNNBPDAR Multichip Memory - 2 GB Mobile DDR2-S4 SDRAM BGA-POP-4 (UF) 220 14.00 14.00 0.58 2.1 4 SK Hynix H5LR4D23AFRX32 Mobile DDR2-S4 SDRAM Memory - 512 MB 7.85 6.32 $1.590 $6.360

3.1 2 Toshiba EGW1 64G MLC NAND Flash Memory - 8 GB 12.90 8.80 $3.620 $7.240 3.2 1 Toshiba GAT5 Memory Controller 4.70 1.40 $0.450 $0.450 3.3 1 Toshiba GAT9 Drive Transistor 2.60 2.50 $0.410 $0.410

4 1 Qualcomm PM8921 Power Management BGA 251 7.60 7.80 0.77 4.1 1 Qualcomm HG-11-N3878-300 Power Management 6.60 6.30 $3.540 $3.540 5 1 Texas Instruments TMS320C55 Digital Signal Processor BGA 118 7.00 7.00 0.82 5.1 1 Texas Instruments F7615700 Digital Signal Processor 4.67 4.18 $2.960 $2.960 6 1 OmniVision OV660 Video Converter Flip Chip, Solder 56 4.00 4.00 0.48 6.1 1 OmniVision OV660 Video Converter 4.00 4.00 $1.110 $1.110 7 1 Cirrus Logic CS53L30 Quad-Channel Microphone ADC Flip Chip, Solder 30 2.70 2.20 0.55 7.1 1 Cirrus Logic 53L30 Quad-Channel Microphone ADC 2.70 2.20 $0.410 $0.410 8 1 NXP Semiconductor TFA9890 Audio Power Amplifier Flip Chip, Solder 49 3.40 3.00 0.50 8.1 1 NXP Semiconductor SVN10558 Audio Power Amplifier 3.40 3.00 $0.750 $0.750 9 1 Qualcomm WCD9310 Audio Codec Flip Chip, Solder 71 3.80 3.20 0.55 9.1 1 Qualcomm HG11-VP942-200 Audio Codec 3.80 3.20 $0.850 $0.850 10 1 Silego SLG46400 Programmable Mixed-Signal Array DFN 12 2.60 2.50 0.76 10.1 1 Silego PA0446400 Programmable Mixed-Signal Array 1.95 1.28 $0.250 $0.250 11 1 Silego SLG4115 ? Programmable Mixed-Signal Array DFN 12 2.60 2.50 0.76 11.1 1 Silego PA0446400 Programmable Mixed-Signal Array 1.95 1.28 $0.250 $0.250 12 1 Texas Instruments LM3556 Flash LED Driver Flip Chip, Solder 16 1.70 1.70 0.50 12.1 1 Texas Instruments LM3556 Flash LED Driver 1.70 1.70 $0.220 $0.220 13 1 AKM Semiconductor AK8963 3-Axis Electronic Compass Flip Chip, Solder 14 1.60 1.60 0.60 13.1 1 AKM Semiconductor AK8963 3-Axis Electronic Compass 1.60 1.60 $0.340 $0.340 14 1 Qualcomm WCN3680 WiFi / Bluetooth / FM Radio Flip Chip, Solder 79 3.90 3.90 0.50 14.1 1 Qualcomm HG11-VU832-300 WiFi / Bluetooth / FM Radio 3.90 3.90 $2.340 $2.340

15.1 1 TriQuint W2224A SP2T Switch 0.95 0.30 $0.060 $0.060 15.2 1 TriQuint ? W21 RF Power Amplifier 1.10 0.87 $0.190 $0.190

16 1 Silego SLG4141 ? Programmable Mixed-Signal Array DFN 12 2.60 2.50 0.76 16.1 1 Silego PA0446400 Programmable Mixed-Signal Array 1.95 1.28 $0.250 $0.250 17 1 NXP Semiconductor PN544 NFC Controller BGA 64 4.60 4.60 0.81 17.1 1 NXP Semiconductor PN544 NFC Controller 3.20 3.20 $1.260 $1.260

18.1 1 STMicroelectronics CSL28A Accelerometer MEMS Sensor 1.70 1.60 $0.910 $0.910 18.2 1 STMicroelectronics V656A Accelerometer Processor 1.70 1.20 $0.150 $0.150 18.3 1 STMicroelectronics GK14A Gyroscope MEMS Sensor 2.60 2.51 $2.150 $2.150 18.4 1 STMicroelectronics V701A Gyroscope Processor 2.55 2.55 $0.440 $0.440

19 1 Texas Instruments MSP430F5259 Mixed Signal Microcontroller BGA 80 5.00 5.00 0.87 19.1 1 Texas Instruments MSP430F5259B Mixed Signal Microcontroller 3.80 3.70 $1.560 $1.560 20 1 Qualcomm WTR1605L GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS Flip Chip, Solder 141 5.50 5.00 0.70 20.1 1 Qualcomm HG11-N3711 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS 5.50 5.00 $4.180 $4.180 21 2 RF Micro Devices RF1623 DP4T Antenna Switch QFN 14 1.60 1.60 0.50 21.1 1 RF Micro Devices M1D162301 DP4T Antenna Switch 0.70 0.60 $0.140 $0.280

22.1 1 Skyworks SC123 RF Power Amplifier 1.33 0.96 $0.370 $0.370 22.2 1 Skyworks 31093 Power Amplifier Controller 0.90 0.53 $0.050 $0.050 22.3 1 Skyworks RP1717 RF Power Amplifier 1.30 0.75 $0.280 $0.280 22.4 1 Skyworks 31531 Power Amplifier Controller 0.96 0.96 $0.110 $0.110 22.5 1 Skyworks 94030 RF Power Amplifier 1.21 0.86 $0.310 $0.310

23 1 Murata LMSWxxx ? Main Antenna Switch w/ Duplexers & Filters QFN 40 5.90 3.90 1.00 23.1 1 Peregrine C9905_8 Main Antenna Switch 1.65 1.18 $1.700 $1.700 24.1 1 Skyworks 94041_34 Bias Control 0.96 0.84 $0.090 $0.090 24.2 1 Skyworks 31087 RF Power Amplifier 0.69 0.49 $0.110 $0.110 25.1 1 Avago TK 7B RF Power Amplifier 1.05 1.04 $0.250 $0.250 25.2 1 Avago HJ5 Bias Control 0.64 0.44 $0.030 $0.030 26.1 1 Bosch Sensortec CMD173 Pressure Sensor 1.10 1.10 $0.120 $0.120 26.2 1 Bosch Sensortec 001 Signal Processor 1.40 1.00 $0.120 $0.120

27 2 AMS TSL277xx Ambient Light & Proximity Sensor DFN 6 2.00 2.00 0.60 27.1 1 AMS E2705A Ambient Light & Proximity Sensor 1.60 1.20 $0.160 $0.320 28 1 Unknown Unknown 10 MP CMOS Image Sensor COB 76 7.55 6.76 0.30 28.1 1 Unknown Unknown 10 MP CMOS Image Sensor 7.55 5.94 $3.280 $3.280 29 1 Samsung S5K5B3GX 2 MP CMOS Image Sensor COB 49 5.96 4.47 0.20 29.1 1 Samsung S5K5B3GX 2 MP CMOS Image Sensor 5.78 3.88 $1.890 $1.890 30 1 Samsung S6E3AA1X01 AMOLED Display Driver Flip Chip, Adhesive (UF) 2408 29.70 1.72 0.30 30.1 1 Samsung S6E3AA1X01 AMOLED Display Driver 29.70 1.72 $2.830 $2.830 31 1 Synaptics S5000B Capacitive Touchscreen Controller BGA 60 5.00 5.00 0.70 31.1 1 Synaptics T1324B Capacitive Touchscreen Controller 3.40 3.40 $1.250 $1.250 32 1 Infineon BGA825L6S GPS/GNSS LNA DFN 6 1.00 0.90 0.50 32.1 1 Infineon BGA825L6S GPS/GNSS LNA 0.90 0.50 $0.080 $0.080

Totals 34 5154 51 $78.12

(UF) = Underfilled

0.901 Bosch Sensortec MCP - 2 Chips 7 3.80 3.6026 BMP180 Digital Barometric Pressure Sensor

3.00 1.001 Avago

1.001 Skyworks

25 ACPM-5007 LTE Band VII Power Amplifier MCP - 2 Chips 10 3.00

MCP - 2 Chips 10 3.00 3.0024 SKY77737 LTE Band XVII Power Amplifier

5.00 1.001 Skyworks

1.001 STMicroelectronics

22 SKY77619 Multimode, Multiband Power Amplifier Module MCP - 5 Chips 42 7.00

MCP - 4 Chips 28 5.50 3.0018 LSM330D 3-Axis MEMS Accelerometer & 3-Axis MEMS Gyroscope

2.50 0.601 TriQuint

0.851 Toshiba

15 TQP887052 WiFi 802.11a/b/g/n/ac Front-End Module MCP - 2 Chips 16 2.50

BGA Stacked 4 161 13.00 11.503 THGBMAG7A2JBAIR Multichip Memory - 16 GB MLC NAND Flash, Memory Controller

Major IC Bill of Materials



Product Details Major Components AntennaMajor IC Bill of Materials Main BoardProduct Label Cost Estimation DiscussionSubsystems

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Exterior Features

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Product Details Major Components AntennaMajor IC Bill of Materials Main BoardProduct Label Cost Estimation DiscussionSubsystems

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Exterior Features



Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Cost Estimation DiscussionSubsystemsProduct Label



Product Details AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

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Major Components



Product Details AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

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Major Components



Product Details Major Components Major IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation DiscussionSubsystems

WiFi / Bluetooth GPS Rx Diversity NFCMain

Antenna




Main GPS Rx Diversity NFCWiFi / Bluetooth

Antenna




Main WiFi / Bluetooth Rx Diversity NFC

Antenna

GPS




Main WiFi / Bluetooth GPS NFCRx Diversity

Antenna




Main WiFi / Bluetooth GPS Rx Diversity

Antenna

NFC



Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Cost Estimation Discussion

Display / Touchscreen Camera - Front Camera - Rear

Brand HANRIM POSTECHPart Number EX34Type Li-ionVoltage 3.80Rating (mAh) 2200Size (mm) 81.5 x 55.5 x 3.7Vol. Energy Density (mWh/cc) 499.0Weight (grams) 37.3Wt. Energy Density (mWh/g) 224

Battery Subsystem

Battery

Subsystems




Battery Camera - Front Camera - Rear

30 - Samsung#S6E3AA1X01AMOLED Display Driver

31 - Synaptics#S5000BCapacitive Touchscreen Controller

Brand SamsungPart Number AMS465QQ01Type AMOLED w/ TouchscreenView Diagonal (inches) 4.7Colors 16777216Rows x Columns (pixels) 1280 x 720Backlight NoneDisplay Size (mm) 111.6 x 62 x 0.9Weight (grams) 13.5

Display/Touchscreen Subsystem

Subsystems

Display / Touchscreen




Battery Display / Touchscreen Camera - Rear

29 - Samsung#S5K5B3GX2 MP CMOS Image Sensor

Brand SamsungPart Number 84016172Type CMOSResolution 2 MPOptical Size (inches) 1/4Optical Zoom 1Size (mm) 6.9 x 6.9 x 5.2Weight (grams) 0.3

2 MP Camera Subsystem

Subsystems

Camera - Front




Battery Display / Touchscreen Camera - Front

28 - Unknown#Unknown10 MP CMOS Image Sensor

Brand UnknownPart Number 37C4EType CMOSResolution 10 MPOptical Size (inches) 1/2Optical Zoom 1Size (mm) 9.9 x 9.9 x 7.2Weight (grams) 1.3

10 MP Camera Subsystem

Subsystems

Camera - Rear



Product Details Major Components AntennaMajor IC Bill of Materials Exterior Features Product Label Cost Estimation DiscussionSubsystems

Side 1 IC Identification Side 2

Grid = 1 cm

Side 1

Main Board




Side 1 Side 2

3 - Toshiba#THGBMAG7A2JBAIRMultichip Memory - 16 GB MLCNAND Flash, MemoryController (4-Die Pkg.)

4 - Qualcomm#PM8921Power Management

5 - Texas Instruments#TMS320C55Digital Signal Processor

6 - OmniVision#OV660Video Converter

7 - Cirrus Logic#CS53L30Quad-Channel Microphone ADC

8 - NXP Semiconductor#TFA9890Audio Power Amplifier

9 - Qualcomm#WCD9310Audio Codec

10 - Silego#SLG46400Programmable Mixed-Signal Array

11 - Silego#SLG4115 ?Programmable Mixed-Signal Array

12 - Texas Instruments#LM3556Flash LED Driver

13 - AKM Semiconductor#AK89633-Axis Electronic Compass

14 - Qualcomm#WCN3680WiFi / Bluetooth / FM Radio

15 - TriQuint#TQP887052WiFi 802.11a/b/g/n/ac Front-End Module (2-Die Pkg.)

16 - Silego#SLG4141 ?Programmable Mixed-Signal Array

Grid = 1 cm

1 - Qualcomm#MSM8960DTSnapdragon S4 Pro Baseband / Applications Processor

2 - SK Hynix#H9TKNNBPDARMultichip Memory -2 GB Mobile DDR2-S4 SDRAM(4-Die Pkg.)

Package-on-Package

18 - STMicroelectronics#LSM330D3-Axis MEMS Accelerometer& 3-Axis MEMS Gyroscope(4-Die Pkg.)

19 - Texas Instruments#MSP430F5259Mixed Signal Microcontroller

Main Board

Side 1 IC Identification

Page 1 Page 2




Side 1 Side 2

Main Board

Side 1 IC Identification

20 - Qualcomm#WTR1605LGSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS

21 - RF Micro Devices#RF1623DP4T Antenna Switch

22 - Skyworks#SKY77619Multimode, Multiband PowerAmplifier Module (5-Die Pkg.)

23 - Murata#LMSWxxx ?Main Antenna Switch w/ Duplexers & Filters

24 - Skyworks#SKY77737LTE Band XVII Power Amplifier (2-Die Pkg.)

25 - Avago#ACPM-5007LTE Band VII Power Amplifier (2-Die Pkg.)

26 - Bosch Sensortec#BMP180Digital Barometric Pressure Sensor (2-Die Pkg.)

27 - AMS#TSL277xxAmbient Light & Proximity Sensor

32 - Infineon#BGA825L6SGPS/GNSS LNA

Grid = 1 cm

17 - NXP Semiconductor#PN544NFC Controller

Page 1 Page 2




Side 1 Side 1 IC Identification

Grid = 1 cm

Side 2

Main Board



COST ESTIMATION PROCESSOverview and Discussion

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights' philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider's knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the "right" answer for your firm's environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within 15 percent of the "right answer," which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.

Product Details Major Components AntennaMajor IC Bill of Materials Main BoardExterior Features Product Label Subsystems Cost Estimation Discussion


Motorola Moto X XT1058 - Newegg...The Motorola Moto X XT1058 smartphone (AT&T version) features a...

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