Motivation and Design Issues

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1 Motivation and Design Issues Interest in exhibiting advantage of CMOS based digital control Very low standby power feasible in PFM (low power) mode Dramatic power saving in PWM mode due to internal power management

description

Motivation and Design Issues. Interest in exhibiting advantage of CMOS based digital control Very low standby power feasible in PFM (low power) mode Dramatic power saving in PWM mode due to internal power management. SVDD. PVIN. comparator. digital controller. SW. PFM control. clk. Dc. - PowerPoint PPT Presentation

Transcript of Motivation and Design Issues

Page 1: Motivation and Design Issues

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Motivation and Design Issues

• Interest in exhibiting advantage of CMOS based digital control

• Very low standby power feasible in PFM (low power) mode

• Dramatic power saving in PWM mode due to internal power management

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System Block Diagram

•Two modes: PWM and PFM

REF

FB

SWPFMcontrol

PWMcontrol

digitaldither ring

osc.

MUX

soft start counter

ring ADC

clk

De

Dc

comparator

PVIN

PGND

MODEENSGND

SVDD

digital controller

clk

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Berkeley Switcher Specifications

Symbol

Parameter Min Typ Max Units

fsw Switching Freq 500 1500 kHz

Io,max Max Output Current 500 mA

VIN Input Voltage 2.8 5.5 V

Ilim Switch Peak Current Limit 1000 mA

ΔVADC PWM Mode ADC Quantization Bin 16 mV

ton PFM Fixed On-time 1.3 μs

NDPWM PWM Resolution 5 + 5 Bit

NDITH PWM Digital Dither Resolution 5 Bit

Tsoft-start Soft start duration 1100 μs

IPFMQuiescent current in PFM mode 3 μA

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Power Train

Problem: high input voltage vs low voltage process

Solutions: 1. Cascoded stucture2. Lateral drain extension structure

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Power Train: Cascoded Structure

Drain

VBias

VIN

Source

VOX

Gate oxide breakdown voltage ~5V

Drain

Source

VOX

VIN

Working voltage ~ 2.5V

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Power Train: LDD Structure

n well

com

pos

ite

gat

e

n well

com

pos

ite

gat

e

com

pos

ite

gat

e

com

pos

ite

gat

e p-LDD layout

n-LDD layout

0

0.3

0.6

0.9

1.2

1.5

1.8

0 2 4 6 8 10

Vgs=1.4V Vgs=2.5V

n-LDD (Ω) 0.27 0.22

p-LDD (Ω) 1.03 0.51

Rdson:

0

0.4

0.8

1.2

1.6

0 2 4 6 8 10

Measured break down voltage

I D (

mA

)

I D (

mA

)

VDS (V) VDS (V)

n-LDD: 7.5~8V p-LDD: 6.5~7.2V

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Cascoded Structure Test Results

20000

0.24

10000

0.24

PVIN

PVIN/2

GND

SW

Vgs=1.4V Vgs=2.5V

NMOS (Ω) 0.33 0.25

PMOS (Ω) 0.60 0.35

Rdson:

NMOS break down voltage: 7.7V

VDS (V)

I D (

uA

)

Rdson:

0

50

100

150

200

250

0 2 4 6 8 100

20

40

60

80

100

120

7.4 7.5 7.6 7.7 7.8 7.9 8 8.1

PMOS break down voltage: 7.9V

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Internal Power Management

20000

0.24

10000

0.24

NFET signal

PVIN

PVIN/2

GND

PFET signal

SW

Digital controller

Voltage regulator

Scavenges power from gate drive discharge

Offers safe supply voltage for controller circuitry

80A

40A

40A PWM

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Internal Voltage Regulations

• Total current consumptions: 1A

• BW of each amplifier: 40kHz

PVIN

PGND

VCext

PVIN

PGND

V/2

V/2 Cext

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Control Law

• PFM Mode (low power, low quiescent curr.)• Fixed on-time control avoids ripple jitter due to

discrete sampling of comparators at rising Vout in hyst

ctrl

• ton = 0.8 Tsw = 1.33 s Vripp,max = 90 mV @ Vin = 5.5 V,

Iout = 0.1 mA

• At high output loads, still jitter due to sampling

• PWM Mode• PID control with digital dither

• Saturated controller response (for large transients)

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PFM (Fixed On-time) Mode

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ADC and DPWM Resolution

VADC = 16 mV = 0.8% reg @ Vout = 1V

VDPWM = 5.4 mV @ Vin = 5.5 V• 5 bit ring osc + 5 bit digital dither • no limit cycling in steady state

• Sampled at fsw

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PWM Mode: DPWM Module

PWM off

VDD

VSS

5-bit Differential Ring

5-bit MUX

5

VDD

1 pair of differential signals

VDDL

Isupply

Ring-MUX Structure

Level Shifter

Dc

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Protection Mode Soft Start

• Build into digital control loop

• Disable PD control

• Make error signal slew the digital integrator

to the appropriate level corresponding to

Vout = Vref

• Gain of error signal set to effect desired

duration of soft-start sequence, tsoft-start =

1100 s

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Digital processing core

PD

Int

Comb

Logic

Dither

Fully on

Fully off

Dc_calcDe Dc

Clamp

From ringAD

C en

en

Pin: EN Soft start

counter

en Soft_start

Go to DPWM

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Ring ADC Basics

Frequency of ring oscillator has linear relation with Itot when voltage swing is below threshold:

VDD

Itot

4-stage differential ring oscillator running at sub-threshold current

bImf tot

Simulated oscillator frequency versus supply current

3.0E+06

4.0E+06

5.0E+06

6.0E+06

7.0E+06

4.E-07 5.E-07 6.E-07 7.E-07 8.E-07 9.E-07

r2=0.99991m=6.83e12b=378034

Supply Current (A)

Frequency

(H

z)

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Ring ADC Architecture

0

0

( )st T

e o reftD V V dt

Sampling freq=500kHz, LSB=16mV, approx 100mV window, VDD=1.5V

Measured current: 36.72A, area = 0.15 mm2

De’

LevelShifter

LevelShifter

CounterN

Counter1

LevelShifter

Counter1

LevelShifter

CounterN

N

N

Σ

Σ

VDD

VSS

Vo Vref

D1

D2

Analog Block

Digital Block

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PFM Mode: Comparator Details

CK

CK

CK

CK

CK

Vin

Vip

Vop

Von

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PFM Mode Quiescent Current

Simulation: 600kHz sampling frequency Comparator, ring osc., level shifters(from

ring voltage to internal VDD), and clock generation: 3μA (from PVIN/2)

Internal voltage regulators: 1.0μA(from PVIN)

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Berkeley Switcher Layout

Ring ADC

DPWM &

Clk Gen

Digi

Core

PFM ModeComparator

Power Train

Gate Drives

PFET

NFET500μm

2.6mm

1.7

mm

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Comparison between Analog and Digital Controllers

For mobile phone application:

Controller Total Quiescent Current

PFM Mode PWM Mode (not include power train)

LM2612 150A 550A

Berkeley Switcher (Simulated)

3 A

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Berkeley Switcher Pin Description

Pin Number

Pin Name Function

1 FB ADC input. Connect directly to Vout

2 REF Analog voltage reference Vref

3 MP Internal Voltage Level, mid-point of PVIN & PGND

4 MODE High for PFM mode

Low for PWM mode

5 EN Enable Input

6 PGND Power Ground

7 SW Switching Node connection to internal PFET & NFET

8 PVIN Power Supply Input to internal PFET switch

9 SVDD Signal Supply Input

10 SGND Analog and Control Ground• Taped-out in Oct 10, 2002, packaged chip returned Jan.20, 2003

• Implemented in 0.25um CMOS

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Personnel and Roles

• Prof. Seth Sanders, project leader

• Jinwen Xiao, PhD student (5th year), leadership on IC designs

• Angel Peterchev, PhD student (4rd year), leadership on architecture issues

• Kenny (Jianhui) Zhang, PhD student (2nd year), responsibility for power train design

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• Y.C. Liang, visiting Nov.2001~Sep.2002 from Natl. Univ. Singapore, for advising on power train design

• Joe Emlano for packaging the chip

Thanks To