Whistling Past the Graveyard: Why the End of Moore's Law Matters ...
Moore's law
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Transcript of Moore's law
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Moore’s Law Going Strong?
Some current and coming relevant technologies.
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Molecular chips
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Single Molecule Chips
• Chip constructed atom by atom of carefully arranged atoms
• Missing atoms in lattice determine logic• Some designs use the full molecule for
computation, some only surface level• 1000 of these fit inside conventional circuit• Much lower power per function
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Nvidia 10 teraflops processor
• Graphics chip enabling exascale computing– Very handy for brain emulation among other
things– Targeted for 2018 completion
• graphics core that can process a floating point operation using just 10 picojoules of power– Picojoules in current Fermi chips– 1000 cores
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Nanoscale light sensors
• Critical to optical interconnect of nanoscale computational components
• Connection to atom scale components– Single molecules, quantum dot interconnect
• Device < 4 nm wide• Can be tuned electrically to different color
sensitivity– Tie this to per neuron colored light signalling?
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Racetrack memory
• Shock proof permanent storage 100,000 times faster than hard disks
• Contains millions to billions of nanowires• Racetrack-equipped computers would boot up
instantly• Nearly 3 orders of magnitude less power use
than RAM, much less hard disk
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Racetrack Memory
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Graphene Transistors
• Multi-transistor functionality possible per transitor
• 10-10000 times faster than best silicon transistors
• Behavior of graphene transistor can be changed on the fly– Triple mode N, P, and neutral• Enables operation as amplifier changing frequency and
phase of signal
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Quantum Dot Memory
• 1 TB per cm2
– Extremely high density• Non-volatile
– Longer life (MTMF) than HD• Up to 1 million years!!
• > 100 faster than DRAM– < 10 ns
• Nanotube memory is contender– But apparent manufacturing problems of high yield sufficiently
pure nanotubes– Stable in vacuum and in presence of high ionizing radiation
• (great for space based systems)
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Multicore -> Many Core
• 2 – 4 cores common• 10 – 12 in pipeline• Tilera has 100-core processor– 546 gigabit per second performance
• Huge software problem– New paradigm of programming?– Automated conversion code?– May need new operating system tech
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3D chips
• Multiple layers of circuitry vertically interconnected into single chip– Vs 3D packaging which does not integrate into single device
• Heat dissipation issues– requires forced fluid cooling in denser circuits
• Benefits– Smaller footprint– Speed due to short wire lengths– 10 to 100 times less power– Potentially cheaper fabrication– Higher connectivity– Heterogeneous integration