Mont Alto Projectile Project (M.A.P.P.) BU Novel Magnetometers Flight Experiment

December 17, 2008 RockSat CDR 1

Mont Alto Projectile Project (M.A.P.P.)

BU Novel Magnetometers Flight Experiment

Penn State Mont AltoBoston University

12/17/2008

Critical Design Review


MAPP Team

Kylie Flickinger – Mechanical Engineering

Adam Kuhlman – Data Acquisition

William K. McDannell Jr. – Software

Chris Small – Strain Gauge Board

Robert Stottlemyer – Team Leader

Tim Svirbly – Test Equipment Development


BU Mag Dog Team

• Sensors – Aichi – Shawn Doria

• Sensors – Honeywell – John Gancarz

• Power – Tracy Thai

• Rabbit Controller – Andy Lee

• Mechanicals – Jim Thumber

• Software/Simulations/Analysis – TBD– Nanosat teams join after January 30


MAPP Science

The purpose of this experiment is to investigate the mechanical stresses in an elastic structure during the flight of a sounding rocket. The structure proposed consists of a circular plate, the deck plate, which is supported by four longerons, which connect in turn to circular plates at either end of the longerons simulating a payload section of previous sounding rocket flights. A dummy mass is attached to the center of the deck plate. During the flight, dynamic loads in the axial and lateral directions will cause the deck plate to deflect. The resulting deformation will be measured at selected points using strain gauges connected to electronic boards to obtain time-varying voltage signals which in turn will be digitized and stored for later analysis. The obtained data will be compared to theoretical predictions. Careful pre-flight calibration of the entire data stream will be conducted.


Novel Magnetometers Flight Experiment - Science

• Design, assemble, and test two COTS, solid state 3-axis magnetometers with controller, data storage and power: – Honeywell HMR2003 - anisotropic magneto-resistance – Aichi Micro Intelligent AMI302 - giant magneto-impedance

• Compare directly the X,Y,Z flight readings of both sensors• Measure EMI from the chips’ bias straps (Honeywell) and

bias coils (Aichi). • Honeywell device proposed for U. Colorado small satellite

design (2003). We have found no other evidence of its use in space flight.

• Aichi chip under study by US Navy for navigation of autonomous marine vehicles. We have found no record of the Aichi chip being used in space.


Subsystem RequirementsMechanical Subsystems MAPP

a)Bottom Plateb)Deck Platec)Top Plated)Longeronse)Test Weightf)Trays for Boardsg)Braces

Electrical Subsystems MAPP

a)G-Switch + Latched Relayb)Battery and Regulationc)Strain Gauge Boardsd)Strain Gaugese)Controller + A/D conversionf)Data Storage

Mechanical Subsystems BU

a)Main PCB b)Rabbit daughter boardc)Battery pack

Electrical Subsystems BU

a)G-Switch + Latched Relayb)Battery and Regulationc)Honeywell magnetometerd)Aichi magnetometere)Controller + A/D conversionf)Data Storage


Block Diagrams

Controller

Power Launch safing

Data Card

A/DHoneywell

Aichi

G-switch

Strain Gauges

Power Launch safingG-switch

ControllerA/D

Data Card

Strain Gauge

Magnetometers


Assembly Mont Alto


Test weight


Top disk


Bottom Disk


Deck plate


MAPP Strain Gauges• After testing in SolidWorks, we determined that the deck

plate would not deform enough for the strain boards that we built for the USERS program to amplify the signal enough to get meaningful data using metal strain gauges. After research, we decided to use semi-conductor strain gauges, which have a gauge factor of ~60 times that of a metal foil strain gauge. We will implement them in a configuration that would both double signal output and reduce concerns about temperature sensitivity. Using this configuration should allow us to use our boards from the USERS program with only minor changes.


Strain Gauge (Up Close)


G-Switch + Latched Relay


MAPP Controller + Memory

- Memory Needs : 12 Analog Signal Streams each digitized at ~250 samples/second to be sampled for 750 seconds at 2 bytes per sample = 4.5 Megabytes

- Data stored on a SD card inserted into Miniboard (45mm x 55 mm) - www.futurlec.com/mini_sc.shtml

standard SD or SPI communication. 3 Volt power

- Microcontroller Board – www.microchip.com/wwwproducts/devices.aspx?ddocname=en024691 Model : PIC24HJ256GP206 , 18 channels 12 bit A/D conversion at up to 500 ksps, 2-UART,2-SPI, 2-12C digital communication, 3 to 3.6 Volt power with on-chip 2.5 Volt power regulator, size 1.0”x2.2” . Programming language C

http://www.futurlec.com/mini_sc.shtml

http://www.microchip.com/wwwproducts/devices.aspx?ddocname=en024691



Special Requirements• MAPP Special Requirements

– Shift in center of mass along length axis on rocket

• BU Special Requirements– Minimize magnetic materials and fields


MAPP Commands and Sensors

- Always On – Triggered by the G-Switch- Turned off by microcontroller before splash down- 12 Analog Signal Streams each digitized at ~250 samples/second to

be sampled for 750 seconds at 2 bytes per sample = 4.5 Megabytes- Data stored on a SD card Miniboard (45mm x 55 mm) -

www.futurlec.com/mini_sc.shtml- Microcontroller Board (protopic 28) – 1.0” x 2.2” –

www.microchip.com/wwwproducts/devices.aspx?ddocname=en024691 Model : PIC24HJ256GP206 , 18 channels A/D conversion, on-chip 2.5 Volt power regulator

- Strain Gauge: Vishay or Semiconductor (to be decided)- Data Acquisition Controlled by Microcontroller initiated by power on

http://www.futurlec.com/mini_sc.shtml




MAPP Test Plans

• Mechanical Stress Distribution- SolidWorks- Thin Plate Theory- Static Force Rig (similar to the one we used for USERS)

- G-Switch and Latched Relay- Spring loaded launch in a controlled setting- Ensure compliance with no-volts requirement when integrated with power supply

- Strain Gauges- Temperature sensitivity- Circuitry and Signal Strength – simple beam test- Compare to metal foil strain gauges- Calibration

- Data Acquisition/Storage- Store and retrieve data

- All electronics: Burn in period


MAPP Timeline• By the end of fall semester (12/19/08)

– Critical design review completed– Begin ordering parts– Wrap up design phase

• Over Christmas Break (12/19/08 – 01/12/09)– Continue ordering parts– Begin planning build phase

• Beginning of Spring Semester (01/12/09)– Meet to plan build phase– Take an inventory of parts

• Between (01/12/09 – 03/15/09) Build Phase• Manufacture circuit board for data collection• Alter strain gauge boards• Manufacture testing rigs—Static force rig like we used for USERS, Spring mechanism to test G-Switch• Manufacture G-switch• Manufacture plates, longerons, alter dummy weight from USERS, braces, and housing for battery and g-switch.

• Between (3/15/09 – 4/25/09) Testing Phase• Test performance of Semiconductor Strain Gauges—Compare to metal foil strain gauges. Also test temperature drift.

– Static force rig similar to the one we used for testing for the USERS project• Test performance of G-Switch and power supply

– see that it meets launch safing no volts requirements.– Use spring mechanism to test the performance of the “ball and tube” part of the G-Switch

• Test performance of Data Acquisition unit• Burn in period for electronics

• Preliminary Integration Phase (4/25/09 – 5/3/09)• Assemble structure• Attach strain gauges to test points in structure• Integrate electronic components—manufacture wire harnesses• Have structure ready to install in can

• Finals week (5/4/09 – 5/8/09)• See you in June! Launch at Wallops


MAPP Parts List

Mechanical parts # Item Status # Item Status 4 Brace A designed 1 Test Weight Completed 4 Brace B designed 4 Trays Completed 8 Brace C designed 4 Longeron designed 1 Bottom Disk designed 1 Deck Plate designed

1 Top Disk designed

- Not at the nut and bolt level… just major hardware that will be purchased or built in house- Lead times (This can make or break a project)- Distributors- Manufacturers- Cost (Don’t forget to consider shipping and tax)


MAPP Parts list, cont.

Electronic Parts :

# Item Status

2 Strain gage board Modification needed

1 Power regulator board Modification needed

1 G-switch and associated electronics needs more design work

1 data acquisition/storage + controller needs more design work


MAPP BudgetItem Description Cost

1 4 Trays for electronic boards ( in hand ) $02 Test weight ( in hand ) $03 remaining physical structure, material $1504 controller, data storage , development $3005 Wire harness $506 PCB boards and electr. parts $2507 Payments to NSROC $08 Travel to workshop,integration,launch $15009 Contingency $500

Total Cost $2750


RockSat Payload Canister User Guide Compliance (MAPP & BU)

Mass estimate includes everything shown in slide 16 . Missing are the electronic boards ( 4 of 4”x4” ) for MA and electronic boards and battery for BU

m = 10.86 lbs (< 12.75, the heavy test mass can be reduced)

Center of mass 0.35” off axis and 1.06” below geometric center. Because electronic boards and tray for the BU experiment have not been included, the center of mass will move slightly closer to the geometric center.

Entire structure fits into a cylinder of 9” (<9.2) diameter and

9.275” (<9.4) height leaving 0.125” for washers.

Connection with 5 bolts to top and bottom bulk head , respectively, is provided.


RockSat Payload Canister User Guide Compliance– cont.

- Payload Activation

a battery , a G-switch, and shorting wires to Wallops shorting plug form a complete loop with electric current flowing only if both the G-switch and shorting plug are in closed position simultaneously. Once current is flowing a circuit consisting of a second battery (ies) and all electronic boards is activated using a solid-state latched relay and switch transistor. This second loop maintains itself even when the G-switch subsequently falls back into its open position (during ballistic flight phase).


Shared Can Logistics Plan

o Boston University (Mike Ruane)o Penn State Mont Alto (Zig Herzog)

Sharing mechanical structure but independent power supply, controller, data acquisition, and data storage. Possibility of future

sharing of these items is not excluded .


Team ManagementDr. Siegfried HerzogPenn State University at Mont Alto Assistant Professor of Mechanical Engineering 1 Campus Drive Mont Alto, PA 17237 Tel (717)-749-6209 Fax (717)-749-6069 E-Mail: [email protected]

Dr. Michael RuaneProfessor, ECE Dept., Boston University8 St. Mary's Street, Boston, MA 02215Phone: 617-353-3256 617-353-6440 faxE-Mail: [email protected]

mailto:[email protected]



MAPP Conclusions

- Lab space available- Students are nervous but excited- We have some previous experience with the USERS

program and can re-use some parts- We aim to finish by the end of April (end of the spring

semester)- Looking forward to beach time!


BU Subsystems

• Sensor 1 Aichi

• Sensor 2 Honeywell

• Power (Battery + Regulation)

• Controller– Sequencing of sensors– Data A/D conversion– Storage to SD card


BU – Aichi AMI302 MagnetometerBU – Aichi AMI302 Magnetometer• Sensing technologySensing technology

– Based on MBased on Magneto-agneto-IImpedance mpedance effect of amorphous magnetic wireeffect of amorphous magnetic wire

• Range of measurable magnetic flux density: -2 to +2 gaussRange of measurable magnetic flux density: -2 to +2 gauss• 3 sensors for length, width, and height (X, Y, Z)3 sensors for length, width, and height (X, Y, Z)• Inputs and Outputs:Inputs and Outputs:

Unit: mm

NameName I/OI/O Pin #Pin # DescriptionDescription

CSCS InputInput 1010 Chip StandbyChip Standby

CH2CH2 InputInput 99X axis / Y axis / Z axis output switchingX axis / Y axis / Z axis output switching

CH1CH1 InputInput 88

OUTOUT OutputOutput 11 Linear DC output proportional to magnetic fieldsLinear DC output proportional to magnetic fields


BUBU – Aichi AMI302 Magnetometer – Aichi AMI302 Magnetometer• Supply Voltage: -0.3 to +6.5 VDCSupply Voltage: -0.3 to +6.5 VDC• Maximum Supply Current: 200 mAMaximum Supply Current: 200 mA

– ApproximatelyApproximately 1% duty cycle on this 1% duty cycle on this peak currentpeak current

• Operating Temperature: -20 to +85°COperating Temperature: -20 to +85°C• Magnetic CharacteristicsMagnetic Characteristics

– Operating Test ConditionsOperating Test Conditions• Ambient Temperature: 25°CAmbient Temperature: 25°C• Power Supply: 3 VDCPower Supply: 3 VDC• 10 μF ceramic capacitor between Power 10 μF ceramic capacitor between Power

Supply and GroundSupply and Ground

PropertyProperty Min.Min. TypicalTypical Max.Max. UnitsUnitsOutput Offset Voltage at Zero Gauss

0.8 1.5 1.9 Volts

Sensitivity 0.16 0.24 0.38 Volts/gauss


BU - Honeywell HMC2003 BU - Honeywell HMC2003 MagnetometerMagnetometer

• Sensing technologySensing technology– Anisotropic magneto-resistanceAnisotropic magneto-resistance

• Range of measurable magnetic flux density: -2 to +2 Range of measurable magnetic flux density: -2 to +2 gaussgauss

• 3 sensors for length, width, and height (X, Y, Z)3 sensors for length, width, and height (X, Y, Z)– One output for each direction (Xout, Yout, Zout)One output for each direction (Xout, Yout, Zout)

Symbol MillimetersMax Min

A 10.92 11.94A1 2.92 3.42D 25.91 27.3e 2.41 2.67H 18.03 19.69


BU - Honeywell HMC2003 BU - Honeywell HMC2003 MagnetometerMagnetometer

• Supply Voltage: 6 to 15 VDCSupply Voltage: 6 to 15 VDC• Maximum Supply Current: 20 Maximum Supply Current: 20

mAmA• Operating Temperature: -20 to Operating Temperature: -20 to

+85°C+85°C• Magnetic CharacteristicsMagnetic Characteristics

– Operating Test ConditionsOperating Test Conditions• Ambient Temperature: 25°CAmbient Temperature: 25°C

• Power Supply: 12 VDCPower Supply: 12 VDC

• Set/Reset switching is activeSet/Reset switching is active

PropertyProperty Min.Min. TypicalTypical Max.Max. UnitsUnitsNull Field Output 2.3 2.5 2.7VoltsSensitivity 0.98 1 1.02Volts/gaussOutput Voltage 0.5 4.5Volts


BU - RCM4300 RabbitCoreBU - RCM4300 RabbitCore• 1GB of storage – mini-SD memory card1GB of storage – mini-SD memory card• Runs at 58.9MHz Runs at 58.9MHz • 20 parallel digital I/O lines 20 parallel digital I/O lines • 8 channel analog input with 12 bit resolution8 channel analog input with 12 bit resolution• Max asynchronous transfer rate =Clk (58.9MHz)/8Max asynchronous transfer rate =Clk (58.9MHz)/8• 4 PWM registers, 10 bit counter, priority interrupts4 PWM registers, 10 bit counter, priority interrupts

Input/Output:Input/Output:• 3 Inputs from Aichi - 3 Inputs from Aichi - X axis / Y axis / Z axis output from X axis / Y axis / Z axis output from

AichiAichi• 3 Inputs from Honeywell - 3 Inputs from Honeywell - X axis / Y axis / Z axis output X axis / Y axis / Z axis output

from from Honeywell Honeywell


BU - RCM4300 RabbitCore cont.BU - RCM4300 RabbitCore cont.AichiAichi• Use timer to time selection of outputs for x, y, z axesUse timer to time selection of outputs for x, y, z axes• Iterate outputs from RabbitCore to read different axes on AichiIterate outputs from RabbitCore to read different axes on Aichi• Different channels for x, y, and z axes Different channels for x, y, and z axes • Take input and pass through A/D converter from each Aichi channelTake input and pass through A/D converter from each Aichi channel• Store converted values onto SD flash memory for future useStore converted values onto SD flash memory for future use

HoneywellHoneywell• Use timer to constantly poll Honeywell for all x, y, and z axes nearly-Use timer to constantly poll Honeywell for all x, y, and z axes nearly-

simultaneouslysimultaneously• Store data from each axis on a separate place on the SD flashStore data from each axis on a separate place on the SD flash• Each axis is read from a separate output pin on Honeywell chipEach axis is read from a separate output pin on Honeywell chip• Use A/D converter to store as value and store converted value on flashUse A/D converter to store as value and store converted value on flash

Both chipsBoth chips• User timer to select which chip is off for EMI comparisonsUser timer to select which chip is off for EMI comparisons


BU – Sensor Schematics

Title

Size Document Number Rev

Date: Sheet of

BU RockSat 0002 2

RockSat BU Pay load -M. Ruane

B

1 1Friday, December 12, 2008

HMCZout

C7

CAPACITOR NON-POL

GND12VHMC

NC5NC4NC3NC2

CH1CH2

VDDACS

GN

DM

VDD

M

OU

T

GN

DA

R3RESISTOR

YTrimHMC

123456789

10111213141516171819202122232425

J1

HEADER 25

XTrimHMCZTrimHMC

VIN1

ADJ2

VOUT3

U13

LM317_K

VIN1

ADJ2

VOUT3

U14

LM317_K

AMI302 3.3V

Yout

VDC3_3VAMI

AMI302-1

D1

DIODE13

D2

DIODE13

Q12N2222

C9

CAP NP

VrefHMC

C10

CAP NP

VrefHMC

Test Header PSU

Integrator DB25S

D3DIODE13

D4DIODE13

Xout

C11

CAP NP

D5

DIODE13

D6

DIODE13

HMCSR_SET

GND12VAMI

C1CAPACITOR NON-POL

HMCBridge

C2

CAPACITOR NON-POL

VDC3_3VAMI

C3

CAPACITOR NON-POL

C4CAPACITOR NON-POL

C5CAPACITOR NON-POL

C6

CAPACITOR NON-POL

1234567891011121314151617181920212223242526272829303132333435363738394041424344454647484950

J3HEADER 50

Xout

VDC3_3VAMI

Yout

SR-1

Ztrim3 Xoff-2

Xtrim4

Yoff-5

Zout6

Xout7

Vref8

GND9

Zoff+20

Zoff-19

Xoff+18

SR+17

Yoff+16

Ytrim15

Yout14

Vbias13

Vbridge12

Vsense11

V+10

AMI302-1-Out

Zout

PWR05VHMC

HMCSR_SET

Zout

VDC12VHMC

R2

2000 ohm

SW2HMCReset

R6POT

R7POT

PWR12VHMC

HMC2003 3-AxisMagnetometer

R17RESISTOR

PWR05VHMC

3

26

7 14 5

-

+

U16

LM741/DIP8

GND12VAMI

3

26

7 14 5

-

+

U17

LM741/DIP8

GND12VHMC

3

26

7 14 5

-

+

U18

LM741/DIP8

VDC12VAMI

PWR05VHMC

R18RESISTOR

GND12VHMC

GND12VHMC

PWR05VHMC

GND12VHMC

PWR05VHMC

D7DIODE ZENER

PWR05VHMC

D8DIODE ZENER

PWR05VHMC

GND12VHMC

GND12VHMC

GND12VHMC

R11

RESISTOR

GND12VHMC

R12

RESISTOR

R13

RESISTOR

VDC3_3VAMI

R14

39K

AMI302 Axis SwitchingMagnetometer

VDC3_3VAMI

R15

39K

RCM4300 Header

R16

39K

GND12VAMI

HMCXout

HMCYout

GND12VAMI


Start at Launch

Key:H - HoneywellA - AichiM - Memory(rabbit)EMI - Electromagnetic Interference

Normal 1 H A M 5 Mins


EMI 1 ~H A M 30 Sec



EMI 2 H ~A M 30 Sec

EMI 3~H ~A M 30 Sec

Safe ~H ~A ~M End

BU - Science Experiment Timing


BU - Data Flows

• 2 sensors, 4 data sources, housekeeping• 12 b/sample on Rabbit RCM4300• Slow change in Earth’s field over flight• Changes from spin of rocket (<10 Hz)• Sample 10 pts/cycle or 100 Sa/s• Estimated flight 22.5 min or 1350 s• 135k Sa x 4 x 12b/Sa = 6.48 Mb = 0.8MB• Well within low-end SD card capacities


BU Testing Plans

• Electrical systems operation– Timing test for sequencing– DAQ test with sensors– SD card storage and retrieval

• Sensor operation– Earth field testing– Helmholz coil testing of boards

• Power operation– Charging/discharging– Voltage regulation and distribution


BU - Parts & Vendors

• Aichi AMI302 (3 on hand from Aichi; two week order time)

• Honeywell (2 on hand; distributors; 2 week order time)

• PCB fab - turnaround (5 business days)

• PCB Assembly for Aichi (10 business days)

• Rabbit Core 4300 (Dev kit on hand)

• Miscellaneous DigiKey/Newark parts


BU - RockSat Payload Canister User Guide Compliance

• Sensor PCB ~15 cm x 15 cm x 2 cm; < 150 g

• Rabbit PCB ~ 5 cm x 8 cm x 1 cm; <100 g

• Battery ~ 6 cm x 10 cm x 2 cm; <150 g

• (Easily reside in ½ canister or even ¼ height)

• Will follow G-switch and Rocket wire protocol

• Independent of MAPP system except CG


Shared Can Logistics Plan• Penn State Mont Alto

- Boston University• Each system is

independent• Structural interfacing

(PSMA)BU Cards + Batt


BU Mechanical Layout

BU Volume

M. Ruane

RockSat Student Launch – Mag Dogs, Boston University

Conceptual Use of BU Volume

SIZE FSCM NO DWG NO REV

BURS-2008-01 1.0SCA

LE1/2 : 1 14-Dec-08

SHE

ET1 OF 1

Battery volume

Rabbit uPSensors

Alternate: Trim one corner to avoidCable channel and align standoff Holes accordingly.

Top Plate

Mont Alto MAPP


BU TimelineID Task Name Duration

Dec 2008 Jan 2009 Feb 2009 Mar 2009 Apr 2009 May 2009 Jun 2009 Jul 2009

12/21 12/28 1/4 1/11 1/18 1/25 2/1 2/8 2/15 2/22 3/1 3/8 3/15 3/22 3/29 4/5 4/12 4/19 4/26 5/3 5/10 5/17 5/24 5/31 6/7 6/14 6/21 6/28 7/5 7/12 7/19 7/26

1 1dCDR Phone Conference

2 25dBench testing of circuits

3 10dPCB 1 layout

4 20dBattery and regulator bench testing

5 1dCanister arrives at MA campus

6 12dOnline Progress Report 4

7 10dPCB 1 assembly

8 10dSensor testing

9 7dSubsystem testing reports

10 10dOnline progress report 5

11 5dPCB 2 layout (if necessary)

12 10dPCB 2 assembly

13 10dSubsystem integration

14 6dSubsystem testing report

15 13dFull mission simulation DITL Testing


17 17d2nd full Mission Simulation Report


1dLaunch Readiness Review Teleconf

20

19

1dCanister Integration & Testing

2dLaunch Day

22

21

30dData Analysis and Report


BU BudgetItem Description Cost

1 Aichi AMI302 (3 in hand, one needed) $1002 Honeywell HMR2300 (2 in hand) (sensor <$100) $1003 Controller (in hand) and development board (in hand) $2504 PCB fabrication (two, possibly three cycles) $3005 PCB assembly of surface mount elements (flight board) $5006 Wire harness, connectors, miscellaneous ICs, discretes $1007 NSROC payment for launch $08 Travel for integration, launch workshop June 2009 $20009 Contingency $1000

Total Cost $4300


• BU Conclusions

– BU Mag Dogs Team is closing out its semester and catching up

to the RockSat schedule– We have an enthusiastic group of students, a lab space for work,

and a Nanosat team becoming available in January– Our experiment is building on a sensor board from USERS and

a microcontroller DAQ system


Appendices – Backup Slides


ManagementDr. Michael RuaneProfessor, ECE Dept., Boston University8 St. Mary's Street, Boston, MA 02215Phone: 617-353-3256 617-353-6440 faxE-Mail: [email protected]

Dr. Siegfried HerzogPenn State University at Mont Alto Assistant Professor of Mechanical Engineering 1 Campus Drive Mont Alto, PA 17237 Tel (717)-749-6209 Fax (717)-749-6069 E-Mail: [email protected]



Housing , Battery + G-switch


Strain Gauge Circuit


Rabbit Daughter Board


Start

Key:H - HoneywellA - AichiM - Memory(rabbit)EMI - Electromagnetic Interference

Normal 1 H A M 5 Sec


EMI 1 ~H A M .5 Sec



EMI 2 H ~A M .5 Sec

EMI 3~H ~A M .5 Sec

Safe ~H ~A ~M End

BU - Expedited & Day in the Life Testing


Brace A


Brace B


Brace C


Longeron


Tray A

Mont Alto Projectile Project (M.A.P.P.) BU Novel Magnetometers Flight Experiment

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Transcript of Mont Alto Projectile Project (M.A.P.P.) BU Novel Magnetometers Flight Experiment