Molecular Beam Epitaxy (MBE)

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Integrated Circuit (IC) Manufacture - Slicing the Silicon ingot - Fabrication of IC’s (Lithography, Sputtering, diffused junction, …) - Testing each IC on the slice - Dicing (cutting each chip out with a diamond saw) - Packaging

Transcript of Molecular Beam Epitaxy (MBE)

  • 1. GLIMPSES AJAL.A.J

2. Fabrication Equipment Molecular Beam Epitaxy (MBE) 3. Fabrication Equipment Photoresist Spinner Bake-out Ovens 4. Fabrication Equipment Mask Aligner Reactive Ion Etching (RIE) 5. Fabrication Equipment Chemical Vapor Deposition (CVD) Plasma Quest Sputter 6. Fabrication Equipment Plasma Sputter Perkin-Elmer MBE 7. Aligned Wafer-Bonding System 8. PCB Manufacture Types of PCB's single-side, double-side and multi-layer Which type to use ? (a) Circuit complexity (b) Available space (c) Cost Typical PCB insulated substrate copper connections protective covering 9. Packaging Dual Inline Package and its lead-frame Steps in Lead Frame Manufacture: (1) Cut copper strips (2) Clean in a chemical bath (3) laminate a layer of photoresist (4) Expose photoresist through mask (5) Develop and etch (6) Remove lamination (7) Plate internal regions with gold/silver Dual Inline Package and its lead-frame Steps in Lead Frame Manufacture: (1) Cut copper strips (2) Clean in a chemical bath (3) laminate a layer of photoresist (4) Expose photoresist through mask (5) Develop and etch (6) Remove lamination (7) Plate internal regions with gold/silver - Make leadframe - Die attachment (chip bonded to leadframe using epoxy) - Wire bonding (ultrasonic welding) - Encapsulation (moisture resistant coating) - Molding (plastic package) - Marking (chip number, co. name, marked on package [laser, silkscreen]) - DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars) - Leadfinishing: electroplating the leads 10. Integrated Circuit (IC) Manufacture - Slicing the Silicon ingot - Fabrication of ICs (Lithography, Sputtering, diffused junction, ) - Testing each IC on the slice [source: www.towajapan.co.jp] - Dicing (cutting each chip out with a diamond saw) - Packaging 11. Images of the CLEAN ROOM MONITORING UNIT 12. Schematic of Ion Beam Sculpting Apparatus 13. Sculpting of Nanopores: Sputtering versus Lateral Mass Transport 14. Fabrication Equipment Probe Station Scanning Electron Microscope (SEM) 15. Were all searchers nowsearch smarter, not harder ? ( AJAL.A.J ) 16. The ultimate passion of searching 17. References Carter, Ronald. Lecture 9 EE 5342 UTA Cheung, Nathan Lecture 17 EE 143 UC Berkeley http: //et.nmso.edu/ETCLASSES/vlsi/files/CRYSTAL.HTM Hastings, Alan The Art of Analog Layout, Prentice Hall, New Jersey, 2001 Campbell, Stephen A. , The Science and Engineering of Microelectronic Fabrication, Oxford University Press, New York, 2001 Alvarez, Antonio, BiCMOS Technology and Applications, Prentice Hall, New Jersey, 2001 18. The End