Mitsui Copper Foil for Package substrate...201501 500 Mitsui Copper Foil for Package substrate...
Transcript of Mitsui Copper Foil for Package substrate...201501 500 Mitsui Copper Foil for Package substrate...
201501 500
Mitsui C
opper Foil for Package substrate
パッケージ基板向け銅箔ロードマップThe Road Map of the Mitsui Copper Foil for Package Substrate
Target μm μm μm μm μm μmμm
Line/Space
Underdevelopment
MT SD-H
MT-Ex
MT-FL
MT-WA
MFG-57A
ULTTM
FSP®-329
FSP®-xxx
ナノアンカー(超微細)表面処理銅箔Nano-anchor surface copper foil
MFG-57A高エッチング性とPSRやEMC(実装時)との密着信頼性を両立。High etching property, Good adhesion between primer and PSR, EMC on assembly
FSP®-329最小限のエッチングにより微細配線形成可能Copper foil and nodule designedto minimize flash etching
Mass productionsample available
ULT超極薄シード層(<1.0μmt)により微細配線形成可能
L/S=2/2Ultimately thin copper foil material to targetL/S 2/2μm
レベルをターゲット
FSP®-xxxコブの微細化により、細線形成可能
樹脂特性向上により、高い回路密着性
Minimum nodule design and upgradedprimer resin realize high reliability forfiner pattern even below L/S=10/10
、信頼性を実現
MultiFoil®G(プライマー付銅箔)
MultiFoil®G(プライマー付銅箔)
MultiFoil®G(プライマー付銅箔)
MT-WA
TM
770307
201501 500
Mit
sui C
opper F
oil
for P
ackage s
ubstrate
MT18-FLNewly Launched the Suitable Material for Fine Pitch Pattern
・Useable for very fine pitch pattern L/S=15/15-20/20 formation by MSAP process.
粗化処理面 Surface Profile
18μm銅箔 Carrier Copper
剥離層 Releasing Layer
銅箔1.5 ~ 3μm Ultra thin Copper
Rz=2.0μm Rz=3.0μm Very Low profile GradeMT18FL
▼ Pattern plating 20μm
Low profile GradeMT18Ex
Standard GradeMT18SD-H
Rz=1.3μm
● MT18FL has an excellent balance between fine patterning and peel strength.
● Patterning example with MT-FL1.5μm by MSAP ● Etching time comparison
StandardLow Profile
Very Low Profile
MT18SD-HMT18ExMT18FL
Rz 3.0Rz 2.0Rz 1.3
1.4kN/m1.1kN/m1.1kN/m
35/35μm25/25μm
15/15~20/20μm●●
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Variations μm P/S(FR-4) Target L/Sby MSAP 1.5 2 3 5
▼ After micro etching process
▶ SEM Image L/S=15/15μm using MT-FL
0
20
40
60
80
100
SD-H Ex
100% 89% 66%%
FL
770307
201501 500
Mit
sui C
opper F
oil
for P
ackage s
ubstrate
MFG(MultiFoil®G)Seriesプライマーレジン付極薄電解銅箔Ultra Thin Copper Foil with a Primer Resin for IC Substrate
・Simplifying customers’ process for ultra fine patterning by SAP.・Reliability on various assembly process/ High heat & chemical resistance.・Compatibility with various low CTE prepregs to relieve warpage issue.
FSPⓇ-329 for SAPKey Features
SVM
・Superior fine pattern ability by MSAP. Track record for LS15/15 devices.・Higher adhesive reliability with SR without any pre-surface treatments on primer.・Reliability on various assembly process/ High heat & chemical resistance.
MFG-57A for MSAPKey Features
HVM
Structure Nodule Designsoptimized for SAP
LS10/10 pattern ability
10μm10μmCarrier foil (18μm)
Smaller typeRz:1.3μm
Larger typeRz:1.9μm
Flat bulk with uniform nodule
Special primer resin
Releasing layer 18μm
Structure Micro Nodule to enhance adhesion to Solder Resist
Carrier foil (18μm)
MFG-MTRz 1.1μm
MFG-57ARz 1.1μm
ref. MT-ExRz 2.0μm
Flat⦆bulk⦆with⦆micro⦆nodule
Special primer resin
Releasing layerSolderResist
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