MIMO Antenna Design in Thin-Film Integrated Passive Device

648 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 4, NO. 4, APRIL 2014

MIMO Antenna Design in Thin-Film IntegratedPassive Device

Tzu-Chun Tang, Student Member, IEEE, and Ken-Huang Lin, Member, IEEE

Abstract— This paper presents a novel approach to constructa multiple-input multiple-output (MIMO) antenna in a smallpackage based on integrated passive device (IPD) manufacturingtechnology. Such an IPD utilizes a thin-film glass substrate thatyields a low loss performance for RF components. A thin filmprocess with limited layers available and size considerations inIPD manufacturing pose major challenges in antenna design,especially for multiple antennas. This thin-film process resultsin a high cavity quality factor (Q) causing a narrowbandin the conventional patch antenna. To overcome this prob-lem, this paper develops antenna elements that incorporate aT-shaped coupling fed driven strip and a loop structure. Thegap between the driven strip and the loop structure functions asan internal tuning circuit, thus contributing to a lower overall Qand antenna miniaturization. The size of the proposed antennaelement is only 1.8 × 0.65 mm2 (0.031 λ0 × 0.011 λ0) in the IPDsize of 4 × 4 mm2 (0.068 λ0 × 0.068 λ0). The experimentalresults indicate that the antenna achieves a gain of 1.4 dBiand a radiation efficiency of 60% over the IEEE 802.11a band(5.15–5.825 GHz). In addition, the multiple antenna elements arearranged to construct a MIMO system. Furthermore, a goodisolation (S21 < −15 dB) is achieved using a space of only0.3 mm (0.005 λ) spacing between two antennas, resulting ina compact design and small package (4 × 4 × 0.25 mm3). Theparameters are also investigated in detail, with the experimentalresults correlating well with the simulation results.

Index Terms— Antennas in package, integrated passive device(IPD), multiple-input multiple-output (MIMO) antenna.

I. INTRODUCTION

THE increasing availability of cutting edge system-in-package (SiP) technology has led to the integration of

more wireless devices into single packages. However, theintegration of an antenna into a miniature package with otherpassive and active components still poses major challenges.Capacitors and inductors in an RFIC cannot be minimizedas much as transistors in semiconductor manufacturing tech-nology, explaining why these passive components are usuallyindependently integrated into a passive circuit chip using analternative advanced integrated passive device (IPD) semicon-ductor manufacturing technology. Recent advances in flip chipand through silicon via technology may lead to the mainstream

Manuscript received January 27, 2013; revised August 20, 2013; acceptedOctober 7, 2013. Date of publication November 1, 2013; date of currentversion March 28, 2014. This work was supported by the National ScienceCouncil under Grant NSC100-2622-E-110-001-CC1. Recommended for publi-cation by Associate Editor W.-Y. Yin upon evaluation of reviewers’ comments.

The authors are with the Department of Electrical Engineering,National Sun Yat-sen University, Kaohsiung 80424, Taiwan (e-mail:[email protected]; [email protected]).

Color versions of one or more of the figures in this paper are availableonline at http://ieeexplore.ieee.org.

Digital Object Identifier 10.1109/TCPMT.2013.2286613

applications of multichip stacking and even 3-D IC in the fieldof SiP.

Small portable wireless device requirements have createdthe need for more compact modules that include many pas-sive and active components, as well as antennas. However,incorporating an antenna into a relatively small semiconductorpackage is challenging because of its size and the need for ahigh radiating efficiency. Despite the use of low-temperaturecofired ceramic (LTCC) technology to integrate the antennaand the RF circuit in a stacked structure [1]–[5], these bulkycomponents offer low integration and consume a considerableamount of space. These antennas often require the connectionof additional matching networks to an IC device, which thenincurs an additional loss and occupies a greater area on theprinted circuit board (PCB). In addition, the LTCC technologyis limited by the nonuniform shrinkage of the metal duringfiring process, subsequently making structural control difficult.

Recent works have focused on developing IPD technologyas an alternative to the bulky discrete passive component andachieving high density components in a package because itinvolves a thinfilm processing [7]–[12]. In contrast to siliconsubstrate, IPD glass substrates are low-loss dielectrics that arepromising for microwave applications [10]. These substratesare also favorable for use in antennas to improve antennaradiation efficiency. In addition, IPD substrates can be usedas an interposer in chips stacking technology, subsequentlyallowing for low interconnect losses and flexible platforms forSiP integration and mounting on the board. Moreover, IPDtechnology offers a finer pitch and better tolerance controlthan those of PCB or LTCC technology, contributing toa high degree of miniaturization, low interconnect losses,and high density integration. Despite the considerable atten-tion paid to antenna integrating package design based onIPD technology [7]–[10], such integrated antennas are onlyused for single input single-output communication systemapplications. To the best of our knowledge, multiple-inputmultiple-output (MIMO) antennas design using IPD technol-ogy for lower bands application, especially for IEEE 802.11a(5.15–5.825 GHz) has not been developed in the openliterature.

Wireless communication systems that use MIMO technol-ogy have attracted much attention in recent years. In MIMOcommunication systems, multiple antennas are installed at thereceiver and transmitter ends to enhance the available data ratein a multipath environment. The signal capacity is improved bysending data through multiple antennas at the transmitter, thenreassembling the data at the receiver end [13]. Incorporatingmultiple antennas in the package at 5 GHz for the popular

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TANG AND LIN: MIMO ANTENNA DESIGN IN THIN-FILM IPD 649

IEEE 802.11a application remain challenging because of themutual coupling between antennas, which can significantlyaffect impedance matching, the radiation efficiency of eachantenna, and the channel capacity [14]. Ideally, two antennasshould be separated by at least a half of a wavelength tominimize coupling. However, such an arrangement is notpractical because of the limited space available for antennasin handheld devices and even the limited space available forthe package. Therefore, several decoupling methods have beenproposed [15]–[25]. Although previous works [15], [16] havedemonstrated the feasibility of using a slot on the groundto enhance isolation, such a slot design requires a largeground plane and subsequently complicates implementation ina package environment. A decoupling network between portshas been developed [17]. The isolation can be enhanced by thedecoupling network with proper circuit elements. However,this method makes a MIMO antenna more complicated andexpensive. Other works [18]–[23] have examined the feasi-bility of using a metamaterial or electromagnetic bandgapstructure to improve the isolation between antennas. Such amaterial or structure may occupy a large volume, limiting itsuse in package devices. Although other works have introduceda parasitic element between antennas to create a reverse currentpath in order to enhance isolation [24], [25], the antenna mustbe separated from the parasitic element, presenting a challengein densely packed modules.

Package integrated MIMO antennas must be small and havea good radiation efficiency, as well as a high isolation withlow envelope correlation coefficient (ECC) between antennas.This paper attempts to address the above problems by placingmultiple antennas in a package for IEEE 802.11a applica-tions with the assistance of advanced IPD manufacturingtechnology.

The rest of this paper is organized as follows. Section IIintroduces the theory and design procedure for MIMO anten-nas based on IPD manufacturing. Section III examines relatedparameters and the performance of the proposed IPD MIMOantennas. The ECC in the MIMO communication system isalso evaluated. Section IV elucidates the fabrication of theantennas and the relevant measurements. The conclusion isfinally drawn in Section V. The simulation results in this paperwere obtained using HFSS 13.0 software.

II. DESIGN OF MIMO ANTENNAS INTEGRATED

PASSIVE DEVICE

A. Antennas Integrated Passive Device Configuration

Fig. 1 shows the MIMO antennas integrated passive device(AIPD) configuration with the dimensions 4 × 4 × 0.25 mm3,which is chosen for the feasibility of package level integration.To meet implementation requirements, on board AIPD code-sign with PCB is favored over discrete AIPD design becauseof the advantage of codesign that the parasitic effects causedby the integration of the antenna and the PCB can be includedin the simulation. MIMO AIPD is located on the PCB(50 × 20 mm2) with a dielectric constant of 4.4 and a loss tan-gent of 0.02. Table I shows the material characterization of theIPD. Fig. 2 shows the cross-sectional view of MIMO AIPD.

Fig. 1. Simulation setup and configuration of the proposed MIMO AIPD.(a) System view. (b) Extended view of the system.

TABLE I

MATERIAL CHARACTERIZATION OF THE IPD

Fig. 2. Cross-sectional view of the proposed design.

In IPD design, the full area ground or signal trace shouldbe avoided because the signal trace may come into contactwith the ground trace, subsequently causing short. Therefore,the distributed signal and ground traces should be used andlocated at different layers. In this design, the metal groundis etched between the glass wafer and the first layer (l1); inaddition, the metal ground is shorted to the system groundthrough vias and wirebonds. In the ground structure design(Fig. 4), strip (L10) on the right and left sides is shortedto the system ground through the wire bond, subsequentlyproviding the current path for the antenna to improve theradiation efficiency. In this paper, a single wirebond is adoptedbecause it causes a higher antenna impedance than when usingmultiple wirebonds, resulting in easily achieved impedancematching. On the other hand, the strips (L10 and L11)establish the U shape ground that behaves like the shieldingwall for mitigating the electromagnetic interference betweenthe antenna and other components. In addition, when RFIC isplaced on the clearance between antennas, the U shape groundcan be further integrated with the shielding box that is used tocover RFIC and prevent it from electromagnetic interference.Next, the feed lines and antenna elements are etched on thefirst layer (l1), and then, the metal pads are formed on thesurface of the second layer (l2). Within this configuration, theantenna and its feed line, ground structure, and clearance forother components are distributed in a vertical alignment tointegrate conveniently with RFIC in the future.

B. Antenna Element Design

In IPD technology, a thinfilm cavity offers high Q, subse-quently increasing the difficulty of broadband antenna opera-tion. In addition, the limited number of allowable laminations


Fig. 3. Equivalent circuit of the proposed antenna.

is also the challenging constraints in complying with both theantenna miniaturization and bandwidth requirement. Tradition-ally, antenna bandwidth can often be enhanced by enlargingits physical dimension in terms of a multilayered structureor increasing the height of the substrate [26]. However,increasing the antenna dimension increases area occupancy;in addition, the height of the film is not always allowed tochange. Therefore, package level antenna design highly prior-itizes achieving antenna miniaturization while maintaining anacceptable bandwidth. In contrast to previous investigations[2]–[4] that used quarter wavelength resonant patch antennato enlarge the package size, this paper adopts the loop-basedantenna because its structure is integrated conveniently withthe ground trace during semiconductor fabrication process toensure miniaturization and improved radiation efficiency. Theproposed design approach is described as follows.

Loop antennas are resonant when the structure is aroundone wavelength using the direct fed method. However, a one-wavelength resonant antenna is too large in size for pack-age devices. Alternatively, the capacitively feeding method isdeveloped to overcome this problem. According to Fig. 3,the loop antenna fed from its open end can be viewed asthe short-circuited transmission line with the characteristicimpedance Za . When the line is electrically small to obtain aminiature antenna, the impedance is purely reactive given by

X = j Za tan βl (1)

where β is the phase constant of the transmission line and lis the length of the loop antenna.

This inductive impedance departs from the resonant condi-tion and can be compensated by adding capacitance Cc in thefeeding of the antenna with

X in = −1/(ωCC) + Za tan βl. (2)

Resonance occurs at X in = 0. Therefore, to ensure thatthe antenna is resonant at a desired miniaturized length, therequired capacitance Cc can be determined by

CC = 1/ωZa tan βl. (3)

Under this arrangement, the resonant length of the loopantenna is not necessarily to be one wavelength and thesize of the loop antenna can be minimized. Two importantparameters are used to develop the antenna miniaturizationdesign: 1) the gap (g) between the driven strip and 2) theoverall length of the loop structure. Once the reactance X isdetermined, the required capacitance Cc can be approximately

Fig. 4. Extended view of the MIMO AIPD.

calculated. Geometry of the antenna feeding structure can bedesigned [32]

Cc = ε0εeff2D

πlog(1/ sin(

πs

2D)) (4)

where D is the patch length, s is the gap width between the twoadjacent patches, and εeff is the effective dielectric constant ofthe material. Notably, tuning the gap (g) between the drivenstrip and radiating element allows us to obtain the requiredcapacitance Cc. This required capacitance to the correspondingstructure can be achieved by taking advantage of the resolutionin IPD manufacturing technology and allowing more freedomof tuning than traditional discrete components do. The finetuning process includes shrinking or enlarging the section ofthe loop area. For example, a particular capacitance Cc may berequired to match the reactance X of the loop antenna. If theloop area is modified, then the gap (g) between the driven stripand the loop antenna must be adjusted accordingly. However,antenna size typically determines its radiation efficiency.Therefore, the gap (g) and the length of the radiating elementshould be carefully designed to maintain a small antenna sizeand a good radiation efficiency simultaneously. Based on thedesign approach, Fig. 4 shows the proposed antenna configura-tion. Table II presents in detail the dimensions of the antenna.Fig. 5 shows the exploded view of the proposed MIMOAIPD. The antenna element comprises a coupling driven stripand radiating element. The radiating element is designed inthe form of a loop structure that is enclosed by L1–L4 andshorted to the ground strip (L10) through the via at the end ofthe structure. The driven strip is the T-shaped feed line and itcan be used to control the impedance matching of the antenna.In the antenna topology, the magnetic flux is generated bythe time varying conduction current on the driven strip andpenetrates the loop structure, subsequently generating effectiveinductance. The electric field across the gaps contributes to theequivalent capacitance. Thus, the induced inductance and thecapacitance resonate at the desired frequency. By designingboth the gap and the antenna structure, the antenna element


TABLE II

DIMENSION PARAMETERS OF THE PROPOSED MIMO AIPD

Fig. 5. Explored view of the MIMO AIPD.

can be miniaturized to fit the compact IPD while maintainingan acceptable bandwidth. In addition, the T-shaped stripand the gap form the internal circuit, which contributes tolower overall Q. Above efforts also contribute to realize theoperation of multiple antennas operation, as discussed in thefollowing.

Multiple antenna elements are arranged for the MIMOantenna system. As opposed to the limitations of antennadesign in the thin-film process, the thin film excites weakersurface wave along the air-dielectric surface [27], [28], indi-cating that the antenna may suffer less surface wave couplingin multiple antenna operation. However, space wave couplingis predominant in this situation. To address this problem,this paper develops a loop like structure design. The smallaperture area resulting in much lower magnetic field energycoupling and hence a good isolation can be acquired. Thetwo antennas have an edge-to-edge separation distance of0.3 mm (0.005 λ). In addition, the clearance between the twoantennas is reserved for RFIC and other components to beplaced.

With reference to Fig. 6 the proposed MIMO AIPD coversthe operation band (S11,22 < −10 dB) 5.13–5.86 GHz withS21 < −15 dB.

Fig. 6. Simulation of the S parameters.

Fig. 7. Illustration of the parameters study.

III. PERFORMANCE OF MIMO AIPD

A. Parameters Study

This section describes the antenna design and feasibility ofachieving MIMO AIPD. The proposed mechanism is analyzedby examining the coupling gap spacing between the drivenstrip and the radiating element, the loop structure area, aswell as the metal strip inside the loop. Fig. 7 shows thecorresponding structure. Here, only one of the abovementionedparameters is modified, while all remaining dimensions of theantenna structure remain the same. Distribution of the magni-tude of the current inside AIPD is also analyzed. The resultingECC in the MIMO communication system is evaluated as well.

B. Coupling Gap Between Driven Strip and Radiating Element

The antenna element can be viewed as an antiresonantcircuit around the resonant frequency. Its resonant frequencyis determined by the equivalent capacitance and inductance.The capacitance and the inductance are formed from thecorresponding geometric structure. In this paper, the electricfield across the gap contributes to the equivalent capacitance.Flexibility of capacitance adjustment can be achieved usingthe photolithography process, which yields a high patternaccuracy. According to Fig. 8, the resonant frequency isshifted toward a higher frequency as the gap increases. Thisshift is owing to the decrease of the equivalent capacitance,explaining why its corresponding resonant frequency changesaccordingly.


Fig. 8. S11 varies with the gap spacing.

Fig. 9. S11 varies with the loop areas.

C. Loop Area

Resonant frequency of the antenna is determined not onlyby the capacitance, but also by the inductance. As mentionedabove, the frequency can be tuned by altering the spacing ofthe gap. Alternatively, the loop area of the radiating elementcan also be changed. According to Fig. 9, the resonantfrequency is shifted toward a higher frequency as the looparea decreases because the loop area forms the equivalentinductance. As the loop area becomes smaller, the equivalentinductance is reduced. Therefore, the resonant frequency isshifted to higher frequencies.

D. Metal Strip Inside the Loop

The lower band operation IEEE 802.11a is more closelyexamined using an additional metal strip. Also, capacitancecan be added to reduce the size of the antenna. However, thesize of the antenna often affects its radiation efficiency, i.e.,a smaller antenna has a poorer radiation efficiency. Instead, theequivalent inductance is added using the metal strip inside theloop structure. According to Fig. 10, the impedance matchingis optimum at 5.13 GHz.

Fig. 10. S11 varies with the metal strip.

Fig. 11. Current distribution at (a) 5.2 GHz and (b) 5.825 GHz.

E. Magnitude of Current Distribution Inside AIPD

Fig. 11 plots the current distributions of the MIMO AIPDat 5.2 and 5.8 GHz, respectively. The magnitude of the currentis the greatest around the antenna and weaker around theother antenna element, resulting in good isolation. In the thin-film process, the substrate thickness leads to weak surfacewave coupling and its corresponding current magnitude decaysrapidly away from the source. In addition, the above mentionedU shape ground structure also contributes to electromagneticshielding. Under this circumstance, the induced current mag-nitude is nearly zero around the middle of the AIPD, leavingroom for the RFIC and other components, ultimately reducingthe risk of potential electromagnetic interference.

F. Evaluation of the ECC in MIMO Communication System

In MIMO communication systems, the ECC (ρe) can affectchannel capacity [29]. ECC can be calculated from the Sparameters and radiation efficiency [30]. The equation is asfollows:

ρe = ∣∣ρij

∣∣2

=∣∣∣∣∣

−S∗11S12 − S∗

21S22√

(1 − |S11|2 − |S21|2))(1 − |S22|2 − |S12|2))η1η2

∣∣∣∣∣

2

(5)

where ρij is the correlation coefficient, and η1 and η2 arethe radiation efficiencies of the first and second antennas,respectively. Fig. 12 shows that the calculated ECC is far


Fig. 12. Calculation of the ECC.

Fig. 13. Proposed MIMO AIPD. (a) Simulation. (b) Fabrication.

below the criterion of low ECC (ρe < 0.5) [31] over5.15–5.85 GHz. For example, the values of ECC at 5.2 and5.8 GHz are 0.00036 and 0.00053, respectively.

IV. IMPLEMENTATION OF THE PROPOSED MIMO AIPDAND EXPERIMENTAL RESULTS

To verify the feasibility of the design of MIMO antennasin the IPD manufacturing technology, the MIMO AIPD isimplemented and measurements are made. Figs. 13 and 14show the fabricated prototype and setup for making mea-surement. The 50- connector is connected to the otherinput port when the return loss is measured. Fig. 15 com-pares the measured (the dotted line) and simulated (thesolid line) results. The measured impedance bandwidth covers5.15–5.87 GHz. The simulation and measurement resultsslightly differ from each other probably due to the manufac-turing tolerance. Nevertheless, the closeness of the simulatedand measured frequency responses confirms that the operatingband of the fabricated antenna satisfies the design require-ment. Measurements results demonstrate the feasibility of theproposed methods. In addition, it is very compact making itfeasible for AIPD that incorporates MIMO technology.

Fig. 16 shows the gain and radiation efficiency of theMIMO AIPD. The parameters are measured over the operatingband in an anechoic chamber with one port excited and theother port connected to a 50- connector, as it is in the

Fig. 14. Measurement setup of MIMO AIPD. (a) Top view. (b) Extendedtop view. (c) Extended top view under electronic microscope.

Fig. 15. Comparison of S parameters between simulation and measurement.

Fig. 16. Comparison of antenna gain and radiation efficiency betweensimulation and measurement.

measurement of the S parameters. The measured peak gainand radiation efficiency are 1.4 dBi and 60%, respectively.The discrepancy between the measurement and simulationresults with an error tolerance of 4% in radiation efficiency


TABLE III

COMPARISON OF MEASURED SPECIFICATIONS AND SIZES BETWEEN THIS PAPER AND SEVERAL RECENT WORK IN THE LITERATURE

Fig. 17. Measurement of radiation patterns at 5.2 GHz. (a) x-z plane. (b) y-zplane.

and 0.5 dBi in gain is attributed to the SMA connector inthe measurement setup. Nevertheless, measurement resultscorrelate well with the simulation.

Figs. 17 and 18 show the measured normalized radiationpatterns at 5.2 and 5.8 GHz. The fact that the radiation ofantenna #1 is maximum toward the y-axis helps to reduce thecoupling of antenna #1 to antenna #2.

Table III compares the experimental results of the proposedMIMO antenna design using glass IPD technology with thoseof recent literature in terms of integrating the antenna intoone component [2]–[4]. According to Table III, the proposeddesign not only achieves multiple antennas operation, but alsoa much smaller package size than that of other designs. Thissignificant performance results from the novel antenna designapproach and the adoption of low loss glass IPD technologythat has a better resolution in photolithography processing,which contributes to good pattern definition accuracy and highyield than when using LTCC technologies. Owing to the smallantenna size, the radiation efficiency is smaller than that of thetraditional quarter wavelength resonant antennas. Nevertheless,the proposed design still achieves an efficiency of ∼60%,

Fig. 18. Measurement of radiation patterns at 5.8 GHz. (a) x-z plane. (b) y-zplane.

which is higher than that of typical small antennas and ismore than sufficient for practical applications.

V. CONCLUSION

This paper developed an MIMO AIPD design forIEEE 802.11a (5.15–5.85 GHz) applications. The antennaelements were realized in a small package with dimensionsof 4 × 4 × 0.25 mm3 (0.068 λ0 × 0.068 λ0 × 0.004 λ0).Without a decoupling element or network, the spacing betweenthe two antennas can be as small as 0.3 mm (0.005 λ at5.15 GHz) in a small package and the isolation meets therequirement (S21 < −15 dB). In addition, the performanceof the MIMO system was evaluated by calculating the ECC,which was lower than 0.5 in the operating bands, thus sat-isfying the requirement for a good MIMO communicationsystem. Moreover, the proposed MIMO AIPD was fabricatedand measurements were made. Experimental results closelycorresponded to the simulation results, thus demonstrating thefeasibility of the proposed method. In conclusion, the proposedmethod is highly promising for use in designing antennas tobe incorporated into packages.


ACKNOWLEDGMENT

The authors would like to thank the advancedsemiconductor engineering group for technical supportand IPD manufacturing. The authors are also grateful formany helpful discussions with Prof. L.-T. Hwang.

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[32] N. Marcuvitz, Waveguide Handbook. Lexington, MA, USA: BostonTech. Pub., 1964.

Tzu-Chun Tang (S’09) received the M.S. degreefrom the Institute of Communication Engineering,National Sun Yat-sen University, Kaohsiung, Tai-wan, in 2009, where he is currently pursuing thePh.D. degree in electrical engineering.

His current research interests include microstripantenna, antenna in package, and radio frequencycircuit design.

Ken-Huang Lin (S’90–M’93) received the B.S.degree from National Sun Yat-sen University(NSYSU), Kaohsiung, Taiwan, in 1984, the M.S.degree from National Taiwan University, Taipei,Taiwan, in 1986, and the Ph.D. degree from theUniversity of Illinois at Urbana-Champaign, Urbana,IL, USA, in 1993, all in electrical engineering.

He joined the Department of Electrical Engineer-ing, NSYSU, in 1993, and is currently a Professor.He served as the Director of the NSYSU IncubationCenter from August 2005 to July 2010. His current

research interests include radio wave propagation, antennas, wireless commu-nication, and electromagnetic compatibility.

Dr. Lin received the Young Scientist Award in the 25th General Assemblyof URSI in 1996 and was named the Advanced Semiconductor Engineering,Inc. Endowed Chair Professor in Engineering in 2012.

MIMO Antenna Design in Thin-Film Integrated Passive Device

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