Microetching composition for copper or copper alloy
2
group consisting of manganese, vanadium, titanium, and zirco- nium; placing an iron-containing anode into a second chamber of the electrochemical cell; placing a cathode into the first chamber of the electrochemical cell; passing electricity through the electro- chemical cell for a time sufficient to cause deposition of iron and hard-to-deposit metal alloy onto the cathode; allowing the deposi- tion to continue until the desired amount of deposition is achieved; stopping the flow of electricity; and removing the cathode, which has been deposited with the iron and hard-to-deposit metal alloy. METHOD OF PRODUCING A METAL SURFACE U.S. Patent 5,965,006. Oct. 12, 1999 R. Baege et al., assignors to Sulzer Orthopaedie AG, Baar, Sweden A method for manufacturing a coarsely structured metal surface of a metal implant comprising in a first step, coating the metal sur- face with an adherent, electro- chemically active protective lac- quer or coating, which can be eroded by a laser of selected wave- length at such low energy density that there is a significant energy threshold with respect to the en- ergy density required for metal erosion, to preclude metal erosion; in a further step, shooting holes into the protective lacquer using the laser of selected wavelength in accordance with spacings of the envisaged spherical cavities, di- ameters of the holes being smaller than diameters of spherically shaped cavities to be formed sub- sequently; in an additional step, exposing the surface provided with holes in the protective lac- quer to an electrically conducting liquid to produce the spherically shaped cavities over a limited time by electrochemical erosion and/or etching so that they grow simultaneously in depth and par- allel to the surface in the region of the holes; and removing the re- maining protective lacquer in a further step. MICROETCHING COMPOSITION FOR COPPERORCOPPERALLOY U.S. Patfnt 5,96~5,0036. Oct. 12, 1999 Y. Maki et al., assignors to MEC Co., Ltd., Amagasaki, Japan A microetching composition for Finishing Equipment For high quality and optimum productivity in your plating process. you need equipment you can count on. PKC is a leading supplier for all your plating requirements, from individual components tLl complete systems. we are the plating equipment specialists. * Complete plating systems l Custom design, in-house fabrication and installation l Metal and thermoplastic tanks. sinks and linings l Variety of corrosion-resistant materials l Custom rack manufacturing l \entilating systems - New or rebuild current equipment Circle 063 on reader information card PICKLEX@ One-Step Metal Preparation Formula THE BEST KEPT SECRET UNDER THE FINISH l Eliminates Rust and Corrosion Forever l Environmentally Safe l Works With Ferrous & Non-Ferrous Metals l Significantly Improves Coating Adhesion l Requires No Heating To Apply l Requires No Curing Time l Eliminates Disposal & Storage Problems www.picklex.com l-888-239-41 10 1-256-534-4146 FAX [email protected] Call for a Free Sample THE MARKETING CONNECTION, INC. HUNTSVILLE, AL Dealers Sought/Limited Territories Available See us at Powder Coating 2000, Booth 2020 Circle 080 on reader information card September 2000 115
Transcript of Microetching composition for copper or copper alloy
group consisting of manganese, vanadium, titanium, and zirco- nium; placing an iron-containing anode into a second chamber of the electrochemical cell; placing a cathode into the first chamber of the electrochemical cell; passing electricity through the electro- chemical cell for a time sufficient to cause deposition of iron and hard-to-deposit metal alloy onto the cathode; allowing the deposi- tion to continue until the desired amount of deposition is achieved; stopping the flow of electricity; and removing the cathode, which has been deposited with the iron and hard-to-deposit metal alloy.
METHOD OF PRODUCING A METAL
SURFACE
U.S. Patent 5,965,006. Oct. 12, 1999
R. Baege et al., assignors to Sulzer Orthopaedie AG, Baar, Sweden
A method for manufacturing a coarsely structured metal surface of a metal implant comprising in a first step, coating the metal sur- face with an adherent, electro- chemically active protective lac- quer or coating, which can be eroded by a laser of selected wave- length at such low energy density that there is a significant energy threshold with respect to the en- ergy density required for metal erosion, to preclude metal erosion; in a further step, shooting holes into the protective lacquer using the laser of selected wavelength in accordance with spacings of the envisaged spherical cavities, di- ameters of the holes being smaller
than diameters of spherically shaped cavities to be formed sub- sequently; in an additional step, exposing the surface provided with holes in the protective lac- quer to an electrically conducting liquid to produce the spherically shaped cavities over a limited time by electrochemical erosion and/or etching so that they grow simultaneously in depth and par- allel to the surface in the region of the holes; and removing the re- maining protective lacquer in a further step.
MICROETCHING COMPOSITION FOR COPPERORCOPPERALLOY
U.S. Patfnt 5,96~5,0036. Oct. 12, 1999 Y. Maki et al., assignors to MEC Co., Ltd., Amagasaki, Japan
A microetching composition for
Finishing Equipment For high quality and optimum productivity in your plating process. you need equipment you can count on. PKC is a leading supplier for all your plating requirements, from individual components tLl complete systems. we are the plating equipment specialists.
* Complete plating systems l Custom design, in-house fabrication
and installation l Metal and thermoplastic tanks.
sinks and linings l Variety of corrosion-resistant materials l Custom rack manufacturing l \entilating systems - New or rebuild current
equipment
Circle 063 on reader information card
PICKLEX@ One-Step Metal Preparation Formula
THE BEST KEPT SECRET UNDER THE FINISH
l Eliminates Rust and Corrosion Forever l Environmentally Safe l Works With Ferrous & Non-Ferrous Metals l Significantly Improves Coating Adhesion l Requires No Heating To Apply l Requires No Curing Time l Eliminates Disposal & Storage Problems
www.picklex.com l-888-239-41 10
1-256-534-4146 FAX
Call for a Free Sample THE MARKETING CONNECTION, INC.
HUNTSVILLE, AL
Dealers Sought/Limited Territories Available
See us at Powder Coating 2000, Booth 2020
Circle 080 on reader information card
September 2000 115
copper or copper alloys compris- ing an oxidizing agent, which can oxidize the copper or copper alloy and is selected from cupric ion source compounds; an organic acid or an inorganic acid; a halide ion source compound; a polymer compound, which contains poly- amine or polyimine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight; and water.
PROCESS FOR TREATING TINNED
SURFACES
U.S. Patent 5,965,205. Oct. 12, 1999 M. Yoshida, assignor to Henkel Corp., Gulph Mills, Pa.
A process for treating a tinned metal surface in order to form a corrosion-protective, paint-adher- ent coating comprising bringing
the metal surface being treated into contact with an aqueous liq- uid coat-forming composition hav- ing a pH of not more than 6.0 and comprising water and 0.5 to 30 parts by weight of phosphate ions; 0.1 to 10 parts by eight of con- densed phosphate ions; and 0.1 to 20 parts by weight of water- soluble polymer molecules.
HOT-DIP COATING APPARATUS
U.S. Patent 5,965,210. Oct. 12, 1999 M. Tada et al., assignors to Kawasaki Steel Corp., Hyogo, and Mitsubishi Heavy Industries, Ltd., Tokyo
A hot-dip coating method in which a steel strip is coated as it is fed upwardly through a slit in a bottom of a coating tank, the im- provement comprising making a
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flow velocity of the molten metal uniform across a breadth of the strip by directing the molten metal through a flow restricting buffer as the molten metal enters the coating tank at the inlets.
ELECTROLESS COPPER PLATING
SOLUTION
U.S. Patent 5,965,211. Oct. 12, 1999 K. Kondo et al., assignors to Nippondenso Co., Ltd., Kariya, Japan
A process for formation of a cop- per plating film, which comprises immersing a material to be plated in an electroless copper plating solution of copper ions; a reducing agent; a pH-adjusting agent; a tri- alkanolmonoamine or a salt thereof in an amount sufficient to act as a complexing agent and ac-
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