Micro mechatronics 1 - HKA
Transcript of Micro mechatronics 1 - HKA
Micro mechatronics 1part 2.2: substrates
manufacturing technologies
Prof. Fritz J. NeffDirector of the Laboratory for Micro mechatronics and Hybrid integrated thick film circuitSat the University of AppliedSciences Karlsruhe (FH), 16. August 2004
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 2
Manufacturing of ceramic substrates
finishing(Laser cutting or polishing)
99% of the parts are used "as fired"
sintering (fireing)(thermal treatment at 60% up to 75% of absolute melting temperature)
Al2O3 at about 1650°C
preparation of sintering processtake away organic pollutions and fixing agents, Temp. (150°C)<< max.
forming(green tape)
mechanical dressing(milling, mixing, granulating + additives)
(paste)
natural and synthetic raw materials(powder)
Green tapes
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 3
Preparation of the mass
milling, mixing, granulating, adding specialcompuonds
99,6% Al2O3 and 0,4% of additivesresult in best surfaces for thinfilm technology
Al2O3 SiO2MgO,CaO
96% + 4% glass
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 4
Realizing the dimensions
Determining of - length, - width,- thickness,- additional special
geometrics- bores.
Nominal thickness + 17%
cutting and boring
drying
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 5
Sintering / fireing
High purity compounds are treated by crushing, milling, granlating, reducing to dust that the result aregranularities between 1µm and 500µm
forming by hot pressing, pressure sintering, compressing by explosion, extruding and powder rolling
Sintering in box type furnaces (muffel) or continuousheat-treating furnaces
Process of tightening by adhesion of the particles, neck groove binding between the particles and tighteninguntil nearly all pores are closed
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 6
Sintering of preformed green tapes
Temperature-time-diagram: Al2O3-ceramics
Process timeh3 12 21
1600
400
°C
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 7
Characteristics of the substrates
Selection betweenAl2O3-, AlN- and BeO-ceramicsaccording to therequirements and also the costs areplaying an important ruleglasses
Thermal conductivity λ and dielectric constante ε
1 6 8 10 20 40 60 80ε0.01
0.1
1
10
100
1000
λW/mK
2
BeO
AIN
Al2O3
Polymere
Polymer laminated metal substrates
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 8
Geometric characteristics
Importantinfluence into thequality of thescreen printingprocess:- line width,- line hight,- sharpness of
edges.
dh
convexity f
f = h - d
DIN 86
Zulässig sind 0.1 mm Durchbiegung auf 25 mm Meßstrecke
surfae profile of substrates
Rautiefe Ra
Länge/µm200 400 600 800
1
2
3
4
5Ra/µm
DIN 86
3 Gruppen bzg. des Mittenrauwertes:
Gruppe 1: 0,8 bis 1,5 µm Gruppe 2: 0,5 bis 0,8 µm Gruppe 3: 0,25 bis 0,5 µm
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 9
Characteristics of technical ceramics
hohe Wärmeleitfähigkeit λ kleine Dielektrizitätszahl
hohe Biegefestigkeit
geringe Oberflächenrauhigkeit
hoher spezifischer elektrischer Widerstand
chemische Resistenz gegenüber verwendeten Pasten
temperaturbeständig gegenüber hohen Prozesstemperaturen
Umweltverträglich, weiterverwendbar, wiederverwertbar
Gleicher thermischer Ausdehnungskoeffizient wie die verwendeten Pasten und Bauelemente
geringe Kosten
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 10
Defects in surfaces of ceramicsubstrates
/acc. to Reichl and Bosch/
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 11
LTCCLow Temperature Co-fired Ceramics
Support of green tapeswith about s=50µm
(Green Tapes)
Support of green tapeswith about s=50µm
(Green Tapes)
Termal treatment at about 150°C
Termal treatment at about 150°C
Punching of vias with about20 Hz
thermal vias d=300µmel. vias 150µm<d<200µm
Punching of vias with about20 Hz
thermal vias d=300µmel. vias 150µm<d<200µm
Filling of the vias(Viafilldruck)
Filling of the vias(Viafilldruck)
Printing of conductorlines
100<b<150µm
Printing of conductorlines
100<b<150µm
Piling up4 up to 6 layers
Piling up4 up to 6 layers
Sintering at 950°C, 0,1 N/mm² up to
0,2 N/mm²
Sintering at 950°C, 0,1 N/mm² up to
0,2 N/mm²
further technologiesfurther technologies
Termal treatment 150°C,Reduction in z-direction about
30%
Termal treatment 150°C,Reduction in z-direction about
30%
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 12
handling of green tapes
green tape fromHeraeusTyp CT700
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 13
Manu-facturing of microhybrids
Keramikfolie
• punching of vias•Filling the vias•Printing the coductors
ajusting, piling upsintering
cutting
printing, fireing /BLU97/ mounting, bonding
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 14
LTCC – fine line
Widerstände
Thermische Vias
Ag mit Au-PlatingChip & Wire
Thermische Vias
Abdeckglass Widerstand
Ag
thermal Vias diameter / screen 300µm / 550µmfunctional Vias diameter / screen 130µm / 260µmConductor line (innen) width / screen 130µm / 260µmConductor line (außen) width / screen 130µm / 260µmsurface Plating NiPdAuBondpad 160µm x 360µm, screen 260µmResistor on rearside
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 15
Inner Layers of LTCC
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 16
Microhybride
Multi-layer
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 17
Technology of LTCC-Process
F
Pressure p = ca. 1,3 N/mm²and 950°C over more than12 Stundenvertical contraction about30%, in x- and y-dimension must be 0%
z
x
y
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 18
Substrate carrier GT1
Substrate carrier without (left) and with (right) Al2O3-substrate, 484 bores made by laser with diametrs of 200µm for low pressure
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 19
inside LTCC
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 20
rearside of LTCCwith resistors
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 21
Manufacturing steps of LTCC-substrate
Lot size of substrates
Screen printing conductor-lines on front side
fireing
Test of conductors
Screen printingovercoat
Fireing of resistorsand overcoat
Laser trimming
Scratching withdiamond
Optical inspection100%
Further steps of SMT-
Screen printing conductor-lines on rear side
Screen printing resistorson rear side
fireing
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 22/BLU97/
Developement of AntiBreakSystem
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 23
Developement of Motronic
/BLU97/
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 24
Requirements to the substrates
Carrying all printed layers,Chemical compatibility with all layers/pastes,Carying all SMD,Mechanical bonding of some elements,Functional (electrical, fluidic) bonding of some elements,High thermal conductivity,Coefficient of expansion should be the same like that of connected films and elementsOptimal peak-to-valley-hightHigh bending strengthProtection of all elements mounted on the surface,Respecting integration in Sensor-Actuator-System
Prof. Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 25
What did we learn?
Important materials for industrial used ceramicsubstrates?Difference between materials for constructionand materials for functionalities?What is causing different peak-to-valley-hightson the surface of the substrates?Manufacturing steps for ceramic substrates?Difference between sintering and fireing?Characteristics of the substrates and defects?