Metrology and Failure Analysis for 3D IC Integration IC integration – Process control and failure...
Transcript of Metrology and Failure Analysis for 3D IC Integration IC integration – Process control and failure...
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Metrology and Failure Analysis for 3D IC Integration
Ehrenfried Zschech,Fraunhofer IZFP DresdenFraunhofer Cluster Nanoanalysis Dresden, Germany
Alain Diebold,CNSE at the University at Albany/NY, USA
Grenoble, 26 May 2011
www.nanoanalysis.fraunhofer.de
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3D IC integration – Process control and failure analysisSc
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130nm
90nm
65nm
45nm
32nm
22nm
Beyond CMOS
Functional Diversification: More than Moore
Analog/RF Passives HV Power SensorsActuators
BiochipsFluidics
InformationProcessing
Digital content &System-on-Chip
(SoC)
Interacting with people and environment
Non-digital content & System-in-Package (SiP)
Combining SoC and SiP: Higher Value Systems
From International Technology Roadmap for Semiconductors: http://www.itrs.net
New processes and new materials
New processes and new materials requirenew solutions for process development,
process control and failure analysis.
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Tier 1Thickness ~ 10’s of umActive Face Down
Tier 1Thickness ~ 10’s of umActive Face Down
Tier 1 FEOLThickness ~ 1’s of um
Tier 1 FEOLThickness ~ 1’s of um
BackSide MetalWidth ~ 1’s of umPitch ~ 10’s of um
BackSide MetalWidth ~ 1’s of umPitch ~ 10’s of um
u-BumpSize ~ 10’s of umPitch ~ 10’s of um
u-BumpSize ~ 10’s of umPitch ~ 10’s of um
UnderfillGap ~ low 10’s of um
UnderfillGap ~ low 10’s of um
Tier 2Thickness ~ 100 umActive Face Down
Tier 2Thickness ~ 100 umActive Face Down
Tier 2 FEOLThickness ~ 1’s of um
Tier 2 FEOLThickness ~ 1’s of um
Package SubstrateThickness ~ 100’s of umPackage Substrate
Thickness ~ 100’s of um
UnderfillGap ~ hi 10’s of um
UnderfillGap ~ hi 10’s of um
Integrated Heterogeneous 2-Die Stack
Tier 1 : CMOS Logic SoCTSV (connect frontside to backside)Very thin Wafer (manage TSV aspect ratio)Active face down
Interface µ-BumpBackside RDL Metal (interface to µBumpand/or routing to allow offset of µBump vs TSV)µ-Bump (Tier to Tier interconnect)Very thin underfill
Tier 2 : Commercial Die Memory or Analog die, or…Frontside Metal (interface to µBump)Active face down & Pretty Thin
Flip Chip (C4) BumpRegular flip chip bumpRegular underfill
PackageRegular PCB substrateRegular plastic moldingRegular Package BGA Bump
3D TSV scheme
~ mm
Flip Chip BumpSize ~ <100 umPitch ~ 100 um
Flip Chip BumpSize ~ <100 umPitch ~ 100 um
TSVSize ~ 1’s of umPitch ~ 10’s of um
TSVSize ~ 1’s of umPitch ~ 10’s of um
Qualcomm Inc
Courtesy: R. Radojcic, Qualcomm
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Contents
Process control / Metrology
Quality control / Failure analysis
Stress engineering
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Contents
Process control / Metrology
Quality control / Failure analysis
Stress engineering
© Fraunhofer IZFP-D
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3D IC Integration: Process control/metrology needs (1)
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TSV processTSV pitch and TSV CD (top & bottom) TSV depth: within wafer and wafer-to-wafer uniformityTSV etch profile: sidewall angle (top and bottom), via bottom profile(curvature)Sidewall oxide liner thicknessMetal barrier dep: thickness uniformity, step coverageCu ECD fill (filling defects: voids)Cu ECD overburdenpost-CMP topography
Microbump processMicrobump quality
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3D IC Integration: Process control/metrology needs (2)
Wafer bondingWafer thicknessWafer bonding quality: bond strenght, voids/micro-voids, hermeticity, …Overlay metrology: wafer-to-wafer alignment, bond alignment
DefectsDefects: critical vs. non-critical defects (etch defects, wafer edge defects, particles, scratches, …)Delamination…
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Analytical techniques for process control
RequirementsFull-wafer (for wafer-level 3D IC)NondestructiveNo particle generationHigh throughputHigh technique reliability and tool uptimeEasy to use (operators, no physicists!)…
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Analytical techniques for process control
In-line techniques (nondestructive)
Scanning acoustic microscopyIR microscopy…
Lab-based techniques
X-sectioning of samples (e. g. FIB) + SEM imagingScanning acoustic microscopy
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Analytical techniques for process control
In-line techniques (nondestructive)
Scanning acoustic microscopyIR microscopy…
Talks Alain Diebold (Tue + Wed)
Lab-based techniques
X-sectioning of samples (e. g. FIB) + SEM imagingScanning acoustic microscopy
Today
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3D TSV process control: Target sample preparation
Focused Ion Beamis the method of choice for site specificpreparation
Restrictions of standard FIB :large quantities of materials to be milled
precise, but too slow (> 2…10 hours depending on geometry)
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3D TSV process control: Fast sample preparation (work in progress)
Approaches for rapid X-sectioning:
1. increase of milling rate using chemical enhancement (for Si removal) and high current FIB
2. new plasma sources for FIB milling
3. laser ablation prior to high-rate FIB polishing
Reduction of preparationtime (approaches 2 and 3): ~ 5 hours ~ 0.5 hours
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Selected TSV Process Control Requirements
Monitoring of via etch process (depth, taper, ...)
H
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Selected TSV Process Control Requirements
Monitoring of sidewall and bottom oxide/barrier (thickness, uniformity,...)
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Selected TSV Process Control Requirements
Monitoring of fill material (voids, grain structure, impurities ....)
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FIB ChannelingContrast
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Selected TSV Process Control Requirements
Monitoring of via-via-interconnections (IMC formation and distribution)
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Contents
Process control / Metrology
Quality control / Failure analysis
Stress engineering
© Fraunhofer IZFP-D
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3D IC Integration: Quality engineering / failure analysis needs
Liner/barrier coverage/homogeneity ( leakage)TSV incomplete fill / voidsAdhesion/delaminationStress ( CPI, Si cracks, Cu extrusion/„pop-up“)
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Analytical techniques for failure analysis
Requirements
Full-wafer or samples Non-destructive or destructiveReasonable throughput Reasonable technique reliability and tool uptime…
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Analytical technique for failure analysis
In-line techniques (nondestructive)
Scanning acoustic microscopyIR microscopy (?)…
Lab-based techniques
Nano-XCT + subsequent X-sectioning (z. B. FIB) + SEM imaging…
© Fraunhofer IZFP-D
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Analytical technique for failure analysis
In-line techniques (nondestructive)
Scanning acoustic microscopyIR microscopy (?)…
Talks Alain Diebold (Tue + Wed)
Lab-based techniques
Nano-XCT + subsequent X-sectioning (z. B. FIB) + SEM imaging…
Today
© Fraunhofer IZFP-D
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Xradia NanoXCT: Lab based X-ray microscopy
Laboratory X-ray SourceCu target (8 keV) orCr target (5.4 keV)
Energy Filter
Condenser(light gathering optic)
Sample
Objective(zone plate)
X-ray CameraZernike phase ring
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Courtesy: Xradia Inc.
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Xradia nanoXCT @ Fraunhofer IZFP Dresden
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X-ray tube
Collimator specimen lens
XRADIA nCT100
imaging system
about 30 motors
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Zone plate’s key parameters
Zone plate (X-ray lense) consists of concentric rings (zones) with zone width decreasing with radius
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Interference principle of Huygens and Fresnel: Delay of the light in different regions, strong chromatic aberration.
Number of zones > 100 requiredfor good focusing
Resolution is proportional to the width of the outermost (smallest) zone.
Outermost (smallest) zone widthdetermines resolution and NA
(current limit: ~ 30nm, A/R ~ 30)
SEM image of a zone plate and its zone profile
E. Zschech, W. Yun, G. Schneider, Appl. Phys. A 92, 423 – 429 (2008)Courtesy: Xradia Inc.
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Limits of zone plates: ~ 30 nm structures
Grating height: 1600nm
Grating bar width: 100nm
Zone plates are fabricated out of high-Z (typically gold) material using electron beam lithography, reactive ion etching and electroplating.
Focusing efficiencies 10-30% currently achievable (depends on A/R).
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E. Zschech, W. Yun, G. Schneider, Appl. Phys. A 92, 423 – 429 (2008)Courtesy: Xradia Inc.
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TSV sample preparation for nano X-ray tomography
Prepreparation (e. g. with laser ablation) +Focused Ion Beam
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Process development: nanoXCT analysis of TSVs
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Failure localization in TSVs: Large filling defects
Cooperation with Lay Wai Kong, College of Nanoscale Science and Engineering at the University at Albany/NY
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Flat samples: Laminography with tilted axis
Johann Radon
Back projection possible based on projections of different angles
Rotation of sample or X-ray source
Reconstruction of 3D data, e.g. by filtered back projection
Acquisition geometry depends on sample shape
cylindrical samples: normal CT
flat samples: Laminography, typical artifacts
NEW!
CT Limited angle CL CL with tilted axis
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X-ray microscope – setup
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X-ray microscope
Real optical imaging using the simplest microscope
dedicatedsample stage
(xyz-Θ)Source Condenser X-ray lens Detection system
1500 mm
Laminography
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Sample tilt
Condenser
PinholeSample
Wedge Rotation stage
FZP
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X-ray computed laminography study of TSVs
Comparison for equal measurement time
Limited Angle CT CT with tilted rotational axis
Better image quality (contrast)
Less artifacts at the bottom of the TSV
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Xray tomography at TSV sample: < 100nm voids visible
Cavity
Position of the surface
single void
Average over 10 Slices
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FIB X-section of TSV after XCT study
SEM nanoXCT
Cavity
Void chain
Curved bottom
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Contents
Process control / Metrology
Quality control / Failure analysis
Stress engineering
© Fraunhofer IZFP-D
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TSV performance and reliability risks
TSV extrusion and de-lamination- P. Ho, RTI 3D Symposium 2009
Expansion
Contraction
• Reliability Via material,diameter
Barrier layermaterial
Insulation liner material andthickness
TSV array pitch, height
• Mobility change
- Radial tension- Circumferential
compression
∆T > 0
∆T < 0
Performance shifting after wafer thinning - QCT/IMEC, DATE 2009
Silicon crystalorientation, P/N
© Fraunhofer IZFP-D
Courtesy: Xiaopeng Xu, Synopsys
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Cu TSV extrusions – Quantitative analysis
4um TSV5um TSV
© Fraunhofer IZFP-D
After 225C annealing for 24 hrs in pure
Nitrogen
27.2µm
Reference line for Bottom of TSV
Reference line for top of TSV
29.1µm
After 225C annealing for 24 hrs in pure
Nitrogen
32µm
25.6µm
Both 4 and 5um TSV show Copper is extruded and with de‐lamination at the wallCooperation with Lay Wai Kong, College of Nanoscale Science and Engineering at the University at Albany/NY
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Stress-induced reliability-limiting effects
Example: Cu extrusion / “pop-up”
o Reasons:
o Shear stress (depends on geometry, process flow (thermal cycles)and materials (E, CTE values)
o Adhesion (sidewall)
o Nano-XCT is a potential technique to study this effect nondestructively (region of interest not destroyed)
Systematic quantitative analysis possible
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Summary
3D TSV integration (new processes and materials) requires
advanced techniques for process control / metrologyTime-to-data has to be reduced for X-sectioning techniques
Plasma FIB, Laser ablation + FIB, …
advanced techniques for quality control / failure analysisTime-to-data has to be reduced for nanoXCT
Improved X-ray sources, optics and detectors
Improved data analysis strategies ( Discrete tomography)
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AcknowledgementDresden Fraunhofer Cluster Nanoanalysis (www.nanoanalysis.fraunhofer.de)Peter Krueger, Sven Niese
Dresden Microscopy Innovation Center (FhG IZFP-D + Carl Zeiss NTS)Bernd Köhler, Rüdiger Rosenkranz, Yvonne Ritz
CNSE at the University at Albany/NYLay Wai Kong
Xradia Inc., Concord/CAKevin Fahey, Jeff Gelb
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