Mems technologies and analysis of merits and demerits

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Transcript of Mems technologies and analysis of merits and demerits

  1. 1. MEMS TECHNOLOGIES AND ANALYSIS OF MERITS AND DEMERITS THEREOF - BIPRASISH RAY (2015H123031G)
  2. 2. CONTENTS INTRODUCTION FABRICATION PROCESS FABRICATION TECHNIQUE APPLICATIONS ADVANTAGES AND DISADVANTAGES CONCLUSION FUTURE SCOPE
  3. 3. WHAT IS MEMS? MEMS stands for MICROELECTROMECHANICAL SYSTEMS
  4. 4. MMicro: Small size, micro fabricated structures. E Electro: Electrical signal control. MMechanical: Mechanical functionality. S Systems: Structures, Devices, System Controls. MEMS devices generally range in size from 20 micrometers to a millimeter
  5. 5. COMPONENTS OF MEMS DEVICE MICROACTUATORS AND MICROSENSORS FORM THE MOST IMPORTANT COMPONENTS OF A MEMS DEVICE. N S EW 2 Axis Magnetic Sensor 2 Axis Accelerometer Light Intensity Sensor Humidity Sensor Pressure Sensor Temperature Sensor
  6. 6. FABRICATION OF MEMS Deposition Patterning Etching Physical Chemical Lithography Dry Wet Photolithography
  7. 7. PACKAGING: o Metal can package o Plastic package o Ceramic package
  8. 8. FABRICATION TECHNIQUE The fabrication technique of MEMS devices is called Micromachining or Microfabrication. The fabrication of MEMS evolved from the process technology in semiconductor device fabrication. Two basic methods of MEMS integration are: Surface Micromachining Bulk Micromachining
  9. 9. SURFACE MICROMACHINING In surface micromachining, the MEMS sensors are formed on top of the wafer using deposited thin film materials. The surface micromachined sensors use the capacitive transduction method to convert the input mechanical signal to the equivalent electrical signal. One of the most important processing steps that is required of dynamic MEMS devices is the selective removal of an underlying film, referred to as a sacrificial layer, without attacking an overlaying film, referred to as the structural layer, used to create the mechanical parts. Enables low cost accelerometers.
  10. 10. BULK MICROMACHINING Bulk micromachining is an extension of IC technology for the fabrication of 3D structures. The whole thickness of a silicon wafer is used for building the micro-mechanical structures. The transduction mechanism that has been widely used is the piezoresistive effect. In piezoresistive materials, a change in the stress causes a strain and a corresponding change in the resistance. Enables high performance microactuators and microsensors.
  11. 11. APPLICATIONS OF MEMS
  12. 12. APPLICATIONS OF MEMS
  13. 13. ADVANTAGES AND DISADVANTAGES Minimize energy and materials. Improved reproducibility. Improved sensitivity, accuracy and reliability Low cost and low power. Easier to alter the parts of a device as compared to its macro counterpart. Farm establishment requires huge investments. Polysilicon is a brittle material. Design includes very much complex procedures.
  14. 14. CONCLUSION This enabling technology promises to create entirely new categories of products. MEMS will be the indispensible factor in advancing technology. As with all emerging technologies had been predicted to revolutionize technology and our lives.
  15. 15. FUTURE SCOPE In order to avoid the need for a multitude of wires, such sensors must be self sustaining and able to communicate wirelessly. As a result, not only more sensors are needed, but also small energy generating modules and wireless transmission components. Clearly, the increased numbers of devices will drive size reduction which in turn will enable higher levels of integration. This prediction combined with the foregoing discussion on the advantages of MEMS over macro devices lead us to predict that MEMS will soon be integrated into our everyday life just as the computers have been.