MEMS-Based Systems Solutions Review and Overview … · MEMS-Based Systems Solutions Review and...
Transcript of MEMS-Based Systems Solutions Review and Overview … · MEMS-Based Systems Solutions Review and...
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MEMS-Based Systems Solutions
Review and Overview
with a
Focus on Current and Emerging Applications
Roger Grace
Roger Grace Associates
Microtech 2011
June 16, 2011
Boston, Massachusetts
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Outline• Definition
• Functional Requirements
• Situational Analysis
• Commercialization Report Card
• Drivers for Adoption
• Research Methodology
• Case Studies
• Critical Success Factors
• Commercialization Opportunities
• Summary and Conclusions
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Attention
This is a business strategy/commercialization/ applications
presentation that has been created to validate that there are great
opportunities to create wealth and serve society vis-à-vis MEMS-
Based Systems Solutions/Smart Systems Integration NOW.
Carpe diem!!!!
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Roger Grace Associates Overview• Founded in 1982,a pioneer in the MEMS strategic marketing and analysis
sector
• Clients include the “who’s who” of industrial and government organizations
worldwide
• Headquartered in Naples, Florida/ San Francisco, California
• Focus on MEMS/Semiconductors and Capital Equipment
• Capabilities include
– Custom market research
– Market strategy development
– M&A due diligence
– Integrated marketing communications
• Promotion
• Positioning and Branding
• New product launches
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Definition• Traditional “MEMS” and “MST” are not typically systems…they are
in fact devices
• “MEMS-Based System Solutions” (MBSS) are an integration of
MEMS-based sensors/actuators/structures with other functionalities
e.g. signal processing, networking delivered in a package and
optimized for a customer application/solution “(R. Grace)
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MEMS-Based Systems Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Design for Manufacturing and Test
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
FUNCTIONS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•BatteryFUNCTIONS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
FUNCTIONS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
FUNCTIONS
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
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MEMS-Based System Solutions
MEMS FRONT
END
•Sensor(s)
•Actuator(s)
•Structure(s)
SIGNAL
CONDITIONING
ELECTRONICS
•ASICs
•DSP
•Microcontroller
POWER/CONTROL
ELECTRONICS
•Energy Harvesting
•Battery
BACK END
•COMMUNICATIONS
ELECTRONICS
•Wireless
•Non-wireless
•Networked
Design for Manufacturing and Test
Co-Design
Systems Engineering
FUNCTIONS
DESIGN
PRINCIPLES
PACKAGING/INTERCONNECTS
Monolithic/Heterogeneous
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SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
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SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
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SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
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SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10
R&D A A A A A A- A- A- A- A- B+ B
Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C
Market Research C B- B- B- B B B+ B- B B B B+
Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-
Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+
Industry Association INC INC INC B B+ B+ B+ B B B+ B B
Standards INC INC INC INC C B- B- B- C+ C C C
Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B
Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D
Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+
Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-
Profitability C- C- C- C- C- C- C- C C+ C C- D+
Employment INC INC INC INC INC C C C+ C+ C+ C C-
Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+
Overall Grade B B B- B- C+ C+
MEMS COMMERCIALIZATION REPORT CARD
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Situational Analysis• Design for manufacture and test and infrastructure development are
key elements for the successful commercialization of MBSS
• Both of these “grades” have progress favorably from their 1998
levels
• With the commoditization of many MEMS sensors for autos and
games, companies have learned to optimize their design for high
volume manufacture just to keep competitive (Darwinian)
• There is sufficient infrastructure in place with good history from a
device supplier, signal conditioning supplier, software developers,
wafer foundries and a host of packaging strategies including wafer
scale and chip stacking to create a low barrier to entry for potential
suppliers
• Companies owning unique IP for MEMS devices are realizing that
in-house vertical integration / value add significantly increases profit
margin e.g. HP, Polychromix(Thermo-Fisher)
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Drivers for Adoption• Broad availability of commoditized devices
• Novel implementations of unique sensors/actuators/structures
• Need for product differentiation
• Commercial availability of low cost signal conditioning/ processing/
memory…ASICs ,DSPs, Flash, E2PROM
• Evolution of wafer level packaging /TSV/films
• Desire to maximize value added and maximize profit margin
• Continuous price reduction of MBSS components
• Relatively low barrier to entry for prospective suppliers
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Research Methodology• In-person and telephone interviews
• Conducted in the November 2009 to August 2010 time frame
including visits to:
– Photonics West-San Francisco California-Jan. 2010
– Pittcon-Orlando, Florida-Feb. 2010
– American Chemical Society-Boston, MA-Aug. 2010
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Tire Pressure Monitor• Supplier: Schrader Electronics
• System comprised of custom designed
piezoresistive pressure sensor,
custom design ASIC with
microcontroller core,OTS motion
sensor, RF chip and antenna, Lithium
ion battery on a PC board in a plastic
package mounted in valve stem
• Key specs
– -40 to 125 degree C temp range
– 500-600 r.p.m. rotation
– 1000’s of g’s
– Lifetime of 150,000 mi./ 6-10 yrs.
• First introduced in 1995
• Volume production >40Million units in
2009
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Navigation System(AHRS)• Supplier: Crossbow
Technologies, California
• (Outsourced OTS gyros/accels
and custom DSP (Kallman
filtering,flash,E2 memory)
• Significant algorithm
development effort/major
defensible IP
• Custom package minimizes
shock and vibration effects
• Application: Attitude heading
and reference System (AHRS)
for private aircraft
• Introduced in 1995
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Gesture Recognition Controller
• Supplier: Movea, California
US/France/China(mfg.)
• Founded in 1989 as Gyration
• Outsources OTS. 3-axis gyros, 3-
axis ,accelerometers ,ASICs,
microcontrollers
• Market sectors served:– Sports and fitness( “virtual coach” for
swimming, running, yoga)
– Healthcare and wellness (range of
motion analyzer)
– Consumer pointing (computer mice, TV
controllers
– “65 market sectors for pointing
products”
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Human-Machine Interface Device• Supplier: Hillcrest Labs,
Maryland US
• Outsourced OTS 3- axis
accelerometers,1/2 axis
gyros,32- bit DSP and other
ICs
• In-house proprietary
algorithm development
• Board size 0.9 x 0.9 in.
• Full production in 2004
• Applications include hand-
held air pointing cursor
control for TVs and games
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Toy• Supplier: MEMSIC,
Massachusetts US
• In-house monolithic thermally
activated two-axis
accel,amplifier,A/D
converter,heater control
circuit,temp. comp.,trimming
fuse,and I2C digital interface
• OTS microcontroller with
programmable interface and
memory, battery, LEDs, plastic
wand package
• Strong co-design effort
• Featured at 2008 Olympics
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Micro Gas Chromatograph
SAW LIGA-GC PP-PC
BYPASS SAW
SAMPLE IN
OUT TO PUMP
2-WAY
VALVE
• Supplier: Defiant Systems,
New Mexico ,US
• In-house development of
critical components…collector,
column , SAW detector
• Key specs:
• Size 5.25x7.5x2.25 in.
• Weight 1.6 lbs.
• Battery life 4 hrs /9v
• RS 232 interface
• Applications include nerve
agent detection, pesticide
detection, EPA regulatory
monitoring
• Status: in devel./early proto.
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Micro Gas Chromatograph• Supplier: University of
Michigan-Wireless Integrated
Microsystems Center (WIMS),
Michigan ,US
• Part of NSF/ERC Center
founded in 2000
• Platform strategy features low
loss ASICs and wireless IC
• Applications include
environmental monitoring,
homeland security, food
processing, bio markers
• Expected to reach
commercialization by 2015
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Inertial Measurement Unit (IMU)• Supplier: MilliSensor Systems and
Actuators, Massachusetts USA
• Monolithic IMU with six
accelerometers(two accelerometers
per axis) and three gyros(each with a
single degree of freedom)
• Measures six degrees of freedom
• Gyro bias stability:20-100 degree/hr.
• Accelerometer bias stability: 0.5-1.0
mg
• Application focus currently is for
military guidance and navigation
systems
• Currently under development
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Seismic Platform• Supplier: HP, California/Oregon ,US
• In-house design of high performance two-
axis accelerometer, battery, power
management chip,
microcontroller,memory, wireless
chip,housing/package…”measurement
engine”
• Key specs:
– < 50 mw./axis power
– < 100 ng /square root hertz
– >130 dB dynamic range
– 0-250 Hz BW
– 7 mm. x 7 mm. die/package
• Current application massive distributed
sensing array for land-based oil and gas
exploration (Shell),future applications
include structural and machine health
condition monitoring
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H.P. – Shell Oil/Gas Exploration
MEMS
Accelerometer
Chip
Node
Wireless Mesh Network
System Development and Management
“In-Field” Data Storage
Imaging and Printing Group
Pro curve
Enterprise Business
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FTIR Spectrometer• Supplier: Block Engineering
• Hand-held Fourier-Transform
• Spectrometer..”Chem Pen”
• Uses Sandia National Labs
SUMMiT V process for the
MEMS
• Currently funded through DOD
R$D…$6 M US
• Projected availability in 2013
• Large volume pricing of $1000
• Applications include chemical
warfare agent detection,
environmental monitoring,
hazardous materials analysis
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Micro Gas Chromatograph• Supplier: Thermo-Fisher
(formerly c2v..Netherlands)
• MEMS engine
• Introduced 2009
• Applications include process
control petrochemical analysis
• Currently part of a rack
mounted solution with plans for
miniaturization to a hand held
instrument
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NIR Spectrometer• Supplier: Thermo-Fisher
Scientific (formerly
Polychromix)
• MEMS engine license from
MIT
• Sandia National Laboratory
license of SUMMiT IV process
• Introduced Fall 2009
• Totally self contained hand-
held measurement system
including display, power
supply, application algorithms,
• Selling price of $15 K to $20 K
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NIR Spectrometer• OEM Spectrometer Engine and
Anavo Portable NIR Analyzer
• System consists of a tunable
laser based spectrometer,
integrated wavelength and
amplitude reference, extended
range photodetector, and control
and processing electronics
– Portable NIR system also
includes a diffuse reflectance
sample interface and LCD screen
with on board libraries for
Qualitative ID or Quantitative
measurement
• Key Specifications
– SNR of 5500:1
– 3cm-1 Resolution
– Millisecond measurement speed
– 1300-1800nm Wavelength range
34Courtesy Axsun Technologies
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Telecom Optical Channel Monitor• MEMs Tunable Compact Optical
Spectrum Analyzer (OSA)
• System consists of a tunable Filter
with integrated Photodiode and
Wavelength Reference, and control
and processing electronics
– Scans through Dense Wavelength
Division Multiplexed Laser Channels
and reports Optical Power,
Wavelength and SNR
• Key Specifications
– Covers C or L Bands or 1 module
covers C+L (1520-1610nm)
– High Spectral Resolution (< 1pm)
and Dynamic Range (30dB)
– Compatible with 10Gb/s, 40Gb/s
and 100Gb/s and advanced
modulation techniques
– 25 Year Life
• More than 30,000 shipped
– > 400 Million device hours of
operation35
Courtesy Axsun Technologies
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Wireless Sensor Node for Structural
Analysis• Investigator: Univ.of Michigan
(Prof. Gerry Lynch)
• Supported by US NIST for
bridges and DOD for structural
ship hull monitoring
• Current implementation uses
off the shelf accelerometers
and strain gages
• Currently deployed on many
bridges in the US and US
Navy ship
• Research areas include chip
stacking, energy harvestesr,
low loss CMOS circuitry and
wireless transmitters
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Swept Laser Engines for Optical Imaging• OEM Tunable Laser Engines for
Optical Coherence Tomography
(OCT)
• System consists of a wide band
tunable laser, Interferometer and
Balanced Detection, with
Associated Control, Processing and
high-speed Data Acquisition
Electronics
• Key Specifications
– SNR of 105 dB
– 100nm Tuning Range
– 1310nm or 1060nm Wavelength
– Up to 100kHz tuning speed
– Long coherence length for deep
imaging
• Applications in Ocular imaging,
Coronary Artery imaging, Cancer
Detection, Endoscopy, etc.
37
Swept
Laser5
95
Delay
50/50
K-Clock
(to DAQ)
Interferometer
signal (to DAQ)
From Sample Arm
From Ref. Arm
Sweep Trigger
(to DAQ)
Laser Output
50/5050/50
From power
tap
Optional Safety
Shutdown Circuit
Axsun Swept Source OCT Engine
Balanced
Detector
OCT Retina Image OCT Anterior Chamber Image
Lens
Iris
Cornea
Courtesy Axsun Technologies
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Leverage Analysis Company Product MEMS
Device
Device
Cost
Solution
Cost (BOM)
Selling
Price
Leverage
Ratio
H.P. Seismic
Sensor
Accel. $60. N/A N/A Immense!!!
Thermo-
Fisher
NIR
Spectro
meter
Optical
mirror
$100 $1350 $17,000 170:1
Thermo-
Fisher
Micro GC Microfluidic
chip
$150 $1500 $25,000 166:1
Axsun NIR Spectro
meter
Optical
mirror
$135 $1700 $16,000 118:1
Hillcrest
Labs
Motion
analyzer
Accels.
Gyros
$10 $25 $75 7.5
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Business Case• Many MEMS/MST devices have become commoditized over the
past couple of years…accelerometers, microphones, pressure
sensors
• Smart Systems Solutions offers a “way out” of this fighting for
market share and continuously declining prices and gross margin
• Value added to the basic front end vis-à-vis
intelligence/communication/packaging is a solution
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RECENT / CURRENT DEALS
Company
Acquired
Product Acquiring
Company
Acquisition Price Date
Polychromix FT-IR Spectrometer Thermo Fisher $28 million Q-2,2010
c2v Microfluidic
Chromatograph
Thermo Fisher Undisclosed Q-1,2010
AMS MEMS Foundry Plures Technologies Undisclosed Q-4, 2010
Jyve Location and activity –
based solutions
Fairchild
Semiconductor
Undisclosed Q-4, 2010
Verreon Glass-based technologies
/ displays
Qualcom $5 million Q-2, 2010
Crossbow MEMSIC MEMS Modules $18 million Q-4, 2009
Kionix Rohm Accelerometers Undisclosed Q-4, 2009
Silicon Clocks Silicon Labs Oscillators Undisclosed Q-2, 2010
Akustica Microphones Bosch Undisclosed Q-3, 2009
HandyLabs Microfluidic Systems Becton Dickinson Undisclosed Q-4, 2009
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DEAL STRATEGY
• The big question….Go IPO???? or sell to strategic partner????
• Predominance of acquisition approach over IPO in past
• Limited number of IPO’s to date– MEMSIC
– MEMSCAP (France)
– Microvision
• Acquired companies get 3.0-3.5 X multiple on sales (typically)…e.g.
Ahura/Thermo Fisher
• However companies have been acquired pre-revenue…e.g. Verreon
• Are we seeing another “feeding frenzy” on acquiring companies who can
support the portable electronics business similar to the optical telecom
scenario????
• Next possible deal…Invensense?
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PROGNOSTICATIONS
(next 12 months)
• Venture capital will continue to be elusive:
– Worldwide economic status remains uncertain
– Limited number of new startups
– Possible failure to fund advanced rounds
– Industrial funding partners will continue to make strategic
investments/acquisitions…e.g. CardioMEMS …keep your eyes and ears tuned
for some other upcoming news!
– Limited number of IPOs…e.g. Invensense…will it go?
• Recent increased M&A activity e.g. Kionix, Akustica, LV Sensors, Sunion, Miradia,
HandyLabs, Polychromix, c2v, TI / Attleboro MA, …??????
• 2011 market to grow at 17-19 % over 2010 (sales)
• Continued participation of traditional semi players in the market
• Wafer scale packaging/chip stacking and TSV continue their widespread adoption
• Higher value added/systems solution approach adoption
– Establish product differentiation/competitive advantage
– Minimize commoditization
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Critical Success Factors
• Availability of commoditized front ends e.g. inertial sensors
• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,
Spectrometers
• Selection of the right ASIC/DSP partner
• Software/algorithm application development expertise
• Adoption of Co-Design principles
• Packaging/connectivity and test expertise
• Adopt lessons learned from successful implementations e.g.
Polychromix,C2V (both recently acquired by Thermo
Fisher))…”those that forget the past are condemned to relive
it”…George Santayana, Age of Reason (1916-1918)
• and most importantly…”think outside the chip”
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Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially
monolithic functionality
• The commoditization of MEMS e.g. inertial and pressure sensors has enabled
system solutions in a variety of high volume consumer products
• The emergence of low cost integration of smart systems in the photonics and
microfluidics sectors will enable a new set of industrial, medical and consumer
applications
• There are currently numerous and significant success stories to establish the
feasibility of the proposed business models
– Commoditized front ends with proprietary software and packaging
– Enabling front ends integrated into systems and packages
• We expect to see a proliferation of the “systems solutions” approach in the
immediate future since they bring numerous benefits to their users including:
enhanced robustness and faster time to market while providing the suppliers with
extended leverage of their technology and higher product differentiation and
maximized gross margins.
• Think “blue ocean” versus “red ocean” strategies
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Critical Success Factors
• Availability of commoditized front ends e.g. inertial sensors
• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,
Spectrometers
• Selection of the right ASIC/DSP partner
• Software development expertise
• Adoption of Co-Design principles
• Packaging/connectivity and test expertise
• Adopt lessons learned from successful implementations e.g.
Polychromix,C2V…”those that forget the past are condemned to
relive it”…George Santayana, Age of Reason (1916-1918)
• and most importantly…”think outside the chip”
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Commercialization Opportunities
• Point of care diagnostics(bio/inertial)
• Portable micro analytical systems(chem/bio)
– Environmental monitoring
– In-situ process control and monitoring
– Homeland security/military threat monitoring
– “Non-lab” medical analysis
• Wireless autonomous systems (inertial/temp./pressure)
– Structural/machine health monitoring
• Navigation/guidance/motion(inertial)
– Smart munitions
– Toys/games
– Medical
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Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially
monolithic functionality
• The commoditization of MEMS e.g. inertial and pressure sensors has enabled
system solutions in a variety of high volume consumer products
• The emergence of low cost integrated MEMS-based solutions in the photonics and
microfluidics sectors will enable a new set of industrial, medical and consumer
applications
• There are currenntly numerous and significant success stories to establish the
feasibility of the proposed business models
– Commoditized front ends with proprietary software and packaging
– Enabling front ends integrated into systems and packages
• We expect to see a proliferation of the “systems solutions” approach in the
immediate future since they bring numerous benefits to their users including:
enhanced robustness and faster time to market while providing the suppliers with
extended leverage of their technology and higher product differentiation and
maximized gross margins.
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References• R. Grace, MEMS/MST Based Systems Solutions:Think Outside the
Chip, ST News, Nov. 2009, www.rgrace.com
• R. Grace, Thinking Outside the Chip: MEMS-Based Systems
Solutions, Small Times, Nov./Dec. 2008, www.rgrace.com
• R. Grace, MEMS Based Systems Solutions: Thinking Outside the
Chip, Euro-Asia Semiconductor, Dec. 2008/Jan. 2009,
www.rgrace.com
• R. Grace, Thinking Outside the Chip for MEMS Design Success,
Electronic Products, Feb. 2010, www.rgrace.com
• R. Grace, Think Outside the Chip, Embedded Systems Design, May
25, 2010, www.rgrace.com
• S. Senturia, MEMS Enabled Products: A Growing Market Segment,
www.polychromix.com
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Upcoming Conferences of Interest
MEMS Industry Group (MIG) Executive Congress,
Monterey CA, Nov.2-3, 2011
www.memsindustrygroup.com
Sensor Tech Forum
Boston MA, Oct. 10-12, 2011
www.sensortechfoprum.com
Smart Systems Integration Conference
Zurich Switzerland, March 20-21, 2012
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Acknowledgements• Polychromix
• Schrader
• Hillcrest Labs
• HP
• University of Michigan- Wireless Integrated MicroSystems Center
(WIMS)
• MEMSIC
• Movea
• Defiant Technologies
• Fraunhofer Chemnitz ENAS
• Crossbow Technologies
• Integrated Sensing and Systems (ISSYS)
• Millisensor Systems and Actuators (MSSA)
• C2V
• Boston Micromachines
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.
• THANK YOU / DANKE / MERCI / HSIEH
HSIEH / SHOKRUN / GRAZIE /
OBRIGADO / EFHARISTOU/GRACIAS