MEMS and Sensors Update, Russel Shumway, Mar 5 2015
Transcript of MEMS and Sensors Update, Russel Shumway, Mar 5 2015
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MEMS and Sensor Packaging UpMarch 2015
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MEMS and Sensor Experience
1980s 1990s 2000 2002 2005 2008 2009 2011
CCD
Sensor
Ceramic/
Hermetic
PackageCABGA, MLF,
Fingerprint, SOIC, DLP
Cavity MEMS, In-Frame
MLF, Cavity SOIC
Laminate to
Laminate
F
S
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Growth and Adoption of Automotive MEMS SThe role of government regulations in the MEMS market
1970’s 1980’s 1990’s 2000’s 2010’s
Fuel Economy
Improvements
Airbags
Tire Pressure
Monitoring
Electronic
Stability
Control
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Rapid Growth in Consumer MEMS
<2004 2004 2007 2009 2010 2012 2013 2
Color Inkjet
Nintendo Wii
iPhone
iPhone 3GS
iPhone 4 Samsung S4/iPhone 5S
Samsung S3 Samsu
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MEMS Packaging Challenge
Controlling stresses to theMEMS structure
Allowing the stimuli to
reach the MEMS structure
Protecting the MEMS and
ASIC devices
More stringent devicepackage protection
Customized requirements
Quick turn
Highly reu
packaging
Miniaturiza
Automotive Market ConsumGeneral Requirements
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MEMS and Sensor Packaging Requirem
A c c e l / G y r o
M a g n e t i c
M i c r o p h o n e
T e m p e r a t u r e
/ H u m i d i t y
P r e s s u r e /
A l t i m e t e r
G a s
G e s t u r e
I R
Wafer Handling Capped Wafer Handling √ √
Stealth Dicing √ √
Stimulus Delivery
Package Port Hole (Top) √ √ √ √ √ √
Package Port Hole
(Bottom) √
Die Attach Options
Low Modulus DA √ √ √ √
Thermal DA √
Low CTE Substrates √ √ √ √ √ √
Multi Die-Stacked √ √ √ √ √ √ √ √
Multi Die-SBS √ √ √ √ √ √ √ √
Flipstack √ √ √ √ √ √ √ √
Multi Sensor √ √ √ √ √ √ √ √
Interconnect Options
Wirebond √ √ √ √ √ √ √ √
Au Stud Bump √
Flip chip √
TSV * √ √ √ √ √ √ √ √
Copper Pillar + COW √ √ √ √ √ √ √
*TSV, TGV is at foundry level.
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MEMS and Sensor Packaging Requirem
A c c e l / G y r o
M a g n e t i c
M i c r o p h o n e
T
e m p e r a t u r e
H u m i d i t y
P r e s s u r e /
A l t i m e t e r
G a s
G e s t u r e
I R
Package Protection
Overmolded Leadframe √ √
Overmolded Laminate √ √
Lidded Package √ √ √ √ √ √
Lidded + Molded
Package √ √ √ √ √ √
Bio-compatible Lid
Exposed Die √ √ √
Non-Ferromagnetic √
Port Hole Filter √ √ √
EMI Shielding √
Cavity Fill / Die Coat
Black Die Coating √
Clear Die Mold √
Gel Fill √ √ √
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MEMS Packaging Complexity
Overmolded or Cavity Package?
Wirebond or f
Die attach material?
E
Laminate or leadframe?
Wire type, loop radius
and gauge?
Molded-in stress?
Leaded or not?
Stacked die or
How/what
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MEMS/Sensor
PerformancePackage Type
Molded MLF ®
Molded
ChipArray ® LGA
Cavity MLF ®
Cavity Ceramic/Hermetic
Good
Better
Best
Packaging Technology is a Differentiator
Cavity MLF ®
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Materials Help Manage Die Stress
From material datasheets From simulation results
0
500
1000
1500
2000
2500
Epoxy - C Film Epoxy - NC Silicone1 Silicone2
M o d u l u s - M P a
Die Attach Adhesives
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
FR5 Ceramic FR5
S
1 P r i n c i p a l S t r e s s - M P a
Substrate Thickness/Mat
Thin
Thick
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Focusing on Cavity Package
Standard on the outside,custom on the inside
Sensor fusion ready, multiple
MEMS/sensor dice
Multiple stimuli opening/ports
Low stress bill of materials
Applicable to leadframes and
laminates
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MEMS Package Variants by Platform
Overmolded Exposed Die Surface CavitySOIC
MLF®/QFN
ChipArray®
LGA/BGA
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MEMS and Sensor Standard Platforms
*Not compatible
Accelerometers
GyroscopesMagnetometers
OvermoldedPackaging
ChipArray® BGAMLF®
Dual
Cavity
PackagingHermetic/CeramicCavityLaminate/LF Cavity
Wafer LevelPackage
MicrophonePressure Sensors
OvermoldedPackaging
ChipArray ® BGAMLF ®
Dual
Cavity
PackagingCeramic CavityLaminate Cavity
Wafer LevelPackage
Temperature &Humidity Sensors
OvermoldedPackaging
ChipArray ® BGAMLF ®
Dual
Cavity
PackagingCeramic CavityLaminate CavityExposed Die Surface
Wafer LevelPackage
Bio-metricBio-medical
OvermoldedPackaging
ChipArray ® BGAMLF ®
Dual
Cavity
PackagingLaminate or LF CavityCeramic CavityExposed Die Surface
Wafer LevelPackage
MicrobolometersDisplays
OvermoldedPackaging
ChipArray ® BGAMLF ®
Dual
Cavity
PackagingLaminate or LF CavityCeramic CavityExposed Die Surface
Wafer LevelPackage
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Amkor Technology P3 Site for Cavity ME
In High Volume since 2008
Utilizes Amkor’s Strip based AssemblyTechnology and Infrastructure
Provides a platform for near stress freedevice environment
Leverages over 20 years of Amkor MEMSProduction Experience
Dedicated Area for Particle Control
(MEMS Microphones) Wide Customer Base supporting both
Consumer and Automotive
Over 500M units shipped since 2008
Full Turnkey Assembly + Test Capability
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MEMS Microphone – “Listening / Sound Se
Strong growth in MEMS
microphones driven by
new applications – Noise cancellation
– Audio and video
conferencing
– High quality recording
– Gesture Control
Introduced FlipChip
Microphones
Bottom Port – W/B
Top Port Rev
Botto
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Typical Cavity MEMS Process Flow
Lid Attach Cure
Laser marking
PKG Saw
ASIC Die Attach
ASIC WBG / SAW
Cure
MEMS Die Attach
Cure
Wire Bond
MEMS Wafer Saw
Lid Attach
Die Coat (Optional)
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Reversible Top Port Process Flow
Lid Attach Cure
Laser marking
PKG Saw
ASIC Die Attach
ASIC WBG / SAW
Cure
MEMS Die Attach
Cure
Wire Bond
MEMS
Wafer
Saw
Lid Attach
Die Coat (Optional)
Cavity Wall +Cover Attach
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Multi-Die Integration – Sensor FusionCavity packages allow integration opportunities
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MEMS Environmental sensors are
driving new applications
– Weather measurement
– Altitude navigation
– Personal navigation
Gas sensor integration is indevelopment
Sensor Fusion – Environmental Sensors
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Temperature, Humidity, FingerPrint, Opti
Fingerprint sensor for biometric recognition
– An open cavity is created using film assistmolding technology
– In high volume since the early 2000’s
Extending film assist molding technology to
other sensors – temperature, humidity and
optical – Optical / IR sensors
Gesture recognition
Ambient light sensor
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MEMS and Sensor Material/Process Roa2013 2014 2015
Wafer Handling
• Stealth Dicing HVM
• Capped Wafer Backgrinding DEV HVM
Substrate/LF
• Low Modulus Substrate DEV HVM
• Embedded Component DEV HVM
• Embedded ASIC Die DEV HVM
• Pre-Mold LeadFrame DEV HVM
• Pre-Mold Laminate DEV HVM
Die Attach
• Low Modulus Die Attach Film DEV HVM
• Printable/B-Stage Epoxy DEV
• Port Hole Filter DEV
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MEMS and Sensor Material/Process Roa2013 2014 2015
Die Coat/Gel Fill
• Clear Mold DEV HVM
Lid Material
• Polymer Lid DEV HVM
• Plated Polymer Lid DEV HVM
• Flangeless Metal Lid DEV HVM
• Transparent Lid DEV
Lid Attach Material
• Solder Printing/Dispensing DEV DEV HVM
• Metal Paste DEV HVM
• B-Stage Epoxy DEV HVM
Singulation
• Laser Singulation DEV HVM
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Material Development
Polymer Lid Status
– Cost effective material solution for existing metal lid – Chemical surface activation for polymer plating
– MEMS microphone and Optical MEMS Lid material
Waterproof Membrane
– IPx7 waterproof requirement (1meter/30min)
– Acceptable level acoustic sensitivity compared withexisting u-Phone
– Flexible membrane between MEMS die & substrate
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Cavity MEMS Products
MEMS Package Thickness Trend
< 2013
N o m
i n a l P a c k a g e T h i c k n e s s
> 1.0 mm
> 0.8 mm
> 0.6 mm
> 0.5 mm
20152014
> 1.2 mm
*Highly Dependent o
Sensor Type and Per
Molded MLF and CABGA
Wafer Level
Ceramic or Low CTE Subst
MEMS P k Pl tf R d
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MEMS Package Platform Roadmap
Die Level StressHigh
Low
P a c k a g e C o s t
High
Overmolded Dual,
MLF and CABGA
Platforms
Exposed Die Film
Assisted Dual,
MLF and CABGA
Platforms
Pre-Mold Cavity and
Lidded Dual, MLF and
CABGA Platforms
Strategic Platforms
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MEMS Package – Next Generation
Cavity Package Hybrid Cavity Pack
MLF®/QFN
ChipArray®
BGA
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MEMS Next Generation Package – Lead
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MEMS Next Generation Package - Lami
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MEMS Next Generation Package – Silicon In
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Intelligently combine data from several sensors for the pu
improving application or system performance
Expected to fan-out across all types applications
Next Challenge
Sensor Fusion = Test Confusion?
In Summary
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In Summary
MEMS Sensor Market is Growing… – Wide array of consumer application driven by “smart devices
– The automotive MEMS sensor market continues to grow withmandates on safety, efficiency, and driver assistance
Standard Platforms = Faster development / introduction oMEMS / sensors
Amkor offers differentiating Package Technology
– Dedicated MEMS Team – Constantly updating the MEMS Toolbox with investments on
equipment and materials and leveraging other core technoloTSV, Cu Pillar
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Thank You for your continued Bus