Memory/SoC World ATE Markets - Computer Systems...

Memory/SoC World ATE Markets

- Products Trends and Test Solutions

J 29 2007June 29, 2007

Representati e Board Director President and CEORepresentative Board Director, President and CEO

Toshio Maruyama

All Rights Reserved - Advantest Corporation1 2007/6/29

Contents

1. ATE History & Future1. ATE History & Future

1. 3rd Generation ---- Test Cost

1. 4th Generation ---- Next Decade

hiOpen Architecture

Hi-speed serial

2007/6/29All Rights Reserved - Advantest Corporation2

History of ATE Architecture

1 x Rate Generator Multi RateGeneratorRate

Shared ResourceTiming Generator Formatter

Generator

ClockStrobe

Timing

Formatter per Pin

g Formatter and Timing Generator

per PinFormatterData

Format

3 bits 3 bits

Control Data

per System

Control Data

per Pin

ControlData

Test

Control Data

per Pin

1 bit per Pin

per Pin1 bit

per Pin

per PinTestData

Pattern

1971 1973 1982 1985 1991 1999 2000

T320/10 T320/20 T3340 Megaone J971 ITS9000 ???Tester model


Number of Transistor 1(ref) 3 10 30 100 300 1000

ATE Player HistoryEntered into IC Tester

Advantest AdvantestTakeda Riken

Asia Electronicsmpa

nies

2000

All Tester TypesCurrent

FundedIn 1954

Changed company name in 1985Entered into IC TesterBusiness in 1968

Asia Electronicsrelated to Toshiba Yokogawa

Andorelated to NEC

Yokogawa

Shibasoku Shibasokunese

Com

Linear Testers

All Tester Types2004

1982

Shibasoku Shibasoku

Japa

n

Minato/Hitachi DecoMinatoclosedin 1997

Linear Testers

Kokuyo Closed

Long-established Tester Maker

VTTLow priceLogic Testers

Spin-offfrom Rohm

mpa

nies Fairchild Schlumberger NP Test

Credence Credence SoC TestersExpanded by M&A

GenRadSpin-off Linear Tester

Sold 2004

2003

Sold1990

1991

nese

Com SZ Testsysteme

Teradyne TeradyneTektronix

SoC TestersMegatest

1960 1995

2003TesterBusinessSold

STS1978

1975

on-J

apan

HP Agilent Verigy

LTX LTX Analog/Mixed Testers

SoC TestersFlash Memory

SoC Tester

Spin-off in 1976Megatest

Spin-offOct 2006


No

Versatest TestersFlash MemoryTester

Spin-offfrom Intel Nextest Low price Flash

and SoC Testers1997

1970 1980 1990 2000 2010

ATE Business History1970 1980 1990 2000 2010

Main FrameWS PC

Hi speed ( 100MHz) i

1’st Generation 2’nd Generation

C

3’rd Generation

O A i

4’th Generation

Hi-speed (~100MHz)

OTA(Overall Timing Accuracy)

per Pin Test System

Flexible SoftwareT6691T3370/80

Test Cost Open Architecture

Hi-speed serial

T5588 T2000T6691 T5588 T2000

100MHz TESTER&

View Point 512 Parallel Test

6 5GH DM&OTA Paper

at ITC

in 1979

6.5GHz DM


from Takeda Riken

Semiconductor/SPE/ATE MarketSemiconductor/SPE/ATE Market

140%

T. Semiconductor($B) Manufacturing Equipment GrowthT. Semi Growth ATE Growth (6MMA)

25

80%100%120%

th$B)

20

20%40%60%

Y/Y

Grow

t

Reve

nue

($ 15

10

-40%-20%0%

R 10

5

04 05 06-60%40%

Source: WSTS, SEMI, SEAJ

0

Key market driver for・・・

Front-End Equipment CAPEX activity of semiconductor manufacturing


manufacturingEnd-user application (TV, PC, DVD, etc.)Test Equipment (ATE)

Contents




hiOpen Architecture

Hi-speed serial


3rd Generation – Test Cost

• Growth-Driver : Consumer Electronics



Increasing chip complexity- Multicore architectureMulticore architecture- Convergence of CPU, GPU- Stacked die

Hi h- High power- High-speed digital- RF core proliferation Multicore Multicore

CPU/GPUConvergence

CPU/GPUConvergence

p- and more . . .

ChipChipC l itC l it

Multicore ArchitectureMulticore

Architecture StackedDie

StackedDie

ComplexityComplexity

High-speedDigital

High-speedDigital

What’sNext?What’sNext?

RF CoreProliferation

RF CoreProliferation



Test Cost ReductionTest Cost ReductionMemory Test System SoC Test System

1

T5501

2GHz/32

T5588

400MHz/512

Test Cost / DUT(Normalized Number)

1

Test Cost / DUT(Normalized Number)

T6683

0.8

T5591

1GHz/16 500MHz/128

T55852GHz/32

286MHz/384

T5383

0.8T6681

1GHz/1000pin

T6573

T2000SPT2000LS

0.6T5581

500MHz/128

286MHz/256

T5377 T5761

66MHz/5120.6

1GHz/1000pin

125MHz/512pin

T6573

250MHzDM/1000pin800MHzDM/1000pin

0 5

0.4T5335P

250MHz/64

0.4 T6671

0 3

0.4

0.5

60% Down 25% Down

0.230MHz/32

0.2200MHz/512pin

0.3

0.2


2002 20071997 2002 20071997

Contents




hiOpen Architecture

Hi-speed serial


Next DecadeOpen Architecture Test System

T2000T2000Full Module Base Test System T2000

TestModule


Next Decade

The Semiconductor Test Consortium was founded in 2003 to develop a common test architecture that is2003 to develop a common test architecture that is completely open, documented and supported via solutions available from all ATE vendors.

Open to all companies throughout the semiconductor supply chain with a vested interest in the test sector thesupply chain with a vested interest in the test sector, the consortium is focused on providing value-added standards that deliver technical & economic benefits to th l b l i d t i d t


the global semiconductor industry.

Next Decade

STC membersSTC members


Next Decade

D ki &

Working Group Activities

EDAInterfaces

STIL Docking & Interfacing

Probecard

Test Program

Gen.

UserLevel

API

ToolingAbstraction

Data-logging Asynch.

Test

InstrumentAbstraction

Layer

Existing WG

AbstractionLayer

TestInterface

Existing WG

Forming Now


Future Plans

Contents




hiOpen Architecture

Hi-speed serial


Next Decade

High Speed Interface Market Trend

20GPCI E XDR

[bps]이미지를 표시할 수 없습니다 . 컴퓨터 메모리가 부족하여 이미지를 열 수없거나 이미지가 손상되었습니다 . 컴퓨터를 다시 시작한 후 파일을 다시 여십시오 . 여전히 빨간색 x가 나타나면 이미지를 삭제한 다음 다시 삽입해야 합니다 .

PCI Express

10G8G

PCI Express XDR

ed

PCI Express

8G

4G

6G FB-DIMM

BU

S Sp

ee

S i lATA

2G

3G4G

Hyper Transport

B SerialATA

Hyper Transport

2003 2004 2005 2006 2007 2008 2009 [year]


Next Decade

HiHi--Speed serial solution Speed serial solution 6.5Gbps Test Module for T2000 Test Systemp y

Printed Circuit Board Technology

ATE Board Performance Board (PB)

Component

Number of Layer

Max Capability T2000 6.5Gbps T2000 Custom PBMax Capability

22 000

28

8 000

22

3 000

44

3 000

44

Hole Diameter (mm)

Size (mm)

Component

0.2

480 x 420

22,000

0.25

480 x 366

8,000

0.2

580 x 480

3,000

0.2

580 x 480

3,000

Line/Space (um)

Hole Count

70 / 70

68,000

100 / 154

47,200

70 / 70

30,000

70 / 70

30,000

Hi-Speed Device Technology

SiGe (BiCMOS) x 8 ft ~120GHzMCM x 8 4Million Gate CMOS[110nm] + DDR2 DRAM x 8


MCM x 8 4Million Gate CMOS[110nm] + DDR2 DRAM x 816 Interleave

Next Decade

HiHi--Speed serial solution Speed serial solution 6.5Gbps Test Module for T2000 Test System

Optical Inter-connect Technology

1Gbps Optical Tester Bus

Cross Section of Cables Optical Cable Optical Module

p y

p p

MEMS (Micro Electoro-Mechanical System) Relay Technology

[mm]MEMS Relay

5mm x 4mm

Cooling Technology (Fluorinert)[×0.1in]

fmax =12.5GHz or over

650W/printed circuit board

Connection Technology 0.65mm pitch


LIF (Low Insertion Force)

p144pin/connector

Next Decade

6 5Gbps Module for T2000 Test System

MEMS (Micro Electoro-Mechanical System) Relay Technology

6.5Gbps Module for T2000 Test System

160pS

6.5GHz

MEMS Technology

n Lo

ss [d

B] Isolation, R

e

[mm]5mm x 4mm

fmax =12.5GHz or over

Inse

rtion

eturn Loss [dB


[×0.1in]

B]

Frequency [GHz]

Memory/SoC World ATE Markets - Computer Systems...

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