Mechanical Behavior of Materials and Structures in...

Mechanical Behavior of Materials andStructures in Microelectronics

www.cambridge.org© in this web service Cambridge University Press

Cambridge University Press978-1-558-99120-0 - Materials Research Society Symposium Proceedings Volume 226: Mechanical Behavior of Materials and Structures in Microelectronics: Symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.Editors: Ephraim Suhir, Robert C. Cammarata, Deborah D.L. Chung and Masahiro JonoFrontmatterMore information

http://www.cambridge.org/9781558991200

http://www.cambridge.org


MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 226

Mechanical Behavior of Materials andStructures in Microelectronics

Symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.

EDITORS:

Ephraim SuhirAT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A.

Robert C. CammarataThe Johns Hopkins University, Baltimore, Maryland, U.S.A.

Deborah D.L. ChungState University of New York at Buffalo, New York, U.S.A.

Masahiro JonoOsaka University, Osaka, Japan

iMfRTSl MATERIALS RESEARCH SOCIETY

Pittsburgh, Pennsylvania






cambridge university press Cambridge, New York, Melbourne, Madrid, Cape Town, Singapore, São Paulo, Delhi, Mexico City

Cambridge University Press32 Avenue of the Americas, New York ny 10013-2473, USA

Published in the United States of America by Cambridge University Press, New York

www.cambridge.orgInformation on this title: www.cambridge.org/9781558991200

Materials Research Society506 Keystone Drive, Warrendale, pa 15086http://www.mrs.org

© Materials Research Society 1991

This publication is in copyright. Subject to statutory exceptionand to the provisions of relevant collective licensing agreements, no reproduction of any part may take place without the written permission of Cambridge University Press.

This publication has been registered with Copyright Clearance Center, Inc.For further information please contact the Copyright Clearance Center,Salem, Massachusetts.

First published 1991 First paperback edition 2013

Single article reprints from this publication are available throughUniversity Microfilms Inc., 300 North Zeeb Road, Ann Arbor, mi 48106

CODEN: MRSPDH

isbn 978-1-558-99120-0 Hardbackisbn 978-1-107-40986-6 Paperback

Cambridge University Press has no responsibility for the persistence oraccuracy of URLs for external or third-party internet websites referred to inthis publication, and does not guarantee that any content on such websites is,or will remain, accurate or appropriate.






Contents

PREFACE xi

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS xii

PART I: METALS

•ISOTHERMAL FATIGUE OF 62Sn-36Pb-2Ag SOLDER 3Semyon Vaynman and Morris E. Fine

PRESENCE OF ANELASTIC STRAINS IN HIGH LEAD SOLDERSAT AMBIENT AND HIGH TEMPERATURES 15

J.K. Tien and A.I. Attarwala

A NONLINEAR AND TIME DEPENDENT FINITE ELEMENT ANALYSISOF SOLDER JOINTS IN SURFACE MOUNTED COMPONENTS UNDERTHERMAL CYCLING 23

Yi-Hsin Pao, Kuan-Luen Chen, and An-Yu Kuo

CONTINUOUS WETTABILITY MEASUREMENT FOR SOLDER REFLOW 29Cynthia M. Melton, Susan M. Yarling, andCarl J. Raleigh

NUMERICAL SIMULATION AND EXPERIMENTAL INVESTIGATION OFSMT LASER MICROSOLDERING THERMAL PROCESS 37

Wang Chunqing, Qian Yiyu, and Jiang Yihong

A COMPARISON OF THE METALLURGICAL BEHAVIOR OF GOLD ANDCOPPER WIRES IN BALL BONDING 43

Tomohiro Uno, K. Tatsumi, K. Mizuno, O. Kitamura,and Y. Ohno

NUMERICAL ANALYSIS OF THE BALL FORMING PROCESS INCOPPER BALL BONDING 49

Fang Hongyuan, Qian Yiyu, and Jiang Yihong

PART II: ORGANIC MATERIALS

•MECHANICAL BEHAVIOR OF ENCAPSULANTS IN MICROELECTRONICPACKAGING 57

C.P. Wong

•THERMAL MODELING OF PLASTIC IC PACKAGES 67A. Bar-Cohen and Devin E. Mix

ELASTOMERIC CONDUCTORS FOR ELECTRICAL CONTACTS 85Mingguang Zhu and D.D.L. Chung

MECHANICAL MODELING OF STRESS GENERATION DURING CUREOF ENCAPSULATING RESINS 91

R.R. Lagasse, R.S. Chambers, T.R. Guess,D.J. Plazek, and C. Bero

•Invited Paper






A METHODOLOGY FOR RELIABILITY ASSESSMENT OF NON-DUCTILEENCAPSULANTS 97

Boon Wong and David C. Sandkulla

MECHANICAL CHARACTERIZATION OF PHOTORESIST POLYMERCOATINGS AS A FUNCTION OF PROCESSING HISTORY 109

Kun Tong, Jeffery F. Taylor, and Richard J. Farris

PART III: SEMICONDUCTORS

*THE INTERPLAY OF THERMO-MECHANICAL PROPERTIES IN THEGROWTH AND PROCESSING OF III-V MATERIALS 117

A.S. Jordan and V. Swaminathan

*THE EFFECTS OF STRESS ON THE INTERDIFFUSION INSi1_xGex/Si SUPERLATTICES 129

"s.M. Prokes

•EXPERIMENTAL EVALUATION OF MECHANICAL BEHAVIOR OFGaAs WAFER MATERIAL 141

Jun Ming Hu, Michael Pecht, and Donald Barker

CRYSTAL PLASTICITY ANALYSIS OF THERMAL DEFORMATIONAND DISLOCATION ACCUMULATION IN GaAs/Si PATTERNEDSTRUCTURE 147

Tetsuya Ohashi and Naoyuki Honda

SILICON CARBIDE WHISKER REINFORCED ALUMINUM WITHIMPROVED TEMPERATURE RESISTANCE DUE TO THE USE OF APHOSPHATE BINDER 153

Jeng-Maw Chiou and D.D.L. Chung

STRESS DEPENDENT ELECTRICAL ACTIVATION OF IMPLANTEDSi IN GaAs - A FOUR POINT BENDING STUDY 157

J.G. Huang, R.J. Jaccodine, J.H. Huang,S.A. Schwarz, C.L. Schwartz, and R. Bhat

PART IV: THIN FILMS AND COATINGS

*THE AC-INDENTATION TECHNIQUE AND ITS APPLICATION TOAl AND Al-Si COATINGS 165

T.W. Wu

*NEW DEVELOPMENTS IN THE DYNAMIC MECHANICAL ANALYSISOF THIN-LAYER MATERIALS 179

B.S. Berry and W.C. Pritchet

ON THE ELECTRONIC CONTRIBUTION TO ELASTIC CONSTANTS OFULTRATHIN FILMS OF p-TYPE Si 191

Kamakhya P. Ghatak and Badal De

STRESS IN METAL FOILS DURING PROCESSING AND THERMALCYCLING 197

A. Jagota, M.F. Lemon, and Y.H. Hu

•Invited Paper

VI






MICROSTRUCTURE AND MECHANICAL BEHAVIOR OF MAGNETRONSPUTTERED Al-Cu FILMS 203

Tsann Lin and V. Raman

GROWTH AND MICROSTRUCTURE OF ALUMINUM NITRIDE THINFILMS 209

M. Grant Norton, Paul G. Kotula, Jian Li,Stuart McKernan, Kathryn P.B. Cracknel1,C. Barry Carter, and James W. Mayer

MECHANICAL BEHAVIOR OF BENZOCYCLOBUTENE FILMS ONSILICON SUBSTRATES 215

P.H. Townsend, T.M. Stokich, Jr., and B.S. Huber

MICROHARDNESS OF THIN SiO2 FILMS ON SILICON 225B. Yost, Che-Yu Li, Bette Bergman-Reuter, andTim Sullivan

LASER ULTRASONIC MEASUREMENT OF THIN FILM ELASTICPROPERTIES 231

Sarah E. Bobbin, J.W. Wagner, and R.C. Cammarata

CONTROL OF MICROSTRUCTURE AND STRESS IN SPUTTEREDTUNGSTEN THIN FILMS ON SILICON 235

R.R. Kola and G.K. Celler

SELECTIVE GROWTH OF POLY-DIAMOND THIN FILMS USINGSELECTIVE DAMAGING BY ULTRASONIC AGITATION ON AVARIETY OF SUBSTRATES 241

R. Ramesham, T. Roppel, and C. Ellis

PREPARATION OF Tl-Ba-Ca-Cu SUPERCONDUCTING OXIDE FILMSBY SPRAY PYROLYSIS TECHNIQUE 249

H.S. Koo, T.L. Kuo, D.H. Kuo, R.J. Lin, W.H. Lee,and P.T. Wu

RELAXATION OF THERMAL STRESSES IN Al-FILMS 255H.G. Bohn, W. Pill, K.-H. Robrock, andW. Schilling

STRESS AND RESISTIVITY IN REACTIVELY SPUTTEREDAMORPHOUS METALLIC Ta-Si-N FILMS 261

C.-K. Kwok, E. Kolawa, M-A. Nicolet, andRay C. Lee

PART V: STRESS-STRAIN AND FRACTURE ANALYSES

•MECHANICAL BEHAVIOR OF MATERIALS IN MICROELECTRONICAND FIBER-OPTIC STRUCTURES: APPLICATION OF ANALYTICALMODELING - REVIEW 269

E. Suhir

•STRAINS AND RELAXATIONS NEAR METAL ALUMINIDE/SEMICONDUCTOR INTERFACES 279

W.W. Gerberich, J.E. Angelo, R.R. Keller,A.M. Wowchak, and P.I. Cohen

•Invited Paper

VII






•SPIRAL CRACKING AROUND A STRAINED CYLINDRICAL INCLUSIONIN A BRITTLE MATERIAL AND IMPLICATIONS FOR VIAS ININTEGRATED CIRCUITS 291

L.B. Freund and K.S. Kim

•FRACTURE STRENGTH OF A12O3 INSULATING THIN FILM FORHIGH DENSITY WIRING SUBSTRATE 303

Masahiro Jono and Atsushi Sugeta

*AGING AND FRACTURE BEHAVIOR OF POLYMERS 315A. Chudnovsky and C.P. Bosnyak

A MICROMECHANICAL ANALYSIS OF THE SIGNAL PROPAGATIONIN COMPOSITE MATERIALS 325

C.S. Chen

THERMAL EXPANSION MODEL FOR MULTIPHASE ELECTRONICPACKAGING MATERIALS 331

Ronald E. Allred and William E. Warren

CURVATURE MEASUREMENTS OF TRI-MATERIAL STRUCTURESUNDER THERMAL EXCURSION 339

Guo-Quan Lu, Boris Mogilevsky, and Tapan K. Gupta

RESIDUAL STRESS MEASUREMENT IN SILICON SUBSTRATE AFTERLOCAL THERMAL OXIDATION USING MICROSCOPIC RAMANSPECTROSCOPY 345

Hideo Miura, Hiroshi Sakata, and Shinji Sakata

EFFECTS OF PLASTIC DEFORMATION ON CHARGE TRANSPORTIN MERCURIC IODIDE RADIATION DETECTORS 351

J. Marschall, F. Milstein, G. Georgeson, andV. Gerrish

STEREOIMAGING DETERMINATION OF STRAINS IN SURFACEMOUNTED COMPONENTS AND PLATED THROUGH HOLES RESULTINGFROM THERMAL CYCLING 357

David L. Davidson

FRACTURE BEHAVIOR OF SILICON CUT WITH A HIGH POWERLASER 363

C.C. Chao, R. Chleboski, E.J. Henderson,C.K. Holmes, J.P. Kalejs, and T.S. Gross

A NEW APPROACH TO EVALUATE THE DELAYED FRACTUREBEHAVIOR OF AN OPTICAL GLASS FIBER 369

M. Muraoka and H. Abe

THE SINGULAR BEHAVIOR OF THE LATTICE HARDNESS OFBISMUTH CUPRATES UNDER THERMOCYCLING 375

V.N. Belomestnykh, O.L. Khasanov, Yu.P. Pokholkov,and A.A. Bush

TESTING OF FRACTURE RESISTANCE OF MATERIALS 383Beta Y. Ni, T.Y. Zhang, and J.C.M. Li

*Invited Paper

viii






PART VI: RELIABILITY ISSUES

•MECHANISMS OF INELASTIC DEFORMATION AND STRESSRELAXATION IN THIN METALLIZATIONS BONDED TO HARDSUBSTRATES 391

M.A. Korhonen, P. B#rgesen, and Che-Yu Li

STRESS INDUCED VOID NUCLEATION IN NARROW ALUMINUMALLOY LINES 401

P. B^rgesen, M.A. Korhonen, C. Basa,W.R. LaFontaine, B. Land, and C.-Y. Li

THE EFFECT OF LINE GEOMETRY ON VOID GROWTH IN THIN,NARROW ALUMINUM LINES 407

P. B^rgesen, J.K. Lee, M.A. Korhonen, andC.-Y. Li

VOID GROWTH AS A FUNCTION OF RESIDUAL STRESS LEVELIN THIN, NARROW ALUMINUM LINES 413

M.A. Korhonen, P. B^rgesen, C.A. Paszkiet,J.K. Lee, and Che-Yu Li

THE EFFECT OF A PASSIVATION OVER-LAYER ON THEMECHANISMS OF STRESS RELAXATION IN CONTINUOUSFILMS AND NARROW LINES OF ALUMINUM 419

C.A. Paszkiet, M.A. Korhonen, and Che-Yu Li

EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATIONOF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS 425

T. Nakagawa, H. Miyatake, T. Maeda, K. Kuroda,N. Tokushige, R. Inoue, J. Kudo, and T. Ashida

CREEP-FATIGUE BEHAVIOR OF MICROELECTRONIC SOLDER JOINTS 433R.G. Ross, Jr., L.C. Wen, G.R. Mon, E. Jetter,and J. Winslow

FINITE ELEMENT SIMULATION OF HILLOCK FORMATION INALUMINUM INTERCONNECT 439

L.G. Burrell, S. Kapur, and I. Shareef

THE EFFECT OF PROCESS ON PERFORMANCE AND RELIABILITYIN A ONE STEP SILVER-GLASS DIE ATTACH ADHESIVE 445

A.M. Conlon, C.P. Cameron, and J.W. Lau

AUTHOR INDEX 451

SUBJECT INDEX 453

*Invited Paper






Preface

This book contains the proceedings of the Symposium on theMechanical Behavior of Materials and Structures in Microelec-tronics. The Symposium was held from April 30 to May 3, 1991,in Anaheim, California, as Symposium H of the 1991 SpringMeeting of the Materials Research Society. The goal of thisSymposium was to apply and advance strength-of-materials methodsto various materials science problems in microelectronics. Toachieve this goal we brought together materials scientists, whofocus mainly on the investigation of the properties of micro-electronic materials, and mechanical engineers who treat amicroelectronic system as a structure.

The symposium consisted of four full days of invited andcontributed papers, and also included two joint sessions withSymposium G: "Materials Reliability Issues in Microelectronics."The program included 82 presentations which examined a widerange of materials systems in microelectronics, as well asvarious experimental, analytical, and computer-aided methods andapproaches used in materials science and mechanical engineering.

The organization of this volume reflects, to a greatextent, that of the Symposium itself. All the published paperswere reviewed by peers. We feel that the contents of the bookrepresents close to the current state of knowledge in the areaof the mechanical behavior and performance of materials andstructures in microelectronics, and hope that it will be usefulfor specialists working in this important field of materialsscience.

The editors thank all authors, session chairpersons and co-chairpersons, reviewers, as well as the MRS staff and programofficials for their contributions and help in organizing thesymposium and publishing this book.

E. SuhirR.C. CammarataD.D.L. ChungM. Jono

August 1991






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 201—Surface Chemistry and Beam-Solid Interactions, H. Atwater,F.A. Houle, D. Lowndes, 1991, ISBN: 1-55899-093-3

Volume 202—Evolution of Thin Film and Surface Microstructure,C.V. Thompson, J.Y. Tsao, DJ. Srolovitz, 1991,ISBN: 1-55899-094-1

Volume 203—Electronic Packaging Materials Science V, E.D. Lillie,P. Ho, RJ. Jaccodine, K. Jackson, 1991, ISBN: 1-55899-095-X

Volume 204—Chemical Perspectives of Microelectronic Materials II,L.V. Interrante, K.F. Jensen, L.H. Dubois, M.E. Gross, 1991ISBN: 1-55899-096-8

Volume 205—Kinetics of Phase Transformations, M.O. Thompson, M. Aziz,G.B. Stephenson, D. Cherns, 1991, ISBN: 1-55899-097-6

Volume 206—Clusters amd Cluster-Assembled Materials, R.S. Averback,J. Bernholc, D.L. Nelson, 1991, ISBN: 1-55899-098-4

Volume 207—Mechanical Properties of Porous and Cellular Materials,K. Sieradzki, D. Green, LJ. Gibson, 1991, ISBN-1-55899-099-2

Volume 208—Advances in Surface and Thin Film Diffraction, T.C. Huang,P.I. Cohen, DJ. Eaglesham, 1991, ISBN: 1-55899-100-X

Volume 209—Defects in Materials, P.D. Bristowe, J.E. Epperson, J.E. Griffith,Z. Liliental-Weber, 1991, ISBN: 1-55899-101-8

Volume 210—Solid State Ionics II, G.-A. Nazri, D.F. Shriver, R.A. Huggins,M. Balkanski, 1991, ISBN: 1-55899-102-6

Volume 211—Fiber-Reinforced Cementitious Materials, S. Mindess,J.P. Skalny, 1991, ISBN: 1-55899-103-4

Volume 212—Scientific Basis for Nuclear Waste Management XIV,T. Abrajano, Jr., L.H. Johnson, 1991, ISBN: 1-55899-104-2

Volume 213—High-Temperature Ordered Intermetallic Alloys IV,L.A. Johnson, D.P. Pope, J.O. Stiegler, 1991, ISBN: 1-55899-105-0

Volume 214—Optical and Electrical Properties of Polymers, J.A. Emerson,J.M. Torkelson, 1991, ISBN: 1-55899-106-9

Volume 215—Structure, Relaxation and Physical Aging of Glassy Polymers,RJ. Roe, J.M. O'Reilly, J. Torkelson, 1991, ISBN: 1-55899-107-7

Volume 216—Long-Wavelength Semiconductor Devices, Materials andProcesses, A. Katz, R.M. Biefeld, R.L. Gunshor, RJ. Malik, 1991,ISBN 1-55899-108-5

Volume 217—Advanced Tomographic Imaging Methods for the Analysis ofMaterials, J.L. Ackerman, W.A. Ellingson, 1991,ISBN: 1-55899-109-3

Volume 218—Materials Synthesis Based on Biological Processes, M. Alper,P.D. Calvert, R. Frankel, P.C. Rieke, D.A. Tirrell, 1991,ISBN: 1-55899-110-7






MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS

Volume 219—Amorphous Silicon Technology—1991, A. Madan,Y. Hamakawa, M. Thompson, P.C. Taylor, P.G. LeComber,1991, ISBN: 1-55899-113-1

Volume 220—Silicon Molecular Beam Epitaxy, 1991, J.C. Bean, E.H.C. Parker,S. Iyer, Y. Shiraki, E. Kasper, K. Wang, 1991, ISBN: 1-55899-114-X

Volume 221—Heteroepitaxy of Dissimilar Materials, R.F.C. Farrow,J.P. Harbison, P.S. Peercy, A. Zangwill, 1991, ISBN: 1-55899-115-8

Volume 222—Atomic Layer Growth and Processing, Y. Aoyagi, P.D. Dapkus,T.F. Kuech, 1991, ISBN: 1-55899-116-6

Volume 223—Low Energy Ion Beam and Plasma Modification of Materials,J.M.E. Harper, K. Miyake, J.R. McNeil, S.M. Gorbatkin, 1991,ISBN: 1-55899-117-4

Volume 224—Rapid Thermal and Integrated Processing, M.L. Green,J.C. Gelpey, J. Wortman, R. Singh, 1991, ISBN: 1-55899-118-2

Volume 225—Materials Reliability Issues in Microelectronics, J.R. Lloyd,P.S Ho, C.T. Sah, F. Yost, 1991, ISBN: 1-55899-119-0

Volume 226—Mechanical Behavior of Materials and Structures inMicroelectronics, E. Suhir, R.C. Cammarata, D.D.L. Chung,1991, ISBN: 1-55899-120-4

Volume 227—High Temperature Polymers for Microelectronics, D.Y. Yoon,D.T. Grubb, I. Mita, 1991, ISBN: 1-55899-121-2

Volume 228—Materials for Optical Information Processing, C. Warde,J. Stamatoff, W. Wang, 1991, ISBN: 1-55899-122-0

Volume 229—Structure/Property Relationships for Metal/Metal Interfaces,A.D Romig, D.E. Fowler, P.D. Bristowe, 1991, ISBN: 1-55899-123-9

Volume 230—Phase Transformation Kinetics in Thin Films, M. Chen,M. Thompson, R. Schwarz, M. Libera, 1991, ISBN: 1-55899-124-7

Volume 231—Magnetic Thin Films, Multilayers and Surfaces, H. Hopster,S.S.P. Parkin, G. Prinz, J.-P. Renard, T. Shinjo, W. Zinn, 1991,ISBN: 1-55899-125-5

Volume 232—Magnetic Materials: Microstructure and Properties, T. Suzuki,Y. Sugita, B.M. Clemens, D.E. Laughlin, K. Ouchi, 1991,ISBN: 1-55899-126-3

Volume 233—Synthesis/Characterization and Novel Applications of MolecularSieve Materials, R.L. Bedard, T. Bein, M.E. Davis, J. Garces,V.A. Maroni, G.D. Stucky, 1991, ISBN: 1-55899-127-1

Volume 234—Modern Perspectives on Thermoelectrics and Related Materials,D.D. Allred, G. Slack, C. Vining, 1991, ISBN: 1-55899-128-X

Prior Materials Research Society Symposium Proceedingsavailable by contacting Materials Research Society.






Mechanical Behavior of Materials and Structures in...

Documents

Transcript of Mechanical Behavior of Materials and Structures in...