mCube MC3413 3rd Generation 3-Axis Accelerometer 2015 teardown reverse costing report published by...

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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] April 2015 – Version 1 – Written by Romain Fraux

Transcript of mCube MC3413 3rd Generation 3-Axis Accelerometer 2015 teardown reverse costing report published by...

Page 1: mCube MC3413 3rd Generation 3-Axis Accelerometer 2015 teardown reverse costing report published by Yole Developpement

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

April 2015 – Version 1 – Written by Romain Fraux

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mCube MC3413 3-Axis MEMS Accelerometer

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– mCube

– MC3413 Characteristics

3. Physical Analysis 12– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package

– Package Views, Dimensions & Pin-Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– Die

– Die View & Dimensions

– Die Marking

– Bond Pad Opening

– MEMS Cap Removed

– MEMS Cap Details

– MEMS Sensing Area

– MEMS Sensing Area Removed

– Delayering (Metal Layers Removed)

– IC Process

– Die Cross-Section

– Die Cross-Section – IC

– Die Cross-Section – MEMS Sensor

– Die Cross-Section – Sealing Sensor/Cap

– Die Cross-Section – MEMS Cap

4. Comparison with Accelerometers from Bosch and ST 62

5. Manufacturing Process Flow 68– Global Overview

– IC Front-End Process

– MEMS Process Flow

– Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

6. Cost Analysis 82– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– CMOS Front-End Cost

– MEMS Front-End Cost

– MEMS Front-End Cost per process steps

– MEMS Front-End: Equipment Cost per Family

– MEMS Front-End: Material Cost per Family

– Total Front-end Cost

– Back-End 0 : Probe Test & Dicing

– Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test & Calibration Cost

– MC3413 Component Cost

– MC3413 Component Price

– Cost & Price Comparison with Bosch and ST

Contact 106

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Package top view Package bottom view

Package Side View

2mm

0.9mm

2mm

• Marking:

DJ4Q

FNA

• Package: LGA 12-pin

• Dimensions: 2.0 x 2.0 x 0.9mm

• Pin Pitch: 0.5mm

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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

• Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

• Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

• Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

– Email: [email protected]