MCC profile.pdf · 2020. 5. 18. · Time (sec.) 50 T em p. (deg. C) 0 100 150 200 250 Max. Gradient...
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MCCSEMI.COM Rev.2-01012021 Recommended reflow soldering profile Preheat Flux Activation Reflow Cool Down t L t s t p T P L SMAX SMIN T T T 25C Temperature (°C) Time to Peak Ramp-Up Ramp-Down Time (Seconds) Figure 1. Temperature Profile for Infrared or Convection Reflow Table 1. Reflow Profile Parameter Description Pb-Free Package Ramp-Up Average Ramp-Up Rate (T SMAX to T p ) 3 ºC/second max. T SMIN Preheat Peak Min. Temperature 150 ºC T SMAX Preheat Peak Max. Temperature 200 ºC Tp Max. Reflow Temperature 260 (+0/-5) ºC T s Time between T SMIN and T SMAX 60-180 seconds T L Solder Melting Point 218 ºC t L Time Maintained above T L 60-150 seconds t p Time within 5 ºC of Peak Temperature 10 seconds Ramp-Down Ramp-down Rate 6 ºC/second max. Time to Peak Time from 25 ºC to Peak Temperature 8 minutes max. 1/3
Transcript of MCC profile.pdf · 2020. 5. 18. · Time (sec.) 50 T em p. (deg. C) 0 100 150 200 250 Max. Gradient...
MCCSEMI.COMRev.2-01012021
Recommended reflow soldering profile
Preheat Flux Activation Reflow Cool Down
t L
t s
t p
TP
L
SMAX
SMIN
T
T
T
25C
Temperature (°C)
Time to Peak
Ramp-Up
Ramp-Down
Time (Seconds)
Figure 1. Temperature Profile for Infrared or Convection Reflow
Table 1. Reflow Profile
Parameter Description Pb-Free Package Ramp-Up Average Ramp-Up Rate (TSMAX to Tp) 3 ºC/second max.
TSMIN Preheat Peak Min. Temperature 150 ºC
TSMAX Preheat Peak Max. Temperature 200 ºC
Tp Max. Reflow Temperature 260 (+0/-5) ºC
Ts Time between TSMIN and TSMAX 60-180 seconds
TL Solder Melting Point 218 ºC
tL Time Maintained above TL 60-150 seconds
tp Time within 5 ºC of Peak Temperature 10 seconds
Ramp-Down Ramp-down Rate 6 ºC/second max.
Time to Peak Time from 25 ºC to Peak Temperature 8 minutes max.
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MCCSEMI.COMRev.2-01012021
Recommended wave soldering profile
Time (Seconds)
Figure 2. Temperature Profile for Wave Soldering
Table 2. Wave Soldering Profile
Parameter Description Pb-Free Package Ramp-Up Average Ramp-Up Rate 200°C/s
Heating Heating Rate During Preheat1 °C/s to 2 °C/s typical; 4 °C/S maximum
TS Final Preheat Temperature 130°C
TP Peak Temperature 260°C
tP Time Within Peak Temperature 10s
Ramp-Down Ramp-Down Rate 5 °C/s maximum
Second Wave
tpTp
Temperature(°C)
First Wave
Preheat Ramp-Down
Ts
25 °C
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MCCSEMI.COMRev.2-01012021
Manual Soldering Specification
For manual soldering, MCC products can withstand 350 ºC for 3sec, pls do not exceed this limitation during soldering, otherwise the parts maybe damaged.
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