MARTIN EXPERT 10.6
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Transcript of MARTIN EXPERT 10.6
REWORK TECHNIC PCMARTIN Expert 10.6Rework for SMT Components
www.martin-smt.de
Rework Technic pc
®
A FINTECH company
REWORK TECHNIC PC
Rework ExcellenceClear and functional – the standard set by MARTIN. With the intuitive and precise functionsof the Expert 10.6, even demanding processes become easily executable tasks. You toocan trust "Made by MARTIN". Reliably reworked components are our best testimonial.
FlexibleEquip yourself for the future. Like its pro-ven predecessors, the MARTIN Expert 10.6is compatible with the smallest SMDs,large processor sockets, and tomorrow’stechnologies.
Precision control unit
High resolution camera
Placement nozzle with automatic 4-axes control
ProvenRely on MARTIN Technology. Extensive application experience and demonstrated precisionhave been proven again and again by our customers around the world for almostthree decades.
EfficientProfit from the speed of the new MARTINExpert 10.6. Quick and reliable processes, as well as an affordable price, provide maximum advantage.
Hot Air soldering nozzle
Hybrid Underheater with IR and convection
Modules for residual solder removal and dispensing
SupportWherever you are located, we are closeby, and you can expect exceptional serviceand support. Competence, reliability andresponsiveness are guaranteed, aroundthe globe.
Your Edge in PlacementThe MARTIN Expert 10.6 offers a leading edge, camera driven alignment system, providing a flawless solution for the automatic placement process. From pre-alignmentto final error-free placement, component accuracy is achieved and maintained.
Generate the devicecoordinates.
Automatic placementof the device ontothe pad array.
Capture with just three mouse clicks.
Auto Vision TechnologyAutomated SMD placement provides ease of use for operators. The pads are displayedand marked on the screen. All componentcoordinates are established with just threemouse clicks.
Placement is controlled in detail by the ca mera, and automatically positioned by the pickup tool. There is no faster, more exact,or more accurate way of positioning SMDs.
Automatic and camera controlled
The Soldering AdvantageThe Expert 10.6 employs the highest standards in thermodynamics. PCBs are rapidly and carefully heated with a calibrated amount of heat from below using a unique combination of hot-air convection and IR. Combined with complementary hot-air flow from above, ensures the solderjoints are precisely and accurately reflowed. This hybrid approach provides superbly soldered joints.
Diagram ProfileThis module duplicates production reflow oven profiles. Thermal values are simply transferred from a datasheetinto the Easy Solder program.
Rapid ProfileBased on Rapid Technology, this innovative profile guarantees a clear and effective process. The result is a time savings up to 30%.
RD k w h d u g
Hybrid TechnologyThe newly developed hybrid under-board heater is a combination of IR technology andhot-air convection. This unique solution tounder-board heating provides both high powerfor shorter saturation times, and improvedinternal management for a more uniformthermal gradient within the board. Board warpage is therefore minimized.
Hot Air PrecisionMARTIN’s Precision Hot Air technology en sures that the required soldering tempe -rature is reached without exceeding the maxi mum value specified for the SMD – withina tolerance of only +/- 1%.
Optional Extras
Report softwareAllows access to all stored data ofindividual solder processes.
Reballing Tools Facilitates the trouble freere-use of removed components.
Soldering nozzles Sets for all BGAs, CSPs und SOs.
Micro SMD SetFor the processing of miniature components.
PCB Flex Support Helps to reduce board deformationduring the rework process.
Prebumping Hotprinter Stencil paste and reflow within one module.
®
MARTIN Expert 10.6
MARTIN Expert 10.6S
MARTIN Expert 10.6XLSpecific equipment• Auto Vision Placer extended by 50 mm • Instead of underheater HIF 08: HIF 09 (5000 W)
Specific technical dataMax. PCB width 490 mm Max. PCB length 600 mm Footprint 630 x 1035 mm Underheater 1200 - 5000 Watt
420 x 450 mm Image size 75 x 95 mm (Maxi-BGA)*
Martin GmbH, Argelsrieder Feld 1b, D-82234 WesslingFon +49-(0)8153-9329-32, Fax +49-(0)8153-9329-39 [email protected], www.martin-smt.de
02/2010
Technical detailsMax. PCB width 390 mm Max. PCB length 500 mm Footprint 460 x 865 mm Hot Air 2 - 35 I/min ± 1 I/min
150 - 400°C ± 1,0 % (repeatability) Underheater 600 - 3000 Watt
245 x 275 mm WIN software Easy Solder 05 Travel 75 mm / 75 mm / 23 mm / ±10° Resolution of axes 0,001 mmResolution of camera 1944 x 2595 pixel Image size 14 x 18 mm (Flip Chip)*
28 x 37 mm (CSP) 37 x 50 mm (BGA/QFP) 65 x 85 mm (Maxi BGA)*
Placement accuracy ± 0,015 mm (Flip Chip)* ± 0,03 mm (CSP) ± 0,04 mm (BGA/QFP) ± 0,07 mm (Maxi BGA)*
Specific equipment • Instead of underheater HIF 08: IRH radiaton element (110 W)
• Instead of 7 soldering nozzles for QFPs: Set with 4 soldering nozzles for all CSPs 2 soldering nozzles for SOs (10 x 15 mm, 15 x 25 mm) 2 placement nozzles for chips (0.25, 0.5 mm)
Specific technical data Underheater 20-110 Watt
65 x 80 mm
The set comes complete with • Solder station DBL 06 with soldering pen, tool maga-zine, reballing holder, 2 soldering nozzles (4.0, 7.0 mm)
• Dis module with dispensing pen, 2 aluminium nozzles (0.3 mm), cleaning set
• Vac module with vacuum pen, 4 placement nozzles (0.7, 1.5, 6.3, 8.5 mm), 2 solder sucker nozzles (1.0, 1.4 mm), cleaner
• Measurement module with ultra fine sensors, 6 channels
• Underheater HIF 08 (3000 W) • PCB table Smart Fix Compact with hand rest, cooling, 4 PCB holders and 2 PCB clips
• Auto Vision Placer with 5 automatic axes, camera, 2 lenses and 4 placement nozzles
• Second soldering pen for residual solder removal • Foot switch, solder paste, solder balls, flux pen, flux cream
• CSP/BGA transfer tool, SMD hook • Set with 7 soldering nozzles for all PLCCs, QFPs• Box with consumables • Rework ABC (handbook) • MARTIN Rework software Easy Solder 05 (WIN XP/Vista/7)
* Optional extra
Konzept und Realisierung: S
ternwerfer Design
A finetech company