Manufacturing Considerations for Optimum Throughput and ...
Transcript of Manufacturing Considerations for Optimum Throughput and ...
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Manufacturing Considerations for Optimum
Throughput and Quality
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Factory Automation Critical to US Manufacturers
• To compete domestically with offshore CM’s, to reduce man labor design’s
need to consider reducing use of manually installed (Thru-hole) components to
full extent possible.
•Isolate Thru-Hole from solder side SMT to allow access for selective soldering
and minimize masking requirements. (i.e. Connectors, Transformers, Relays….)
(consider pre-design meeting with manufacturing dept. / company)
• Maximize Computer Integrated Manufacturing - using CAM enables us to
optimize line efficiency, substantially improve our responsiveness and accuracy
•CIM can also be a baseline for a PLM Tools and – establish a forward
compatible package and part number library.
•Establish Consistency Now with component libraries, document formats and
define your Revision Control with PLM and factory automation in mind.
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TJM Core Objectives
To deliver electronic hardware that is:
1) Built to print.
2) In conformance with specified standards.
3) Delivered on time.
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TJM’s Value Added
• Communication • Response to RFQ’s
• Daily status updates
• Project interface (access to Insightly)
• We verify everything….
• DFM Report• Documents any design, documentation or data concerns
throughout the manufacturing cycle.
• Quality System AS9100• Exceeds commercial standards
• Delivery
• One week is currently standard
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What has the most impact to meeting
these 3 main objectives?
1) Kit Condition (when customer supplies parts)
2) Lack of ASCII / CAD / (intelligent machine data)
3) Poor or incomplete documentation -no drawing is
provided, silkscreen does not have ref des, polarity and
orientation markings missing or ambiguous)
4) Layout / Design issues –Most are silkscreen,
panelization or fiducial related.
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RFQ or Build Data / Document Checklist
Musts Nice to Have• ASCII CAD Data File
• Revision Controlled BOM
• Revision Controlled DWG
• XY file (if ASCII not avail.)
• Gerber Set
• Bare Board for Oven
Profiling (Baseline)
• Step File
• Schematic
• Board Fabrication Drawing
• Extra parts set for profiling
• Sample
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Procurement /
Kit Staging
SMT
ASSEMBLY
Set UpCAM
FIRST
ARTICLE AOI Inspection
Touch up / TH Final Inspection Ship
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ASCII CAD
File
CircuitCAM
Pick and
Place
Program
AOI
Inspection
Program
Color
Coded
Visual Aids
Build
Planning
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ASCII CAD Design File
• CAD Data Includes: PWB dimensions, Pad geometries , part package geometries and part number information not provided in standard XY file.
• Improves our manufacturing efficiency, expediency, quality, and responsiveness.
• Minimizes the potential for human error (no manual entry)
• CAD Imports build your component library over time, reducing package and part number entry and programming from job to job.
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BOM Import Sources and FormatsC
he
ckP
oin
t
Cir
cu
itC
AM
Text
(ASCII)Yes Yes
Fixed
Column or
Character
Excel Yes No N/A
ODBC
(Access)Yes No N/A
Format
Cost, Height
(mils)
Polarity,
Socketed
(Y/N,Yes/No
, T/F,
True/False)
Unlimited
Delimiters
Required
Fields
Preferred
Fields
Optional Text
Fields
Optional
Number
Fields
Optional
Boolean
Fields
Template
Definition, Join
Multiple Files to
Form 1 BOM,
Analysis
Reports, Use
Customer or
Internal Number
as Primary,
AML/AVL
Mgmt, Revision
Control
Additional
Functions in
CheckPoint
Custom
BOM Fields
Supported in…
Part
Number,
Reference
Designators
Description,
Quantity
(CheckPoint)
Part Marking,
Package,
Population
Type,
Customer P/N,
Mfr, Mfr P/N,
Vendor,
Vendor P/N,
Bin Location,
Stock Code,
Software Ver,
Part Rev, URL
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Fiducials
• Most common problem we see is……there are none.
• Use of Fids are key to controlling #1 Defect –
(Tombstones)
• Have Global Fids in the design data (preferrably as the
origin 0,0.
• Use Panel Fids
• Once Global fids are used to set up program the panel fids (most often) can be used for production and reduce camera location time.
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Fiducial Types
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Yield Results using optimized fiducials
• Production Defect rate reduced to .012% (down
from 3%) on modules with 0402, 0201 and uBGA
packages.
• Touch up time reduced by 1/3 of the original
board build that had no fiducial locations.
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Most Common Component Kit
Challenges• Exact Quantities ordered – No Attrition.
• Part ID - Customer provides alternates in the kit but does
not identify alternates on pick list and BOM. (we require to
get approval for substitutes to proceed)
• Chopped Tape Dilemma – Need to specify “continuous
tape” from Digikey/Mouser.
• Component Leads on fine pitch items damaged not
protected properly on multipin devices.
• Customer often holds kit until last item is received. Send
kits ahead for review and staging, drop ship final items.
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WATCH OUTSome things we have come across recently..
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Inconsistent Pad Geometry on BGA
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Case sample: Samtec SeaRay
Connectors• Has an interesting interconnect technology (solder
charge)
• Recommends .006” thick stencil and (min of .005”)
• Recommends over sized apertures
Notes:If the solder charge does not collapse, due to incorrect stencil
parameters, part is difficult to remove, and is not re-useable. Note: we use
.004” thick stencils on 80% of our builds due to 0402 and 0201 passives. So
here is a situation where you have one part challenging the other for correct
tooling.
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Please Don’t use…unless you have to
• White Solder Mask • Dark Ledger
White mask reflects light and reduces AOI image quality.
Machine operators can not see polarity markings or ledger through machine camera during set up
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Panelization
• Stencil data in gerber set is for (1) unit. Array data
requirement must be communicated to, and provided by,
the board house.
• Why is that difficult to get that from Chinese board
vendors?
• Mousebites – Be careful where these are located, keep
away from traces, via, components in general.
• Prefer Scored Tabs – Careful about location.
• Be careful of long, thin scored boarders on boards .063 or
thicker. This inflicts mechanical stress on board while
trying to break border away
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Keep Out Areas for Panel Tabs?
• Mousebites • Scored Tab
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Fab Issues / Most common
• No Fab drawing and notes or Read-Me files for specs
• Clear stack up instructions
• Clarify material types, Copper Weights
• Trace and spacing should be no less than .005”
• Finished hole sizes .008” or above
•
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Summary
• Providing ASCII CAD File is key to throughput and
accuracy
• Use Fids – Both Global and Panel
• Oven Profile is Critical – Spare Board and Parts provded?
• Consider letting CM (TJM) buy parts. It’s cleaner
• Mask vs PAD defined(see image)
• Watch for new component packages with special
requirements (Samtec SEARAY)