Spring 2003 Yield Management Solutions38

Product NewsCDExpress This run-time regression software option on the SpectraCD spectroscopicCD metrology system significantly reduces time-to-results in R&D envi-ronments compared to offline library generation systems. While mostadvanced CD metrology systems can perform run-time regression,CDExpress is unique in that it uses SE data and runs completely on-toolwithout the need for expensive computer clusters dedicated to each metrol-ogy tool. CDExpress has also demonstrated exceptional performance interms of precision, stability, and MAM (move-acquire-measure) time.

TeraSim TeraSim, an option available with the TeraStar reticle inspection systemand the previous-generation 300 series, is the semiconductor industry’smost advanced reticle defect printability software solution. LeveragingKLA-Tencor’s industry-leading PROLITH lithography simulation technol-ogy, TeraSim provides optical lithography modeling capabilities that ensurecorrect defect dispositioning, enabling improved reticle yield throughreduction in reticle defect repair. TeraSim enables mask makers and ICmanufacturers to reduce the number of defect review and repair steps,while improving reticle yield and cycle time without impacting waferyield.

Alpha-Step IQThe Alpha-Step IQ state-of-the-art, stylus-based surface profiler combineshigh measurement precision with versatility and economy. Ideal for pilotlines and materials research with guaranteed 8Å (1σ) or 0.1% step heightrepeatability and sub-angstrom resolution, the Alpha-Step IQ provides thebest repeatability and performance to analyze and monitor processes. Thissystem offers the most complete suite of two-dimensional analysis featuresfor topography on a variety of surfaces including semiconductor wafers, C4bumps, MEMS, ceramics, SIMS craters, microlenses, and displays. TheAlpha-Step IQ features advanced and customizable two-dimensional analy-sis capabilities that can measure step heights from 10 nm to 2 mm in ver-tical range. Software is available in English, Japanese, Mandarin, German,French, Italian, and Spanish, making it easy for customers with a world-wide presence to communicate their results, free of possible error in datainterpretation.

Spring 2003 Yield Management Solutions 39

Klarity ProDATA v1.4With the inclusion of new functions and capabilities, Klarity ProDATA version1.4 software redefines the state of the art in advanced lithography data analysis.Important new benefits to users include instantaneous viewing of SEM wafermap images to study across-wafer variation of CDs when accessing either thecurrent NT-based, or earlier Mac-based, KLA-Tencor CD SEM data; MackCDfitting function for CD that requires fewer parameters for a fit, improves noisefiltering, and creates a lithographically intelligent fit to FE data; polynomial fit-ting functions for sidewall angle and resist loss data that now support scat-terometry (SpectraCD) datasets; focus-exposure process window creation fromraw data, without fitting; and weighting factors that automatically weightKLA-Tencor CD SEM data points for more accurate fit and process windows.

µPCMThe new µPCM (Micro Photo Cell Monitoring) solution is an efficient and cost-effective methodology for controlling defect density in the lithography cell.Leveraging KLA-Tencor’s 23xx high-resolution inspection platform with inlineautomatic defect classification (iADC), together with optimized test vehicles,µPCM provides the highest sensitivity and capture rate required for eliminatinglithography-related micro defects. The µPCM solution consists of: the µPCMReticle™, optimized test vehicles, customized SPC and sampling strategies,industry-proven methodologies, and expert implementation and defect sourceisolation assistance. The µPCM Reticle, consisting of contact/via holes, linesand spaces, and trenches, is used in conjunction with optimized film stacks ontest wafers and KLA-Tencor’s 23xx wafer inspection system to reduce the timeto characterize new lithography processes and defect level baselines, and identi-fy excursions during manufacturing. µPCM provides the highest sensitivity to"true" process excursions, increases resolution to critical lithography defects,and decreases engineering time for root-cause determination.

NanoPro NP1™Designed to address 200-mm and 300-mm volume product requirements, theNanoPro NP1 is the industry's first single-tool solution for wafer geometry andnanotopography metrology. Combining wafer shape, thickness, flatness andnanotopography metrology in a single scan, it is the only metrology system thatcan monitor SOI and bare wafers inline at multiple points during the wafer pro-duction process. NanoPro NP1 features the precision/tolerance ratio requiredfor sub-130-nm technologies, and its near-zero contamination allows the tool tobe used in critical modules like bonding, where contamination would result inyield loss due to bonding voids. NanoPro NP1’s Grazing Incidence DifferentialInterferometer enables detection of topography changes of the top silicon layerfor new generation ultra-thin SOI wafers. This feature provides consistent mea-surement performance on all surfaces, while NanoPro NP1’s pattern wafer capa-bility decreases stepper qualification time and eliminates the production oppor-tunity loss due to routine wafer flatness measurement on the stepper by replac-ing the same measurements on the NanoPro NP1.

Want some useful insight into sub-100 nm process control? Look no further than Think Shrink. This must-readbook for litho and etch professionals offers proven pattern transfer process control strategies, including manythat have been successfully implemented in today’s most advanced fabs. All of which points to a thrillingconclusion: That with the right strategies and tools, it is possible to gain control of your litho and etch processand achieve high yield and productivity. Bringing your next device shrink intofocus much faster than you ever imagined.

Your next device shrink just got closer.

Accelerating YieldOrder your FREE copy today. www.kla-tencor.com/thinkshrink

©2003 KLA-Tencor Corporation. Think Shrink is a trademark of KLA-Tencor. Allow 4-6 weeks for delivery of book.

Order y

our

FREE

copy

.