1 Tutorial at ASCI 2008 Fast-Prototyping of Wireless Sensor Networks Jan Beutel, ETH Zurich.
M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status.
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Transcript of M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status.
M. Szelezniak 2PXL Sensor and RDO review – 06/23/2010
STARTalk Outline
• Development plan• LVDS data path at 160 MHz• Mass Termination Board • RDO Motherboard• Flex Cable
• Development• Preliminary Design• Alternative Approach• Infrastructure Test Board
• Interfaces to STAR• Prototype Telescope System in STAR
• Probe tests• Summary
M. Szelezniak 3PXL Sensor and RDO review – 06/23/2010
STARDevelopment Plan
PXL RDO Basic Unit
2 m (42 AWG TP)6 m (24 AWG TP)
100 m (fiber optic)
4 ladders per sector 1 Mass Termination Board (MTB) per sector 1 sector per RDO board 10 RDO boards in the PIXEL system
RDO motherboard + Xilinx Virtex-5 Dev Board
RDO PC with DDL link to RDO board
Mass termination board + latch up protected power daughtercard
← Front Back ↓
M. Szelezniak 4PXL Sensor and RDO review – 06/23/2010
STARLVDS Data Path at 160 MHz
2 ns eye patternopening for 1 m 42 AWG cables at 200 MHz
Ladder mock-up with 1-to-4 LVDS fanout buffers
Mass termination board + LU monitoring
42 AWG wires
24 AWG wires
Virtex-5 based RDO system with DDL link to PC
Status• Data Path Architecture Validated• Measured BER (bit error rate) of < 10-14
M. Szelezniak 5PXL Sensor and RDO review – 06/23/2010
STARMass Termination Board
Status• Prototype in hand.• Testing in
progress.
LU protection
LU protected power supply VDA,VDD
PLL
ADC
Mass Termination BoardLU protected power regulation board
• I2C ADC for sensor temperature monitoring
• PLL for CLK distribution with 50% duty cycle
• JTAG buffers LVDS LVCMOS
LVDS buffers JTAG buffers
M. Szelezniak 6PXL Sensor and RDO review – 06/23/2010
STARReadout Board
Status• 3 Prototypes in hand. • Firmware, hardware
and software are working for individual sensor testing.
Xilinx VIRTEX-5 development board
USB interface
DDL
LVDS buffers
50 MHz ADC
Custom readout board.
• fast ADC for sensor testing
• DDL for data acquisition
• USB for data acquisition / system monitoring
SRAM
M. Szelezniak 7PXL Sensor and RDO review – 06/23/2010
STAR
7
http://rnc.lbl.gov/hft/hardware/docs/Phase1/cable_power_gnd_trace_optimization.doc
Signal # of traces type Width (0.005” t&s)
Sensor output 10 x 4 x 2 = 80 LVDS 0.800” (20.32 mm)
CLK 2 LVDS 0.020” (0.51 mm)
CLK_RETURN 2 LVDS 0.020” (0.51 mm)
Marker 1 CMOS 0.010” (0.25 mm)
START 1 CMOS 0.010” (0.25 mm)
SPEAK 1 CMOS 0.010” (0.25 mm)
JTAG + RSTB 5 CMOS 0.050” (1.27 mm)
TEMP 2 analog 0.020” (0.51 mm)
Total 94 0.940” (23.88 mm)
Number of traces and required width to route (without vias) using industry standard 0.005” (125 µm) traces and spaces and with 17.5 µm Cu trace equivalent thickness.
Signal
7
Flex Cable Development
Power trace Width at thickest part
Analog power 0.220” (5.588 mm)
Digital power 0.098” (2.489 mm)
Ground 0.318” (8.077 mm)
Total 0.636” (16.154 mm)
Power
Analog power traces
Digital power traces
Ground return traces
wW = 23.08 mm
M. Szelezniak 8PXL Sensor and RDO review – 06/23/2010
STARFlex Cable – Preliminary Design
Hybrid Copper / Aluminum conductor flex cable
Low mass Sensor regionDriver region
Side view (exaggerated vertical scale)
Top View
• 2 layer Al conductor cable in low mass region• 0.004” (100 µm) traces and 0.004” (100 µm) spaces• 70% fill factor• Conductor thickness in low mass region is 21 µm (Cu) or 32 µm (Al)• Minimum required conductor trace width 1.325” (33.65 mm) of 46.16 mm available. • Bond wire connection between Al and Cu cable sections.
Low mass region calculated X/X0 for Cu conductor = 0.232 %Low mass region calculated X/X0 for Al conductor = 0.073 %
M. Szelezniak 9PXL Sensor and RDO review – 06/23/2010
STARFlex Cable – Preliminary Design (cont.)
Compared to the standard 4 layer Al conductor cable construction;
Advantages• One 2-layer Al conductor cable – less reliance on Al conductor
flex PCB fabrication process and less complex Al structure.• Lower radiation length than previous (not as well justified)
estimate.• More layers and thus more complex structures in the driver
region are possible (this may be needed).
Disadvantages• Wire bonding (or other high density connection technique)
required for inter cable connection.• Cable will not be the same thickness everywhere – may
complicate fixturing.• Non homogeneous CTE in cable.
M. Szelezniak 10PXL Sensor and RDO review – 06/23/2010
STARFlex Cable – Alternative Approach
Multi-layer single sided with aluminum conductor with cable on top of sensor • addresses aluminum via manufacturing issue • minimizes the cable X width • cable located on the top of the sensors partially obstructs the sensors for both
view and touch probe location measurements
X = 3.67 mm – exceeds the existing envelope by 0.77 mmX = 2.88 mm if Clock return and RSTB are neglected (production runs) – within the current mechanical envelope
VDD, VAA, GND, clock, temp, SPEAK (bonded to power) - ΔX not relevant
Sensor 120 µm + no stiffener
signal outputs, Clock return, marker, start, JTAG, RSTB – ΔX = 0.105” (2.67 mm)
M. Szelezniak 11PXL Sensor and RDO review – 06/23/2010
STARAluminum Flex Cable
• A single sided test cable design has been produced for fabrication at Datex to assess capability and quality.
• Some delay due to material issues. It is difficult to find anyone willing to fabricate kapton/Al.
• We have located some 1 mil Al on 1 mil mylar and shipped it to Datex. They are evaluating the suitability.
• Datex is about to start first attempt at fabrication.
• Other vendors (SE SRTIIE, Kharkov,Ukraine and CERN?) will be contacted.
• A detailed description of the challenge is available here http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc
M. Szelezniak 12PXL Sensor and RDO review – 06/23/2010
STARFlex Cable Status
PIXEL Cable development stages:
1. Infrastructure testing board
2. Prototype detector cable FR-4 with Cu traces
3. Prototype detector cable Kapton with Cu traces
4. Prototype detector cable Kapton with Al traces
Status• Preliminary FR-4 test version in hand
• Testing in progress
Infrastructure testing board with extended sensor testing capabilities
M. Szelezniak 13PXL Sensor and RDO review – 06/23/2010
STARInfrastructure Test Board
Coupling mechanism is under investigation. Next board with 50 μm Phase-2 prototypes is being assembled.
The first test of the complete RDO chain:
• 10-sensor ladder• MTB• RDO• long cables Ladder-like layout except for Power and GND
Very preliminary results with full thickness Phase-1 prototypes:
Status• Multidrop clock working• JTAG daisy chain working (with caveats)
• Testing in progress
Noise
One sensor at a time 100 %
All sensors on (high discriminator threshold → low switching/output activity) – expected running configuration
Up to 125 %(122 % on average)
All sensors on (low discriminator threshold → high switching/output activity)
Up to 145 %(138 % on average)
M. Szelezniak 14PXL Sensor and RDO review – 06/23/2010
STARPrototype Telescope System in STAR
Status• 3 Sensor (MimoSTAR2) telescope
used at STAR in 2007 RHIC run.• Clean noise environment at STAR• Successful tracking • No latch-up events were observed
during the run • Interfaces to Trigger and slow
controls worked well
M. Szelezniak 15PXL Sensor and RDO review – 06/23/2010
STARProbe Tests
Initial testing with ~75 μm travel past touchdown
30 μm additional lowering of probe pins
Phase-1 discriminator transfer functions ƒ(threshold voltage) observed on two of the probed sensors :
Sensors designed with dedicated probe pads in the sensor pad ring.
13 full-thickness, diced sensors probe tested.
Up to 3 probe tests on a sensor.
We will begin testing thinned sensors within the next few days
Status• Automated and scripted system
for sensor testing is in place.• Vacuum chuck for handling up to
twenty 50 μm thick sensors is being tested
• Ongoing sensor testing
M. Szelezniak 16PXL Sensor and RDO review – 06/23/2010
STARSummary
• RDO basic unit has been prototyped and successfully tested
• Development of the low mass flex cable has started
• The first FR4 ladder prototype is under test
• Interface to the STAR trigger and slow control systems successfully tested
• Automated probe test setup ready for testing thinned sensors