LTV-702F Product Data Sheet Photocoupler...1 /1 3 Photocoupler LTV -702F (M, S, S -TA, S -TA1)...

LITE-ON DCC

RELEASE

LITE-ON Technology Corp. / OptoelectronicsNo.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.

Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660http://www.liteon.com/opto

PhotocouplerProduct Data SheetLTV-702F (M, S, S-TA, S-TA1) series Spec No.: DS-70-96-0010Effective Date: 07/20/2016

Revision: F

BNS-OD-FC001/A4

BNS-OD-FC001/A4

BNS-OD-FC001/A4

BNS-OD-FC001/A4

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Photocoupler

LTV-702F (M, S, S-TA, S-TA1) series

Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4

Rev.: -

1. DESCRIPTION

1.1 Features

Current transfer ratio (CTR : 40% ~ 320% at IF = 10mA, VCE = 5 V, TA=25oC)

High input-output isolation voltage Viso = 5,000Vrms

High collector-emitter voltage ( VCEO = 70V )

Response time ( tr : TYP. 2s at VCC = 5V, IF = 10mA, RL = 75 ) Dual-in-line package :

LTV-702F

Wide lead spacing package :

LTV-702FM

Surface mounting package :

LTV-702FS

Tape and reel packaging :

LTV-702FS-TA, LTV-702FS-TA1

Safety approval * UL approved (No. E113898)

* TUV approved (No. R9653630)

* CSA approved (No. CA91533-1)

* FIMKO approved (No. 193422-01)

* NEMKO approved (No. P96103013)

* DEMKO approved (No. 303968)

* SEMKO approved (No. 9646047 / 01-30)

* VDE approved (No. 094722 )

RoHS Compliance

All materials be used in device are followed EU RoHS directive (No.2002/95/EC).

ESD pass HBM 8000V/MM2000V

MSL class1

1.2 Applications

Directly connectable to TTL

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2. PACKAGE DIMENSIONS

2.1 LTV-702F 2.2 LTV-702FM

2.3 LTV-702FS

Notes :

1. Year date code.

2. 2-digit work week.

3. Factory identification mark shall be marked

(Y: Thailand, W: China-CZ).

4. Rank shall be or shall not be marked.

5. For VDE option.

Dimensions in millimeters (inches).

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3. TAPING DIMENSIONS

3.1 LTV-702FS-TA

3.2 LTV-702FS-TA1

3.3 Quantities Per Reel

Description Symbol Dimension in mm (inch)

Tape wide W 16±0.3 (0.63)

Pitch of sprocket holes P0 4±0.1 (0.15)

Distance of compartment F 7.5±0.1 (0.295)

P2 2±0.1 (0.079)

Distance of compartment to compartment P1 12±0.1 (0.472)

Package Type TA / TA1

Quantities (pcs) 1000

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4. RATING AND CHARACTERISTICS

4.1 Absolute Maximum Ratings at Ta=25°C

Parameter Symbol Rating Unit

Input

Forward Current IF 60 mA

Reverse Voltage VR 6 V

Power Dissipation P 105 mW

Junction Temperature TJ 125 oC

Output

Collector - Emitter Voltage VCEO 70 V

Emitter - Collector Voltage VECO 6 V

Collector Current IC 50 mA

Collector Power Dissipation PC 160 mW

Total Power Dissipation Ptot 200 mW

*1 Isolation Voltage Viso 5000 Vrms

Operating Temperature Topr -55 ~ +100 °C

Storage Temperature Tstg -55 ~ +150 °C

*2 Soldering Temperature Tsol 260 °C

*1. AC For 1 Minute, R.H. = 40 ~ 60%

Isolation voltage shall be measured using the following method.

(1) Short between anode and cathode on the primary side and between collector and emitter on the

secondary side.

(2) The isolation voltage tester with zero-cross circuit shall be used.

(3) The waveform of applied voltage shall be a sine wave.

*2. For 10 Seconds

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*CTRI

I100%C

F

4.2 ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25°C

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS

INPUT

Forward Voltage VF — 1.4 1.7 V IF=60mA

Reverse Current IR — — 10 A VR=6V

Terminal Capacitance Ct — 30 250 pF V=0, f=1KHz

OUTPUT

Collector Dark Current ICEO — — 50 nA VCE=10V, IF=0

Collector-Emitter

Breakdown Voltage BVCEO 70 — — V

IC=0.1mA

IF=0

Emitter-Collector

Breakdown Voltage BVECO 6 — — V

IE=10A

IF=0

TRANSFER

CHARACTERISTICS

Collector Current IC 4 — 32 mA

IF=10mA, VCE=5V

*Current Transfer Ratio CTR 40 — 320 %

Collector-Emitter

Saturation Voltage VCE(sat) — 0.25 0.4 V

IF=10mA

IC=2.5mA

Isolation Resistance RISO 51010 11011 — DC500V

40 ~ 60% R.H.

Floating Capacitance CF — 0.6 1 pF V=0, f=1MHz

Cut-Off Frequency fC — 150 — kHz VCC=5V, IF=10mA

RL=75, -3dB

Response Time (Rise) tR — 2 7 s VCC=5V, IF=10mA

RL=75 Response Time (Fall) tf — 2 8 s

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5. RANK TABLE OF CURRENT TRANSFER RATIO CTR

CTR Rank Min Max Condition

A 40 80

IF=10mA, VCE=5V, TA=25oC

B 63 125

C 100 200

D 160 320

No mark 40 320

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6. CHARACTERISTICS CURVES

Fig.1 Forward Current vs. Fig.2 Collector Power Dissipation vs.

Ambient Temperature

Fig.4 Forward Current vs.

Fig.5 Current Transfer Ratio vs.

Forward Current

Fig.6 Collector Current vs.

Collector-emitter Voltage

Forward voltage V (V)

Forward current I (mA)

F

F CE

FF

orw

ard

curr

ent I (

mA

)

F

-55

Ta= 75 C50 C

25 C

0 C

-25 C

Ta= 25 C

I = 30mA

Pc(MAX.)

5mA

10mA

20mA

F

80

R =

500k100k

2mA

Ambient Temperature

Forw

ard

curr

ent I (

mA

)

Ambient temperature Ta ( C) Ambient temperature Ta ( C)

Colle

cto

r p

ow

er

dis

sip

ation P

c (

mW

)C

olle

cto

r curr

ent Ic

(m

A)

Curr

ent tr

ansfe

r ra

tio C

TR

(%

)

Collector-emitter voltage V (V)

60

40

20

0-25 0 25 50 75 100 125 50-25-55 0 25 12575 100

200

100

50

150

0

160

01

0.5 1.0 1.5 2.0 2.5 3.0

2

5

10

20

50

100

200

500

00 2 4 6 8 10

5

10

15

20

25

30

35

40

45

00

2 5 10 20 50

20

40

80

100

120

140

160

200

180

60

Forward Voltage

o

o

o

o

o

o

o

oo

Fig.3 Collector-emitter Saturation

Voltage vs. Forward Current

Forward current I (mA)F

Colle

cto

r-em

itte

r satu

ration v

oltag

eV

(s

at)

(V

)

2mA

3mA

1mA

5mA

Ic= 0.5mA Ta= 25 Co

0 2.5 5.0 7.5 10.0 12.50

1

2

3

4

5

6

VCE= 5V

Ta= 25 C

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Fig.11 Frequency Response

Fig.9 Collector Dark Current vs.

Vo

ltag

e g

ain

Av

(dB

)

Frequency f (kHz)

-8

-100.5 1

-4

-2

-6

2 5 10 20

R = 200

50010050 200

150 75

Ambient temperature Ta ( C)

10

Co

llecto

r d

ark

curr

ent I (

A)

2

0

10

10-30

-13

-12

200 40

Ambient Temperature

10

10

10

10

CE

O

-11

-10

-9

-8

10

-7

-6

100o

60 80

Load resistance RL (k )

Load Resistance

Fig.10 Response Time vs.

Resp

onse tim

e (

s)

1

0.50.02 0.05

10

5

2

0.1 0.2 0.5

tr

tf

o

Fig.7 Relative Current Transfer Ratio vs.


50

Rela

tive

curr

ent tr

ansfe

r ra

tio

(%

)

-550

100

0-25 25

Ambient Temperature

150

100o

7550

vs. Ambient Temperature


Fig.8 Collector-emitter Saturation Voltage

Co

llecto

r-em

itte

r satu

ratio

n v

oltag

e

0.14

0.12

0.10

0.08

0.06

0.04

0.02

0-55

V (

sat)

(V

)-25 0

0.16

7525 50o

100

90%

Test Circuit for Frequency Response

Output

Vcc

td

tr

ts

tf

Output

Test Circuit for Response Time

Input

VccInput

Output

10%RDRL

RLRD

IF= 10mA

VCE= 5V

IF= 10mA

VCC= 5V

Ta= 25 C

IF= 10mA

IC= 2.5mA

VCE= 10V

IF= 10mA

VCC= 5V

Ta= 25 Co

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7. TEMPERATURE PROFILE OF SOLDERING

7.1 IR Reflow soldering (JEDEC-STD-020C compliant)

One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times.

Profile item Conditions

Preheat

- Temperature Min (TSmin)

- Temperature Max (TSmax)

- Time (min to max) (ts)

150˚C

200˚C

90±30 sec

Soldering zone

- Temperature (TL)

- Time (tL)

217˚C

60 sec

Peak Temperature (TP) 260˚C

Ramp-up rate 3˚C / sec max.

Ramp-down rate 3~6˚C / sec

60 ~ 120 sec

25 C

150 C

200 C

260 C

217 C

60 sec

Time (sec)

Tem

pera

ture

( C

)

20 sec

Tsmax

ts (Preheat)

tL (Soldering)

Tsmin

TL

TP

Ramp-down

Ramp-up

35~70 sec

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7.2 Wave soldering (JEDEC22A111 compliant)

One time soldering is recommended within the condition of temperature.

Temperature: 260+0/-5˚C

Time: 10 sec.

Preheat temperature:25 to 140˚C

Preheat time: 30 to 80 sec.

7.3 Hand soldering by soldering iron

Allow single lead soldering in every single process. One time soldering is recommended.

Temperature: 380+0/-5˚C

Time: 3 sec max.

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8. RECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD)

Unit: mm

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9. NAMING RULE

Example : LTV-702FS-TA1-A

Example : LTV702FSTA1A-V

(2) TAPING TYPE (TA, TA1)

Please refer to orientation of taping on Page: 3

(1) No suffix = Dual-in-Line package

M = Wide lead spacing package

S = Surface mounting package

DEVICE PART NUMBER

LTV702F(1)(2)(3)-V

(4) VDE order option

(3) CTR RANK (A,B,C,D or none)

Please refer to the CTR table on Page: 6

(2) TAPING TYPE (TA, TA1)

Please refer to orientation of taping on Page: 3

(1) No suffix = Dual-in-Line package

M = Wide lead spacing package

S = Surface mounting package

(3) CTR RANK (A,B,C,D or none)

Please refer to the CTR table on Page: 6

DEVICE PART NUMBER

LTV-702F(1)-(2)-(3)

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10. NOTES

LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes

without further notices.

The products shown in this publication are designed for the general use in electronic applications such as office automation

equipment, communications devices, audio/visual equipment, electrical application and instrumentation.

For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment,

Medical equipment, etc, please contact our sales representatives.

When requiring a device for any “specific” application, please contact our sales in advice.

If there are any questions about the contents of this publication, please contact us at your convenience.

The contents described herein are subject to change without prior notice.

Immerge unit’s body in solder paste is not recommended.

LTV-702F Product Data Sheet Photocoupler...1 /1 3 Photocoupler LTV -702F (M, S, S -TA, S -TA1)...

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