NEP14-01E

Low-Ag/Ag-free solder pastes with lower void

LS720V Series

Features

Specifications

● Reduces voids by improving �uidity of �ux during solder melting● Reduces voids even in bottom surface electrode type 　components by improving solder wettability ● LS720V �ux which can be used for low-Ag/Ag-free alloys

● Main reason of void formation 　and the measure

● Comparison of crack progression 　 between Sn-Cu-Ni-Ge and M773

● The effect of LS720V is observed in 　 suppressing void formation

● Joint strength improved with the addition of 　 Bi and Ni (compared to 0% Ag material)

● Effect of Ni addition

Although voids are tend to occur when bottom surface electrode type components such as QFN frequently, it can be reduced by LS720V

100% Crack progression Approximately only 30% crack progression

Replacing Cu with Ni makes the construction of the bonding surface �ner and thus increases strength

Cycle conditions: -40℃ to +125℃, after 1000 cycles

Surface treatment: Cu-OSP

Bottom surface electrode

Conventional product LS720V product

Appearance of QFN

Improvement

Without Ni

Reflow: 1time

Reflow: 4times

With Ni

PWB

QFN

SolderVoid

Conventional product LS720V Conventional product LS720V

4mm QFN 8mm QFN

50

40

30

20

10

0

Void

are

a ra

tio (%

)

● Development of Ag-free/M773 alloy

M705M40M47M773

Price

Lowerprices

2000 2010 2013

Achieves Ag-free while confrming reliability

Solder paste

M705

M40

M47

M773

3.0% Ag

1.0% Ag

0% Ag

0.3% AgSn-3.0Ag-0.5CuSn-1.0Ag-0.7Cu-1.6Bi-InSn-0.3Ag-0.7Cu-0.5Bi-NiSn-0.0Ag-0.7Cu-0.5Bi-Ni

Stre

ngth

(N)

Number of temperature cycle (Cycle)

M705；SAC305M773

Sn-Cu-Ni-Ge

M773；Sn-Cu-Bi-Ni80

70

60

50

40

30

20

0 200 400 600 800 1,000 1,200 1,400 1,600

-40℃/30min ⇔ +85℃/30minEvaluation using chip resistors

Sn-Cu-Ni-Ge M773

Voids are caused by reducing gas from residual �ux and poor solder wettability

Sufficient quantity of solder and excellent fusibility that makes mounting of 0201-type chip components possible

NEP14-02E

M705-RGS800HF Type6

Features

Specifications

● Suf�cient solder quantity ensured by using Type 6 size 　 �ne powder● Newly developed highly active �ux facilitates removal of 　 oxide �lm● Uniquely developed �ux suppresses reoxidation in re�ow

● Printing on a pattern with openings φ130µm in 　 diameter and a mask 60 µm in thickness with 　 various types of powders

● Flux developed along with �ner solder powderSolder paste for 0201-type chip components

Type 6 ensures suf�cient printing

0402-type component mounting 0201-type component mounting

Component supplier: Murata Manufacturing Co., Ltd.

With Type 6 powder, the surface area and the oxide �lm area are doubled compared to Type 5 powder

Type4

Type4

Type4

Type5

Type6

Type6

Type4

Insufficient printing with too much flux

Fusion defect

Halogen-free

Conventional �ux RGS800

Narrower pitch

● Type 6 powder is necessary for land patterns 　 for 0201-type chip components

● Ultra-high density mounting made possible by 　 mounting of microscopic components

Suf�cient solder quantity cannot be obtained with large solder particle size

Type4

Type6

Insufficient printing

Sufficient printing

Type4

Average particle size:Approx. φ30 µm

Type5

Average particle size:Approx. φ20 µm

Type6

Average particle size:Approx. φ10 µm

Type5

Insufficient printing with too much flux

Type6

Sufficient quantity of printing

● Finer solder powder proportionate to 　 smaller land area

Solder paste for 0201-type chip components

Type4

Type5Type6

Sold

er p

owde

r dia

met

er

0603-type 0402-type 0201-type

Land area

Φ30μm

Φ20μm

Φ10μm

Development

2000

2020

2010

1005-type 0603-type 0402-type 0201-type

GRN360

GWS

S70G

RGS800

RGS800

● Fusion defects are caused with a paste consisting 　 of Type 6 powder and conventional �ux

Promises good wettability despite being Ag-free

NEP14-03E

NEO2 M24AP

Features

Specifications

● Quick initial wetting with the use of fast acting active agents ● Smooth wet spreading achieved by improving �uidity of �ux● Highly heat-resistant activator makes good 　detachability possible

● Enables Fast soldering

● Highly heat-resistant activator inhibits formation 　of spikes and bridges

● Good results compared to Sn-Cu-Ni-Ge

● Mixture of different types of materials 　 does not cause problems

● High reliability and Ag-free realize the lower price

Achieves Ag-free while con�rming reliability

2000 2010 2015 2020

Flux cored

Paste

M705M794

M35

M40

M24AP

M47

M773

3.0% Ag

1.0% Ag

0.3% Ag

0% Ag0% Ag

0.3% Ag

5

4

3

2

1

0

NEO M24APSn-Cu-Ni-Ge-P

Sn-Cu-Ni-Ge

NEO M24AP

Sn-Cu-Ni-Ge-P

Sn-Cu-Ni-Ge

NEO M24APSn-Cu-Ni-Ge-P

Sn-Cu-Ni-Ge

50

45

40

35

30

25

20

15

10

5

0

100

90

80

70

60

50

40

30

20

10

00 1 3 5 10 20 50 80 90 95 97 99 100NEO M24AP

Sn-Cu-Ni-Ge-P

Sn-Cu-Ni-Ge

Price

Lowerprice

Insulation reliability

Wetting speed

Wetting spread

Heat resistance

Scattering resistance

Color appearance

Cost

Smoke

Shorter time ＝ Improves working efficiency ＝ Realizes cost cuts ＝ Contributes to energy saving

Working ef�ciency up by 33%

Time reductionby 33%

Elapsed time 0s 0.5s 1.0s 0.5s

Tens

ile s

treng

th [M

pa]

Brea

king

elo

ngat

ion

[%]

M24AP Mix Ratio

Tensile strengthBreaking elongation

Choose the optimum chip solder from among three types

NEP14-04E

Chip solder

Features

Specifications

● They come in tape and reel packaging which allows simultaneous 　automatic placement on surface mount devices● Melts in tandem with solder paste, requiring no additional 　soldering● Provides an appropriate amount of solder to ensure high 　connection reliability

Chip solder

Solder preform Flux Highly viscose flux

·Mounted and fused on solder paste

·Low price type

·Improved solder wettability·Inhibits reoxidation in re�ow ovens·Allows air re�ow soldering

·Directly mounted and fused on copper lands or components

Flux coated chip solder Type A

Flux coated chip solder Type B

● Choose from among three types that applies to your intended use

(unit: mm)

l

±0.05

±0.1

±0.1

±0.1

0402

0603

1005

1608

±0.05

±0.1

±0.1

±0.1

w

±0.05

±0.05

±0.05

±0.05

t

Reference exhibit

● Automatically mounts chip solder, which melts simultaneously with solder paste

Solder pasteprinting

Componentmounting

Re�ow

Chip solder

Chip soldermounting

Solder pasteprinting

Componentmounting

Re�ow

● For joint reinforcement of large components

Componentmounting

Land Solder paste

Solder pasteprinting

Largecomponent

Largecomponent

Chip solder

Solderingcomplete

● Improves mounting precision by smoothing the suction face

Air enters when the suction ace is curved,weakening the suction force

No air enters when the suctionface is �at and the suction face is strong

Chip solder

Air Air

Chip solder witha smooth

suction face

Smoothing of thesuction face

Improvement ofmounting precision

* Smooth suction face design is available in sizes smaller than the 0603-size type* Patent pending

● Chip solder dimension tolerance

Form 120µm-pitch bumps with Φ4μm alloy powder

Solder Paste for Bump Forming BPS Series

NEP14-05C

Features

Specifications

● Excellent sticking characteristic forms �ne bumps in 　each process● Realizes excellent melting characteristic even when 　Type 7 or �ner powder● Good solder wettability enables bump formation with fewer voids

● Trend towards �ne pitch

● Pitch sizes and bump formation in various 　 supplying methods

● Excellent �ux prevents heat sags and forms 　 good bumps

● Even though �ne powder, still has good 　 wettability and forms bumps with fewer voids

● Forms good bumps even when using paste 　 with �ne powder because of excellent 　 melting property

● Forms 120 µm pitch bumps with φ4µm alloy powder

Metal mask Type 7 (φ1 to 10 μm) Type 7 or �ner (φ1 to 6 μm)

120 µm pitch printing

Opening size

Solder

Narrower and thinner

Mask opening size

Conventionalproduct

Conventional product

Preheating

180˚C-3min

Preheating

180˚C-3min

BPSseries

BPS series

After printing Bump formation after re�ow

Uniquely developed �ux prevents oxidation

MovementRolling

Movement

Stencil Pressurization

RollingMovement

Dry �lm

Type 7 or �ner90 to 150 mm pitch

Type7110 to 180 mm pitch

Type6160 mm pitch or more

Dry �lm methodCartridge methodOpen squeegee method

NEP14-06E

A high-reliability WLCSP solder ball

M758

Features

Specifications

● Forms bumps with high joint strength on wafer electrodes

● Good wettability on copper plating such wafer electrodes

● Packaged M758 has excellent thermal fatigue resistance

● M758 forms bumps having high joint strength on wafer electrodes

● Good wettability on copper plating such wafer electrodes

● Packaged M758 shows good results in temperature cycle test

Failure mode5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

SAC305 SAC405 M758

Shear height

CuPlating

Shear tool ShearFailure Mode Mode1

Pad Solder Solder & Interface Interface

Mode2 Mode3 Mode4

M758 forms bumps having high strength on the package level by the surface reforming effect of added Ni

The failure mode in every test is Mode 4: Interface failure

Stre

ngth

(N)

Shear Strength

1.3

1.2

1.1

1

0.9

0.8

SAC305 SAC405 M758M758 has good wettability for Cu plated package

M758 has excellent thermal fatigue resistance due to solid solution strengthening with Bi added compared to conventional products, such as SAC305 and SAC405.Also, M758 has drop impact resistance equivalent to or more than that of conventional products

Leng

th(m

m）

Spreadability test resultTesting method

Reflow oven（245℃） O₂;<200ppm

Flux

Cu plating

Measured location

Measuredlocation

99.9

10

1100 1,000 10,000 100 1,000 10,000

99.9

10

1

TCT Drop

Accu

mul

atio

n ra

te.%

Cycle number Drop number

Accu

mul

atio

n ra

te.%

ProductName Composition Melting

Point (%) Note

M705 SAC305 217-220 Pb-free Standard

M710 SAC405 217-229

M758 205-215 Suitable material for WLP

S/F : Cu WLCSP : Size 7 x 7mm

Cu core ball facilitate 3D packaging and narrow-pitch mounting

Cu Core Ball

Features

Specifications

NEP14-07E

● Ensures space to easily realize a highly-reliable component-built structure● Enables narrow-pitch mounting that can be performed through Cu pillar mounting using existing equipment● Promises high heat dissipation and electromigration countermeasures

● Ensures space through its multilayer structure with a Cu core

● Cu core ball facilitate 3D packaging

Cu ball

Solder plating

Cu ball

Ni plating

Solder plating

Cu core ball (spacer)

The Cu core ball ensure space to easily realize a highly-reliable component-built structure

Realizes good drop resistance Exhibits a temperature cycle equivalent to that of a conventional product

● Characteristics

● Enables narrow-pitch mounting without short circuit risk with existing equipment

● Drop test and temperature cycle test

PKG

PCBPCB

PKG

PCB

PKG

Solder ball

Cu core ball

Superior electromigration resistance

Temperature cycle test

Ensures appropriatespace

Inclination

Short

PCB

PKG

Cu has good thermal conductivity

PCB

PKG

PCB

PKG

Electromigration Ensures space Heat dissipation

Solder platingCu plating

Eliminates the plating processes required in Cu pillar mounting

Cu pillar mounting Cu core ball mounting

Cu core ball

Drop Number

Cum

ulat

ive

Freq

uenc

y

Drop testC-Cu M90M705 (conventional product )

C-Cu M90M705 (conventional product)

Cycle Number

Cum

ulat

ive

Freq

uenc

y

1

10

100

1 10 100 10001

10

100

1 10 100 1000

NEP14-08E

A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering

WF6317

Features

Specifications

● Mounts solder balls with good squeezing property and ball holding force

● No �ux residue after washing with 　 warm water at 40˚C

● Low-volatile �ux inhibits contamination of re�ow ovens

Solder ball

Flux printing Flux transfer Ball mounting Ball fusion and bondingFlux

Suction head

Suction head

Suction headSuction head

Package

Suction head

Package

Suction head

● Washing with water within 8 hours after mounting can remove �ux residue

Washed after 0h Washed after 4h Washed after 8h Washed after 12h

Residue

Washingwith water

No flux residue

● Excellent wettability even on Cu-OSP PBC

WF-6317 Conventional flux

Res

idue

(%)

100

50

0250Reflow temperature (˚C)

Low-volatile fluxWF-6317

Low-residue flux

Residue-free flux

● Low viscosity and high tacking power stabilize ball holding 　 force and ensures excellent solder wettability● Easy to wash out water-soluble �ux which can be used for 　 Pb-free re�ow soldering at 250˚C● Prevents and inhibits contamination of re�ow ovens with 　 low-volatile �ux

NEP14-09E

Achieves excellent heat dissipation characteristics in horizontal packaging that suppresses void formation

Solder Paste Containing Ni Balls

Features

Specifications

Increased voids Decreased electrical resistance

and heat dissipation

Uniform thickness Void reduction High quality alloy

● Suppresses cracks caused by solder thickness or inclination 　 and achieves soldering with high heat dissipation● Bare chips without inclination enable highly reliable wire 　 bonding● Suppresses voids by an originally developed method by 　 optimally blending Ni balls of a uniform size

● Solves problems with power 　 device mounting

● Originally developed Ni balls of a uniform size allow high heat dissipation

● Optimal formulation of Ni balls suppresses 　 void formation

● Achieves horizontal mounting using solder 　paste with Ni balls

Solves problems with power device mounting

Normal solder pastes have a risk of inclination of chips

Air layers in cracks inhibit heat conductivity and reduce heat dissipation

Ni balls reduce variation in solder thickness

Solder thickness at each measured point

Printing Mounting Fusion

Printing Mounting Fusion

●Without Ni balls

Good heat dissipation●With Ni balls

Solder paste with Ni balls allows horizontal packaging by using spacer effects

Development of Ni balls of a uniform size

Spacer With spacer Without spacer

Development oforiginal paste

Development of various alloysaccording to intended use

Sold

er th

ickn

ess

[µm

]

With Ni balls Without Ni balls

Solder

Solder

Powder

Chip

PCB

Powder

Bare chipPreform

Ni ball

Ni ball

Crack causedby inclination

Crack due tothin solder layer

Ni ball

Semiconductor device

Insulated substrate

Heat sink

Cracks generated at thin portions during cooling cycle

Selection of a solder alloywhich can withstand severe conditions

The chip is inclined and the solder thickness is uneven

Ni balls secure standoff for parts

NEP14-10E

Void-free soldering with residue-free paste

NRB70

Features

Specifications

● Achieves void-free soldering of power devices 　 with the vacuum re�ow oven SVR-625GT

● Changing heat-evaporating materials decreases 　 the �ux residue ratio to 5% or less and realizes 　 no-clean solder paste

● Residue-free and excellent wettability 　 even with N2 re�ow oven

● Residue-free mounting of �ne pitch microscopic 　 components made possible with Type 5 powder 　 and NRB70H

● No interference with repletion of under�ll 　 in BGA mounting

Degree of vacuum (Pa)

ø200 µm dot printing part 0.4 mm pitch part 0603 -type component

20

15

10

5

0No vacuum 30000 20000 10000 5000

Paste: M705-NRB70

Void

are

a ra

tio %

The void area ratio is decreased to 1% by controlling the degree of vacuum

Resi

due

(%)

100

50

0250Reflow temperature (℃)

Low-volatile flux

Low-residue flux

Residue-free fluxNRB70

Residue-free = Residue ratio is 5% or less(defined by SMIC)

General-purpose paste

Residue-free paste

Oxygen density: 1500 ppm or less

φ200 µm dot printing part 1005 -type chip component

● Vacuum re�ow oven SVR-625GT realizes void-free 　 and residue-free soldering● Achieves highly reliable soldering with residue-free 　and no-clean solder paste● No cleaning liquid reduces environmental burden 　and realizes lower price

NEP14-11E

Ideal as a lead-free high-temperature solder alternative

Ag Nano Paste

Features

Specifications

● Sinters and binds at 250℃ and does not 　 remelt at temperatures of up to 960℃, 　 which is the melting point of Ag

● Ohmic contact with resistance values similar 　to that of silver

● Sintered state

● Photos of Ag nano sintered body

● Performance list

● Applicable to various uses by taking advantage 　 of paste that does not remelt at temperatures 　of up to 960℃

Best for mounting of power modules and LEDs of which operating temperatures are high For LEDs of which

operating temperatures are high

For die bonding of devices

For internal connection in 3D mounting

Adjacent particles reduce surface area and join with one another (necking)

Protects with organic molecules to prevent sintering at room temperature

The protective layer is decomposed at 250℃

25

20

15

10

5

0

Ag nano paste Ag nano paste

PCB

Bare chip

Sintering

Ag Sn Conductive paste Ag nano paste

Comparison of speci�c resistance values

Spec

ific

resi

stan

ce v

alue

/ µΩ

・cm

Item

MetalSintering

temperatureForm

Particle sizeViscosity

Specific resistance valueInsulation resistance

Migration(85℃,85%RH)

Flux content

Tackiness

12

345678

9

10

Powder

Paste

Silver nano particle200 to 300℃

Thin foil< 300mm

30 to 100 Pa·s< 10µΩ·cm

1×1010 Ω or moreNo occurrence

(1000h)10 to 12%

1.0N

- - - -TG-DTA

(differential thermal analysis)SEMSEM

RheometerResist mat

Based on JIS Z 3284Based on JIS Z 3284

TG-DTA(differential calorimetry)Based on JIS Z 3284

Performance Test method

Ag nano sintered body

Cu

Si

Ag nano sintered body

● Sinters and binds at 250℃ and does not remelt at 　 temperatures of up to 960℃, which is the melting 　 point of Ag● Ohmic contact with resistance values similar to 　 that of silver● Can be supplied both for printing and dispensing

NEP14-12E

Features

Specifications

New alloy with excellent thermal fatigue characteristics developed for automotive industry (ECU)

Solder Paste M794 Series

● Comparison of the crack growth after 　 Thermal Cycle Test

● Microstructure of M794 as re�ow

● Distribution of the crack growth ratio after 　 2000 cycle Thermal Cycle Test

Crystal Grain became coarse by TCT in SAC305

[SAC305]

Sn-3Ag-3.0Bi-3.0Sb-Ni-x

Cra

ck G

row

th R

atio

(%)

–40℃/30min ⇔ 125℃/30min

Number of cycles (cycle)

Shea

r stre

ngth

(N)

● Comparison of thermal fatigue resistance 　between alloys

● Addition of Ni +x limits the coarsening of the formation and blocks crack growth elements

Cycle

100

80

60

40

20

00 500 1,000 1,500 2,000 2,500

3216CR,–40℃/30min ⇔ 125℃/30min

Cra

ck G

row

th R

atio

(%)

M794SAC305

SAC305

100

80

60

40

20

0M794

100

80

60

40

20

0

Initial TCT 3,000cyc

M794 keep the fine grain scale after TCT

[M794]Ni and x added

Initial TCT 3,000cyc

Solid solution elements Bi and Sb are added to Sn-Ag-Cu eutectic composition to improve the mechanical strength. Also, Ni and x are added to inhibit coarsening.

(n=11 samples)

● High proof thermal fatigue is realized by using an effect of solid solution and intermetallic compounds● The electric connection is maintained by prevention of crack progress● Halogen free paste is available● Options for nitrogen and air re�ow are available

M794

M705

60

50

40

30

20

10

00 500 1,000 1,500 2,000 2,500 3,000 3,500