LOCTITE® GC 18 – THE GAME CHANGERLOW VOIDING, TEMPERATURE-STABLE SOLDER PASTE

soldergamechanger.com

Following the introduction of its award-winning,

temperature-stable LOCTITE® GC 10 solder paste,

Henkel has brought to market the latest product in

the LOCTITE GC series. LOCTITE GC 18 upholds the

performance attributes required for demanding

SMT environments, maintaining stability for 6

months when stored at 26.5°C and for one month

at temperatures up to 40°C. This material is

designed to improve transfer efficiency for fine-

pitch components and has good fluxing action on

challenging surface finishes. As a result, the material

also reduces void occurrences on BGAs, chip resistors

(CRs), chip capacitors (CCs), SOICs, QFPs, and a full

range of QFN packages. Sustainability is built in to

LOCTITE GC 18 as it facilitates the elimination of

costly nitrogen reflow processes, reduces rework,

lowers processing costs and cuts PPM defects.

Competitor Material Voiding Level

LOCTITE GC 18Low Voiding

All marks used above are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S., Germany and elsewhere. © 2020 Henkel Corporation. All rights reserved. LT-8328 (02/20)

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LOCTITE® GC 18 BENEFITS

LOCTITE GC 18 ATTRIBUTES

IMPROVED STABILITY IMPROVED REFLOW IN AIR BEST-IN-CLASSPOST-REFLOW RELIABILITY

IMPROVED PASTE MANAGEMENT

On-line stencil stability: Good process capability after up to 12 hours printing.

Excellent coalescence in long, hot profiles for 0201 and 0.4 mm pitch components.

Specially formulated to provide low voiding when soldering Bottom-Terminated Components (BTC- QFN, DPAK and LGA)

Exceptional on-line paste utilization.

6 times the stability of conventional paste.Excellent coalescence after storage of printed paste for up to 48 hours at 80% relative humidity.

Residues are compatible with encapsulation technology.

Eliminates end-of-day paste scrapping.

Elevated temperature stability is 100 times that of conventional paste.

Minimal hot slump at 190°C.Post-reflow residues are benign and cleanable with existing chemistries.

Eliminates refrigerated pre-production and warehouse storage.

Improves shipping logistics management.Best-in-class cosmetic appearance for Pb-free solder joints.

Flux residues are suitable for in-circuit test (ICT) even after multiple reflows.

Eliminates cold pack, dry ice and overnight shipping.

Excellent long-term tackiness when small printing deposit volumes required.

Capable of reflow in air or nitrogen.High SIR improves moisture resistance in challenging end-applications.

Zero startup time without refrigeration. 

ATTRIBUTES TYPICAL TECHNOLOGY LOCTITE GC 18

FLUX Regulatory Compliance Halide-free or halogen-free Zero halogens added

IPC J-STD-004B Classification ROL0 ROL0

POWDERParticle Size Distribution Type 4 Type 4

Alloy SAC305 SAC305

STORAGE

Performance Stable at 25°C 1 month 6 months

Performance Stable at 40°C 1 day 1 month

Performance Stable at 50°C None 1 week

PROCESS On-line Paste Utilization 75% > 95%

PRINTINGStencil Life Up to 8 hours Up to 12 hours

Startup Time 4 – 24 hours 0 hours without refrigeration

REFLOW

Soak Temperature 150 – 180°C 150 – 200°C

VOIDS: BGA IPC Class III IPC Class III

VOIDS: CR/CC < 20% < 10%

VOIDS: QFN 3x3 mm 25% < 10%

VOIDS: QFN 12x12 mm 50% < 20%

Time Above Liquidus (TAL) 20 – 90 sec. 60 – 120 sec.