List of integrated circuit packaging types 1

List of integrated circuit packaging types

A standard-sized 8-pin dual in-line package (DIP)containing a 555 timer IC.

Integrated circuits are put into protective packages to allow easyhandling and assembly onto printed circuit boards and to protect thedevices from damage. A very large number of different types ofpackage exist. Some package types have standardized dimensions andtolerances, and are registered with trade industry associations such asJEDEC and Pro Electron. Other types are proprietary designations thatmay be made by only one or two manufacturers. Integrated circuitpackaging is the last assembly process before testing and shippingdevices to customers.

Occasionally specially-processed integrated circuit dies are preparedfor direct connections to a substrate without an intermediate header orcarrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, themetallized pads that would be used for wire bonding connections in a conventional chip are thickened and extendedto allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling withepoxy to protect the devices from moisture.

Through-hole

Three 14-pin (DIP14) plastic dual in-linepackages containing IC chips.

• Single in-line package: SIP• Dual in-line package (DIP) (.1" pin spacing, rows .3" or .6" apart)• CDIP: Ceramic DIP• CERDIP: glass sealed ceramic DIP• QIP: Quadruple in-line package, like DIP but with staggered

(zig-zag) pins.• SDIP: Skinny DIP (standard DIP with .1" pin spacing, rows .3"

apart)• ZIP: Zig-zag in-line package• MDIP: Molded DIP[1]

• PDIP: Plastic DIP

Surface mount•• CCGA: ceramic column grid array (CGA)•• CGA: column grid array•• CERPACK: ceramic package•• CQGP:•• LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)• LGA: Land Grid Array• LTCC: Low temperature co-fired ceramic• MCM: Multi-Chip Module•• MICRO SMDXT: micro Surface Mount Device extended technology

List of integrated circuit packaging types 2

Chip carrierA chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leadswrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on theedges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board bysoldering, though sockets can be used for testing.•• BCC: Bump Chip Carrier•• CLCC: Ceramic Leadless Chip Carrier•• LCC: Leadless Chip Carrier, contacts are recessed vertically.•• LCC: Leaded Chip Carrier•• LCCC: Leaded Ceramic Chip Carrier•• DLCC: Dual Lead-Less Chip Carrier (Ceramic)•• PLCC: Plastic Leaded Chip Carrier

Pin grid arraysMain article: Pin grid array•• OPGA: Organic Pin Grid Array•• FCPGA: Flip-chip Pin Grid Array•• PAC: Pin Array Cartridge•• PGA: Pin grid array (also known as PPGA)•• CPGA: Ceramic Pin Grid Array

Flat packagesMain article: Quad Flat Package• Flatpack, early metal/ceramic case with flat leads•• CFP: Ceramic Flat Pack• CQFP: ceramic quad flat-pack, similar to PQFP•• BQFP: Bumpered Quad Flat Pack•• DFN: Dual Flat Pack, No Lead•• ETQFP: Exposed Thin Quad Flat Package•• PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking•• PQFP: Plastic quad flat package•• LQFP: Low-profile Quad Flat Package• QFN: Quad Flat No Leads, also called micro lead frame (MLF).• Quad Flat Package: (QFP)•• MQFP - Metric Quad Flat Pack,a QFP with metric pin distribution•• HVQFN: Heat-sink very-thin quad flat-pack no-leads• SIDEBRAZE:[2]

•• TQFP: Thin Quad Flat Pack•• TQFN: Thin Quad Flat No-Lead•• VQFP: Very-thin Quad Flat Pack

List of integrated circuit packaging types 3

Small outline packages•• CSOP: ceramic SOP•• MSOP: Mini Small-Outline Package•• PSOP: Plastic small-outline package•• PSON: Plastic small-outline no lead package•• QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm.• SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).•• SOP: Small Outline Package• SSOP: Shrink Small-Outline Package• TSOP: Thin Small-outline Package•• TSSOP: Thin Shrink Small Outline Package•• TVSOP: Thin Very Small-Outline Package• µMAX: Similar to a SOIC. (A Maxim trademark example [3])•• WSON: Very Very Thin Small Outline No Lead Package

Chip-scale packages

Example WL-CSP devices sitting on the face of a U.S.penny. A SOT-23 device is shown for comparison.

• CSP: Chip Scale Package (package no more than 1.2x the sizeof the silicon chip)

•• TCSP: True Chip Size Package (package is same size assilicon)

•• TDSP: True Die Size Package (same as TCSP)•• MICRO SMD: a chip-size package (CSP) developed by

National Semiconductor•• COB: chip-on-board; a bare silicon chip, that is usually an

integrated circuit, is supplied without a package.•• COF: chip-on-flex; a variation of COB, where a chip is

mounted directly to a flex circuit.•• COG: chip-on-glass; a variation of COB, where a chip is

mounted directly to a piece of glass - typically an LCD.

Ball grid array

Main article: Ball grid arrayBall Grid Array (also CBGA, PBGA, FBGA, UFBGA, UBGA, MBGA)

• FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface• LBGA : Low Profile Ball Grid Array (see BGA) (also Laminate Ball Grid Array)• TEPBGA: Thermally Enhanced Plastic BGA.•• CBGA: Ceramic Ball Grid Array•• OBGA: Organic Ball Grid Array• TFBGA - thin fine pitch BGA.•• PBGA: Plastic Ball Grid Array• MAP-BGA: Mold Array Process-Ball Grid Array [4]• UCSP: Similar to a BGA (A Maxim trademark example [3])• μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm•• LFBGA - low profile fine pitch ball grid array•• TBGA: Thin Ball Grid Array

List of integrated circuit packaging types 4

•• SBGA: Super BGA - above 500 Pin count• UFBGA: Ultra Fine BGA

Transistor, diode, small pin count IC packages

A drawing of a ZN414 IC in a TO-18package

• MELF: Metal Electrode Leadless Face (usually for resistors and diodes)•• SOD: Small Outline Diode.•• SOT: Small Outline Transistor (also SOT-23, SOT-223, SOT-323).•• TO-XX: wide range of small pin count packages often used for discrete parts

like transistors or diodes.•• TO-3•• TO-5• TO-18: metal can package with radial leads•• TO-39•• TO-46• TO-92: plastic encapsulated package with three leads•• TO-99•• TO-100• TO-220: through-hole plastic package with a (usually) metal heat sink tab

and three leads• TO-226 [5]

• TO-247 [6]

• TO-252 (also called SOT428, DPAK)[7]

• TO-263, also called D2PAK: SMT package similar to the TO-220•• TO-263 THIN

References[1] http:/ / www. national. com/ ms/ PA/ PACKING_CONSIDERATIONS__METHODS__MATERIALS_AND_REC. pdf[2] http:/ / cpu. linuxmania. net/ liste/ cpuinfo/ chip-package/ SIDEBRAZE_DIP/ chip-package-sidebraze. htm[3] http:/ / datasheets. maxim-ic. com/ en/ ds/ MAX9716-MAX9717. pdf[4] http:/ / www. freescale. com/ files/ dsp/ doc/ eng_bulletin/ EB362. pdf[5] http:/ / www. siliconfareast. com/ to226. htm[6] http:/ / www. vishay. com/ docs/ 95223/ to247. pdf[7] NXP. "SOT428" (http:/ / www. nxp. com/ packages/ SOT428. html).

External links• JEDEC JEP95 (http:/ / www. jedec. org/ category/ technology-focus-area/ registered-outlines-jep95) official list

of all (over 500) standard electronic packages• fairchildsemi.com - Fairchild Semiconductor Index of Discrete Packages (http:/ / www. fairchildsemi. com/

products/ discrete/ packaging/ pkg. html)• SiliconFarEast - An illustrated listing of different package types, with links to typical dimensions/features of each

(http:/ / www. siliconfareast. com/ ic-package-types. htm)

Article Sources and Contributors 5

Article Sources and ContributorsList of integrated circuit packaging types  Source: http://en.wikipedia.org/w/index.php?oldid=603206727  Contributors: Abdull, Alan Liefting, Alan.poindexter, Andrewjlockley, Anon423,CyberDragon777, CyrilB, Danh, DavidCary, DavidGrayson, Efa, Electron9, Gschelotto, Inductiveload, Intgr, Jesse Viviano, Jim1138, Jluu, Kostmo, LeoNomis, Magioladitis, Mahjongg,Mikewax, Mixabest, Mkratz, Moket, Nathanacorn, Night Gyr, Nikkimaria, NintendoFan, Northamerica1000, Obankston, Potatoswatter, Quintote, Rilak, Rjwilmsi, Sbmeirow, ShaunOfTheLive,Sunik.lee, TheAMmollusc, Thumperward, Twisp, Wtshymanski, Yusiang1998, Zelpld, 36 anonymous edits

Image Sources, Licenses and ContributorsFile:Signetics NE555N.JPG  Source: http://en.wikipedia.org/w/index.php?title=File:Signetics_NE555N.JPG  License: GNU Free Documentation License  Contributors: Ghouston, Gvf, Jahoe,Shooke, Stefan506, 1 anonymous editsFile:Three IC circuit chips.JPG  Source: http://en.wikipedia.org/w/index.php?title=File:Three_IC_circuit_chips.JPG  License: Public Domain  Contributors: Kimmo PalosaariFile:UNIO WLCSP and SOT23 Device on Penny.jpg  Source: http://en.wikipedia.org/w/index.php?title=File:UNIO_WLCSP_and_SOT23_Device_on_Penny.jpg  License: Creative CommonsAttribution-Sharealike 3.0  Contributors: Cp82File:TO-18, 3 leads, ZN414 (shaded).svg  Source: http://en.wikipedia.org/w/index.php?title=File:TO-18,_3_leads,_ZN414_(shaded).svg  License: Public Domain  Contributors: Inductiveload

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