Lecture 9 JFET

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    Electronic DevicesKEEE 2224

    Lecture 9

    Junction Field-Effect Transistor

    (JFET)

    Dr. Ghafour Amouzad Mahdiraji

    November 2012

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    Junction Field-Effect Transistor (JFET)

    pn junction FET

    Fabricated with

    pn plus junction

    MEtal-Semiconductor FETMESFET

    Fabricated with

    Schottky Barrier

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    Space Charge Region

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    JFET Concepts

    A voltage applied to the metal platemodulated the conductance of the

    semiconductor under the metal and

    controlled the current between the

    ohmic contacts. The phenomenon of modulating the

    conductance of a semiconductor by

    an electric field applied

    perpendicular to the surface of asemiconductor is called field effect.

    This type of transistor has also been called the unipolar transistor, to

    emphasize that only one type of carrier, the majority carrier, is involved in the

    operation.

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    pn Junction Field-Effect Transistor (or pn JFET)

    The n region between the two pregions is known as the channel.

    In this n-channel device, majority

    carrier electrons enters from the

    source terminal into the channel and

    flow towards the drain terminal.

    The gate is the control terminal.

    The two gate terminals (p regions)are tied together to form a single gate

    connection.

    A complementary p-channel JFET can also be fabricated in which the p andn regions are reversed from those of the n-channel device.

    In p-channel device, majority carrier holes enters from the source terminal

    into the channel and flow towards the drain terminal.

    The p-channel JFET is generally a lower frequency device than the n-

    channel JFET due to the lower hole mobility.

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    pn JFET Basic Operationzero voltage applied to the gate (V

    GS= 0)

    If the source terminal is at ground potential, and if a small positive drain

    voltage is applied, a drain current ID

    is produced between the source and

    drain terminals.

    The n channel is essentially a resistance so the ID versus VDS characteristic,for small V

    DSvalues, is approximately linear, as shown in the figure.

    Gate-to-channel space charge regions and I-Vcharacteristics for small VDS

    values for

    zero gate voltage.

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    pn JFET Basic Operationreversed-biased gate voltage (V

    GS< 0)

    In general, when a voltage applied to the gate of a pn JEFT with respect tothe source and drain, we alert the channel conductance.

    If a negative voltage is applied to the gate of the n-channel pn JFET (VGS

    VDS

    (sat), the transistor is said to be in the saturation region and thedrain current, for this ideal case, is independent of V

    DS.

    Is the ID zero when the channel becomes pinched off at the drain terminal?

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    pn JFET Basic OperationVGS

    = 0 and very large drain voltage VDS

    As the figure shows, at the pinchoff region in the channel, the n channel and

    drain terminal are now separated by a space change region, which has a

    length L.

    The electrons move through the n channel from the source and are injectedinto the space charge region where,

    subjected to the E-field force, they

    are swept through into the drain

    contact area.

    If we assume that L

    VDS(sat), both the E-field and Lchange slightly together, which

    let the drain current remain

    constant. Thus, the device looks

    like a constant current source.

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    MEtal Semiconductor FET

    The second type of junction field-effect transistor is the MESFET. The gate junction in the pn junction FET is replaced by a Schottky barrier

    rectifying contact (or simply MEtal).

    Usually, MESFETs fabricated by semi-insulating GaAs substrate, to include

    higher electron mobility, hence smaller tranit time and faster response, and

    simplified fabrication process.

    Although MESFETs can be fabricated in silicon,

    they are usually associated with gallium arsenideor other compound semiconductor materials.

    A thin epitaxial layer of GaAs is used for the

    active region; the substrate is a very high

    resistivity GaAs material referred to as a semi-

    insulating substrate. GaAs is intentionally doped

    with chromium, which behaves as a single

    acceptor close to the center of the energy

    bandgap, to make it semi-insulating with a

    resistivity as high as 10

    9

    -cm.

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    MESFET Basic Operation(depletion mode)

    The MESFET shown in the figure is normally ON or in depletion mode

    device, which means it need a voltage to pinch off the channel.

    A reverse-biased gate-to-source voltage (or negative voltage to gate) applied

    to the MESFET shown in the figure, induces a space charge region under themetal gate that modulates the channel conductance as in the case of the pn

    JFET.

    The space charge region willeventually reach the substrate if the

    applied negative gate voltage is

    sufficiently large. This condition,

    again, is known as pinchoff.

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    MESFET Basic Operation(enhancement mode)

    MESFETs can also be fabricated in enhancement mode, where channel is

    normally pinched off even at zero gate voltage.

    As the figure shows, the space charge region width is larger than the channel

    width, which make the device pinch off.

    Channel space charge region of an

    enhancement mode MESFET for

    zero gate-semiconductor voltage

    VGS

    = 0.

    To open a channel, the depletion region must be reduced: a forward-bias

    voltage must be applied to the gate-semiconductor junction.

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    MESFET Basic Operation(enhancement mode)

    When a slightly forward-bias voltage is applied, the depletion region width

    slightly reduced, just as width as channel; a condition known as threshold.

    The threshold voltage is the gate-to-source voltage that must be applied to

    create the pinchoff condition.

    The threshold voltage for this n-channel MESFET is positive, in contrast to

    the negative voltage for the n-channel depletion mode device.

    Channel space charge region of an enhancement

    mode MESFET for gate-semiconductor voltageequal to threshold voltage V

    GS= V

    T.

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    MESFET Basic Operation(enhancement mode)

    If a larger forward bias is applied, the channel region opens and let the

    electrons flow from the channel.

    The applied forward-bias gate voltage is limited to a few tenths of volts

    before there is significant gate current. This device is known as an n-channel enhancement mode MESFET.

    Channel space charge region of an enhancement

    mode MESFET for gate-semiconductor voltage

    larger than threshold voltage VGS

    > VT.

    Enhancement mode p-channel MESFETs and enhancement mode pn junction FETs

    have also fabricated.

    The advantage of enhancement mode MESFETs is that circuits can be designed in

    which the voltage polarity on the gate and drain is the same, however, the outputvoltage swing will be quite small with these devices.