EE141© Digital Integrated Circuits2nd Manufacturing1

PackagingPackaging

EE141© Digital Integrated Circuits2nd Manufacturing2

Packaging RequirementsPackaging Requirements

Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal Economical: Cheap

EE141© Digital Integrated Circuits2nd Manufacturing3

Bonding TechniquesBonding Techniques

Lead Frame

Substrate

Die

Pad

Wire Bonding

EE141© Digital Integrated Circuits2nd Manufacturing4

Tape-Automated Bonding (TAB)Tape-Automated Bonding (TAB)

(a) Polymer Tape with imprinted

(b) Die attachment using solder bumps.

wiring pattern.

Substrate

Die

Solder BumpFilm + Pattern

Sprockethole

Polymer film

Leadframe

Testpads

EE141© Digital Integrated Circuits2nd Manufacturing5

Flip-Chip BondingFlip-Chip Bonding

Solder bumps

Substrate

Die

Interconnect

layers

EE141© Digital Integrated Circuits2nd Manufacturing6

Package-to-Board InterconnectPackage-to-Board Interconnect

(a) Through-Hole Mounting (b) Surface Mount

EE141© Digital Integrated Circuits2nd Manufacturing7

Package TypesPackage Types

EE141© Digital Integrated Circuits2nd Manufacturing8

Package ParametersPackage Parameters

EE141© Digital Integrated Circuits2nd Manufacturing9

Multi-Chip ModulesMulti-Chip Modules

EE141© Digital Integrated Circuits2nd Manufacturing10

MCM ArchitectureMCM Architecture

EE141© Digital Integrated Circuits2nd Manufacturing11

MCM technologies