latest VK-X series (2)

NEW 3D Laser Scanning MicroscopeVK-X100/X200 Series

A Microscope, SEM and

Roughness Gauge in a Single UnitPerform profile and roughness measurements with a click of a button

2

Providing Non-contact Profile and Roughness

Measurements on Nearly Any Material

NEW

3D Laser Scanning Microscope

VK-X100/X200

3

OPTICAL MICROSCOPE

It is impossible to focus on a target

with an uneven surface at high

magnification.

SEM

Observation can only be performed

in black and white, sample size is

limited and pre-processing is time

consuming.

ROUGHNESS GAUGE

Projections and depressions cannot

be measured without damaging the

target area.

For overall observation and measurement of a target

High-speed and high-precision image stitching with WIDE-Scan eliminates field-of-view

limitations at high magnification.

Wide-view

Ensure uniform measurements from user to user

Per form fully-automated measurements with a single-click of the mouse.

Measurement

All of these limitations are overcome with a laser scanning microscope

NEW Two New Functions

WIDE-Scan

AI-ScanFULLY-AUTOMATED MEASUREMENTS

with one push of a button

Enlarged (1000x)

4

Disadvantages

OPTICAL MICROSCOPE

SEM

ROUGHNESS GAUGE

Poor resolution, low contrast

Monochrome image only

Sample scratched due to contact with probe

Shallow depth-of-field

Time-consuming preparation and observation

Difficult to measure target areas

No support for traceability

Restricted sample size

Resolution is limited by stylus tip diameter

1

1

1

2

2

2

3

3

3

Disc pits (6000x)

Ink toner (1000x)

Blade edge (1000x)

PREPARATION

Sample processing

Deposition To stage

Approx. 20 min

OBSERVATION

Start-up Vacuuming

Observation

Approx. 25 min

Observation may not be possible due to the size of the sample because it cannot fit in the sample chamber.

Hitting the desired area of a target with a stylus can be problematic for targets like screw thread crests.

It is not possible to measure surfaces that are smaller than the tip of the roughness gauge’s stylus.

Contact-type surfaceroughness gauge

R: 2 μm0.08 Mil

Aluminum surface (200x)

Horizontal indenta-tions on screen.

COMMON PROBLEMS WITH CONVENTIONAL EQUIPMENT

5

Problems Solved with a Laser Microscope

Disc pits (6000x)

High resolution, 24000x magnification

High-definition color image

Non-contact design can be used on soft targets

1

1

1

Blade edge (1000x)

Fully-focused image

No sample preparation

Easily locate area of interest

2

2

2

Traceability compatible

Measure samples of any size and nearly any material

Small beam-spot laser

3

3

3

Ink toner (1000×)

Detachable head unit allows for a variety of sample sizes to be measured, can be integrated with other devices and supports remote operation.

HIGH-RESOLUTION, LARGE DEPTH-OF-FIELD OBSERVATION

RAPID 3D COLOR IMAGING

NON-DESTRUCTIVE PROFILE AND ROUGHNESS MEASUREMENTS

Z X-Y

Independent administrative agency/National Institute of Advanced Industrial

Science and Technology (AIST)

National Institute ofStandards and Technology

(NIST)

JCSS Accredited Laboratories

Height difference gaugeCoordinate measurement

instrument

Calibration block Calibration chart

3D Laser Scanning Microscope (VK Series)

Measurement results obtained using the VK Series are highly reliable and comply with national traceability standards.

PREPARATION

Place your sample directly

on the stage

0 min

OBSERVATION

Start-up Observation

Approx. 3 min

LED pad (1000x)

2D image 3D image

Laser microscope

R: 0.4 μm

Laser beam diameter is significantly smaller than a roughness gauge stylus, enabling more accurate measurement of irregular shapes.

0.02 Mil

Easily achieves full-focus

observation

High resolution, high

magnification observation

Optical observation

Full-focus image

High-resolution laser monochrome image

The Next Step in the Evolution of Optical Observation

High-speed auto focusInstantly obtain a focused image of a sample with a single click, even at

high magnification. Additional focus adjustments are unnecessary.

IC pattern (1000x) Blade edge (1000x)

NEW Digital microscope observationCapture high-resolution images with true color

Built-in camera with 3CCD imaging mode

Record up to a 21.6 megapixel imageWhat is the pixel shift method?Records a total of 9 images by shifting the CCD both vertically and horizontally by 1/3 of a pixel. Furthermore, it obtains RGB data for each pixel, thus allowing for clear observation with superior color reproduction.

Full-focus observation

Capture fully-focused images, even on three-

dimensional objects or at high magnification.

Super high-resolution observation

6

VK-X100/X200 Fea tu res .01

OBSERVATIONObservation of unparalleled clarity

Color SEM-like

observation

3D

observation

Industry’s Best 16-bit laser color image

Sandpaper (400x)

By scanning the entire surface with a

short-wavelength laser, full-focus

observation is achieved from 200x to

24000x* at resolutions that can not be

attained with an optical microscope.

* When using the VK-X200 Series

Disc pits (6000x)Optical image

Monochrome laser image

Laser image

16-bit laser color image Ink toner (1000x)

Industry’s Best 16-bit laser color imageAchieve fully-focused observation with unparalleled resolution

SEM-like resolution with real color

By scanning a laser in XYZ directions

over a target, users can capture fully-

focused color images with accurate

height information associated with each

pixel.

7

* If settings are performed without this adjustment, reflections on angled surfaces and dark surfaces will be weaker and cause errors.

Now Anyone can Perform High-Quality Measurements

Developed with years

of experience and

technical knowledge.

Easy Mode and

AI-Scan allow anyone

to perform expert

measurements.

World’s First The 3 functions of AI-Scan

1. AAG functionAutomatically selects the two best settings for the laser light-receiving element to allow for accurate measurements to be made on angled surfaces and targets with varying levels of contrast.

* AAG=Advanced Auto Gain

Start measurement with a single click

Conventional method AAG function

Diamond tool (400x)

(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.

(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.

8


RECORDINGIntuitive and easy-to-use interface

Glare

Exists

Absent Conventional systems only adjust the laser sensitivity at a certain height, making it impossible to account for changes in the surface of the target throughout the entire measurement range.

Field of View Field of View

Me

asu

rem

en

t ra

ng

e

AAG FUNCTION

AAG ORIGINAL

CONVENTIONAL ALGORITHM

1-1. Automatic adjustment of the laser sensitivity 1-2. Optimal adjustment at each height

FULLY-AUTOMATED MEASUREMENTS


2. Auto setting of the upper and lower limitsAutomatically recognizes and sets the upper and lower limits of the measurement range, and then collects measurement data by scanning the target throughout that range.

The upper and lower limits on the screen are recognized and automatically set as the measurement range

The lens scans automatically

When using single scan After double scan

3. Double scan functionAdjusts the measurement and capture settings and automatically re-scans the target to obtain information that wasn’t detected during the first scan.

9

By simply clicking the “Start measurement” button,

the AI-Scan function will automatically scan an object

using the optimal settings.

Solder (200×)

Upper limit

Lower limit

Robust measurement software provides flexibility for analysis

Surface area measurement of a solar battery (1000x)

Optical film (1000x)Height, width, angle and cross-section measurement (1000×)

Radius-of-curvature of a micro lens (1000x)

LED pad unit - 3D comparison (1000x) Differential measurement of sample A and B

Sample A

Sample A Sample B

Sample B

Perform profile, height, area and volume measurements

3D image and profile comparison

Profile and 3D measurement

3D comparison view

Aligns two three-dimensional images to allow for comparative

evaluation.

Profile and 3D measurement

Height, width, angleand cross-section measurement

The VK-Analyzer software can measure the height, width,

cross-section, angle or radius-of-curvature of any user-

specified line or curved cross-section profile.

Surface area and volume measurement

Measures volume, surface area and surface area to area ratio

of objects in any specified location on the screen.

Compare profiles on two different images

Comparative measurement

Overlay and compare profile measurements on two different

targets. Differences in height are automatically displayed in

the profile graph.

10


MEASUREMENTMeasure any surface shape

Film - surface roughness comparison (3000x)

Resist pattern (6000x) Optical film (1000x) * Will be equipped in the near futureColor filter (1000x)

Electronic device pattern (1000x)

Sample A: Ra 1.5 μm Sample B: Ra 3.2 μm

Evaluate and characterize surface topography

Automatically record and measure multiple samples at once

Quantify line and surface roughness

Line roughness measurement

Calculate roughness on a 2D or 3D image for a given line.

Surface roughness measurement

Quantitatively determine differences in surface conditions by

measuring the surface roughness of a target.

Automatically measures targets that have a repeating pattern

Automatic width and height measurement

Automatically measures the width and height of targets that

have a repeating pattern. Since measurement is automatic, no

user errors are generated, allowing for rapid, accurate

measurement.

Performs consecutive measurements of multiple areas

Automatic measurement of multiple areas on multiple samples*

Using the motorized stage (optional), multiple areas of a single

sample or specific areas of multiple samples are automatically

measured.

2. Surface-roughness of blue filter1. Surface-roughness of red filter

11

Achieves the measurement of shapes that are at or

below a micron. Enables a range of observation,

from optical microscope to SEM observation, in a

single unit.

Light receiving element

Laser Scanning Microscope History

16-bit

5 nm0.005 μm

10 nm0.01 μm

14-bit

8-bit

PH

OT

OM

ULT

IPL

IER

PH

OT

OD

IOD

EC

CD

Improved operability

VK-8500 Series

VK-7500 Series

Enables the measurement of surface shapes from lines to planes

Performs area scanning with a red semiconductor

laser and achieves 3D shape analysis as well as

color confocal images.

VK-9500 Series

A short wavelength violet laser that achieves high measurement precision with a 14-bit light receiving element

Equipped with a violet laser as well as a 14-bit

photomultiplier to achieve high measurement precision with

18000x observation.

VK-8700 Series

A red semiconductor laser that greatly improves

versatility with a variety of observation and

measurement options.

VK-X100 SeriesNEW

The fusion of a laser displacement meter and a microscope

Achieves both microscope observation and profile

measurement by using a laser to perform line

scanning.

From lines to planes

12

One-click AI-Scan

Flow chart format

Evolution to an easy-to-use, high-precision instrumentThe shift from a laser microscope to a laser scanning microscope

FULLY-AUTOMATED MEASUREMENTS


Greatly improved accuracy

TYPE VF-7500 VK-8500 VK-9500 VK-8700 VK-9700 VK-X100 VK-X200

Obse

rvati

on f

unct

ion Light-receiving

elementLine CCD, 8-bit Photodiode, 8-bit Photomultiplier, 14-bit Photomultiplier, 14-bit Photomultiplier, 16-bit

MagniY cation 250x to 2500x 200x to 8000x 200x to 18000x 200x to 12000x 200x to 18000x 100x to 16000x 200x to 24000x

Optical zoom None 1x, 2x, 4x 1x to 6x 1x to 6x 1x to 8x

Laser scanning method

Line (488 pixels × 1 pixel) Area (1024 × 768 pixels) Area (1024 × 768 pixels) Area (2048 × 1536 pixels) Area (2048 × 1536 pixels)

HDR function None None None OTC function (14-bit) HDR function (16-bit)

Reco

rdin

g f

unct

ion

Linear scale module resolution

None10 nm

(0.01 μm)10 nm

(0.01 μm)10 nm

(0.01 μm)1 nm

(0.001 μm)5 nm

(0.005 μm)0.5 nm

(0.0005 μm)

Measurement method setting

Manual Manual ManualManual or Beginner Mode

(AAG function)Manual settings/

Built-in Easy mode

Detection algorithm Peak algorithm Peak algorithm Peak algorithm Peak algorithm, RPD algorithm Peak algorithm, RPD algorithm

AI-Scan function None None None None Yes

Image stitching function

None None Yes (AIA system) Yes (FAST algorithm) Yes (Built-in WIDE algorithm)

Navigation function None None None None Yes*

Mea

sure

men

t fun

ctio

n Traceability compatible

None Yes Yes Yes Yes

Repeatability (σ) 0.03 μm 0.03 μm 0.02 μm 0.03 μm 0.014 μm 0.02 μm 0.012 μm

Top surface Y lm thickness of a transparent object

None None None Yes Yes

Film thickness measurement

Yes (line film thickness measurement)



Yes (line and area film thickness measurement)

Yes (line and area film thickness measurement

* Will be equipped in the near future.

The world’s most advanced laser scanning

microscope with 24000x magnification and

0.5 nm resolution.

Resolution of the linear scale module

1 nm0.001 μm

0.5 nm0.0005 μm

A built-in 16-bit light receiving element, along with

AI-Scan mode, enables simple, high-accuracy

measurements with high-resolution image capture.

VK-9700 Series

VK-X200 SeriesNEW

Further increases the versatility of observation and measurement functions and can be operated by non-experienced users.

Extremely versatile with 1 nm resolution and the ability to observe

transparent objects.

er increases the versatility of observat

The

mic

0.5

m

NE

er increases the versatility of observat

By improving the light-receiving element,

response capabilities have improved dramatically.

13

Linear scale module

[Conventional]

0.01µm

[VK-X200]

0.0005µmAchieves an ultra high precision that is 20x greater than conventional models.

Resolution

Conventional

16-bit & AAG

New features of laser scanning microscopes Part.1

Higher Precision

* If settings are performed without this adjustment, reflections on angled surfaces and dark surfaces will be weaker and cause errors.

(1) Sensitivity adjustmentChanges the sensitivity of the light-receiving element to prevent saturation when scanning a sample.

(2) Sensitivity readjustment*Automatically adjusts to raise the sensitivity to a level just below the level that will produce saturation.

Glare

Exists

Absent

AAG ORIGINAL

Diamond tool (400x)

14

VK-X100/200

Conventional

12-bit (4096 levels)

* Dynamic Range Comparison

256x more than a CCD

16x more than

conventional models

16-bit (65536 levels)

8-bit (256 levels)

CCD

16 times the dynamic range of conventional laser scanning microscopes

Industry’s Best 16-bit photomultiplier

When it comes to obtaining accurate data, the element responsible for detecting the reflected laser light is the most important component

of a laser scanning microscope. Boasting the world’s greatest dynamic range, the 16-bit photomultiplier of the VK-X Series is able to

accurately detect both faint and strong reflected light, even on highly-angular surfaces.

Achieves even higher precision

Industry’s Best 0.5 nm linear scale module

Automatically adjust the sensitivity of the 16-bit photomultiplier to its optimal settings

World’s First AAG function*

This function automatically adjusts the sensitivity of the laser receiving element

throughout the entire measurement range to account for variations in material, shape

and reflectance.

Detect position

information in the z-axis

with an ultra high-

precision 0.5 nm linear

scale module that is 20x more accurate than conventional

systems. This newly developed linear scale module can

achieve high-resolution measurement and boasts a

reliability that can be traced back to national standards.

* AAG = Advanced Auto Gain

Higher Speeds

z Z-I curve after measurement

The RPD algorithm enables high-precision measurement results while reducing the time it takes to scan a target.

Intensity of received reflected light (Intensity)

Can detect the real peak.

Cannot detect the real peak.

Detected peak

Detected peak

Conventional method

RPD method

Po

sitio

n in

Z-a

xis

dire

ctio

n

(Z p

ositio

n)

15

0 05 510 Measurement speed (sec)

2x faster than conventional models


Conventional

[Measurement mode: High-precision] [Measurement mode: Ultra high-speed]

Conventional

VK-X VK-X

Measurement speed (sec)

Perform high-precision measurements in a shorter amount of time

RPD* algorithm

The VK-X’s original algorithm detects the true peak position using the Z-I curve after measurement. It enables high resolution with a

significant reduction in measurement time.

* RPD=Real Peak Detection

Achieves measurement speeds that are at least 2x faster than conventional systems

NEW Equipped with an ultra high-speed scan mode with a top-speed of 120 Hz

Measurement speeds have been improved to 2x that of conventional systems while also improving the measurement accuracy. For

applications that require even higher speeds, a newly developed 120 Hz ultra high-speed scan mode can be equipped.

* Reference data from measuring a 10 μm step with a 50x objective lens

Conventional method

RPD method

0.053 μm (0.002 Mil) standard step sample measurement

result (Comparison with conventional method)

A narrow field-of-view prevents a user from understanding the target as a whole and restricts the measurement range.


High-speed, high-precision

Solution

16

Resolve narrow field-of-view issues with image stitching

Issue.1

The statue of Lincoln on a U.S. penny (200x)

Conventional measurement method

High-magnification makes it difficult to understand what and where you are looking at.

Use WIDE-Scan mode to easily understand the overall structure of a target.

A high magnification image allows users to perform measurements with high-precision. However, as the magnification

is increased, the field-of-view reduces, making it difficult to understand where you are looking or what you are looking

at. WIDE-Scan allows users to quickly and easily generate a wider field-of-view image by stitching together multiple

images.

WIDE-Scan

Measuring only a single area often leads to incorrect data when applied to the entire target.


Solution

17

Issue.2Conventional measurement method

Each location being measured exhibits variations in the result.

20.5 µm height

18.5 µm height

22.5 µm height

Average height 20.5 µm

Multiple areas can be measured and averaged with WIDE-Scan.

If only measuring a limited number of areas, the numerical values may vary depending on the locations being

measured. WIDE-Scan obtains a wide-field, high-resolution 3D image and allows users to average data collected

from a much larger sample area.

WIDE-Scan

Measurement, processing and stitching

speed are dramatically improved with

AI-Scan and WIDE algorithm.



Solution

18

Conventional image stitching

PCB (200x)

10 60 Measurement speed (min)

By combining AI-Scan and WIDE-Scan, images can be

seamlessly stitched together at speeds over 6x faster than

conventional systems.

High-precision stitching with the WIDE algorithm

Quickly stitches together images without the

appearance of seams or incorrect measurement

information. Automatically corrects all XYZ data by

evaluating the light intensity and height data of

overlapping areas.

6x the measurement speed of conventional models

Measurement, processing and stitching speed are

dramatically improved with AI-Scan and WIDE -Scan

algorithms.

* Reference data from measuring an approx. 4 mm square

Conventional

VK-X

WIDE-Scan NEW

Image stitching application

VK-H1XJ

Optional

VK-X100/X200 image stitching

Easily perform high-speed image stitching and wide-field measurements with WIDE-Scan


Image assembly - manual operation

It’s possible to stitch together several images without the need of a motorized stage.

Just drag and drop multiple images into the software, and the VK-X will automatically

complete the merge.

19

Easy stitching Free measurement

If an arbitrary range is set, the motorized stage will be

used to automatically perform continuous

measurement and stitching within that range.

Even for stitched images, it’s possible to perform any

measurement by clicking on the image.

Step.1 Step.2

Built-in navigation system*

Use the wide-field image that was stitched

together as a reference when navigating

around a target at higher magnification.

* Will be equipped in the near future

20

A new function captures subtle features that were previously impossible to image

Light guide plate(1000x)

Conventional 8-bit gradationHDR

16-bit

Normal image

Laser, full-focus image Rear face of a wafer(1000x)

C-laser DIC 2D image C-laser DIC 3D image

Printing (400x)

The range of obtainable brightness is narrow, resulting in the glaring of areas beyond the range.

Subtle contrast cannot be rendered because of coarse resolutions.

The range of obtainable brightness is wide, diminishing the perceived glare.

Subtle contrast can be rendered because of detailed gradation.

Difficulties Solutions

Gradations obtained by capturing a single image

Gradations obtained by capturing multiple images Conventional

256x levels

Conventional method HDR function

(256 levels of gray) (65536 levels)8-bit 16-bit


NEW 16-bit gradation dramatically enhances image contrast and eliminates glare

High Dynamic Range (HDR) Function

This function optimizes the appearance (texture and contrast) of targets with unclear or low-contrast surfaces.

It enables higher contrast, and an unprecedentedly clear observation that fully captures the details of the target

object.

Differential observation and profile measurement without the need to remove and insert prisms or filters

C-laser DIC display function [Function for observing minute surface features]

This function combines the laser image and height information. This enables effective observation of target objects previously difficult to

observe when using contrast information, such as mirrored samples and samples with little variation in surface texture. It lets you observe

nano-level indentations and projections, which were difficult to observe with conventional laser microscopes.

WORLD’S FIRST

After HDR processing

Low-contrast gradations are shown in detail

21

Capture data from the top, bottom and intermediate layers of a transparent object

Area Film Thickness Measurement function

Analyze multiple layers at all points in the

observation field. You can display 3D

images and cross-section profiles of a

selected single layer or multiple layers, and

measure shapes or film thicknesses of

user-specified locations.

Capture the top surface of a transparent object

Transparent Top Surface Observation function

Transparent Top mode acquires information on the outermost surface of a transparent object, while being

unaffected by light that reflects from other layers within the target.

Conventional model VK-X100/X200

In the case of transparent targets, transmitted light goes through the peak (focal point) on the front face and detects the peak (focal point) on the rear face. The difference in both peak positions can be measured (film thickness).

Received reflected light intensity [Intensity]

Rear face

Transparent film surface

Substrate surface

Transparent film thickness

Transparent film surface

Substrate surface

Front face

Laser lightFront surface film

Rear surface film

Position in the Z axis [Z position]

Film thickness

Ink jet nozzle (1000x)

Resist (1000x)

22

Half mirrorColor CCD camera

Half mirror

Half mirror

Objective lens

Observed target object

X-Y scanning optical system

White light source for illumination

Light receiving element (photomultiplier)

Pinhole

Condensing lens

Short wavelength laser light source

Three types of images built from laser scan

Color + Laser imageFully-focused color image that SEMs and optical microscopes cannot provide.

Laser intensity imageGray-scale, high contrast image similar to what SEMs provide. Shows changes in reflected laser intensity.

Height-Color MapDifferent heights are marked by changes in color.

Color + laser intensity information Laser intensity information Height information

The laser scanning microscope employs two light

sources: a laser source and a white light source. These

two types of light sources enable the acquisition of

laser intensity, color, and height that are required to

construct fully-focused color images, fully-focused

laser images and height information.

[Detects reflected-light intensity and height with a

short-wavelength laser]

The light that is emitted from the laser light source of

the laser scanning microscope is focused on the target

via the XY scanning optical system and the objective

lens. The focused beam spot then performs a surface

scan of the target within the observation field through

the XY scanning optical system. The target within the

observation field is split into 1024 x 768 pixels,

scanned, and then reflected light for each pixel is

detected with the light receiving element. The objective

lens is then driven in the Z-direction and surface

scanning is repeated. This acquires the reflected-light

intensity of every z-axis position for each pixel. After

this, the height information and reflected-light intensity

is detected, with the z-axis position of the highest

reflected-light intensity as the focal point. This makes it

possible to acquire full-focus light intensity images and

height images (information) in which the entire target is

in focus.

[CCD camera obtains color information]

The data collected from the laser is then coupled with

the reflected light from the white light source to

produce an image with height and color information.

This gives a user an image that rivals the resolution of

an SEM, yet also provides real color observation.

Uses two light sources to acquire information

Diagram of the measurement principle

Move the objective lens in the Z-axis direction and scan with the laser again.

Scan with the laser in the X and Y direc-tions.

1

2

3

4

Short wavelength laser light

Me

asu

rem

en

t ra

ng

e

1024 X 768 pixels

Repeat for the entire measurement range.

Measurement complete.

Principle structure

23

Disadvantages of Interferometers

1. Unable to detect steep angles

When using interferometers to measure objects with steep angles, due

to the concentration of interference patters in those areas, accurate

information is unable to be gathered.

3. Slope correction is required

Before measurement, slope correction of the sample with a goniometer

stage is required. Because interference patterns become crowded when

the sample is at an angle, proper measurement cannot be performed.

VK-X100/X200

Because interference patterns are not used, direct

measurement is possible even if the sample is at an angle.

Slope correction can also be applied after image capture.

2. The targets that can be viewed are limited

With light interference, if the surface does not reflect well, measurement

is difficult to perform, so support for a variety of targets is not provided.

Measurement also cannot be performed if there is an extreme difference

between the reflected light from the reference surface and the reflected

light from the measurement surface (Works well with mirrored-surfaces,

but is difficult to measure samples with extreme projections and

depressions and samples without much of a reflective surface).

4. The lateral resolution is the same as an optical microscope

Since interferometers operate on white light, the lateral resolution of these

systems will be the same as a conventional optical microscope -

approximately 0.43 μm 0.02 Mil.

VK-X100/X200

The confocal range finding system, which uses laser

reflection intensity for detection, can measure shapes that

have high angular characteristics with low noise.

VK-X100/X200

Because it uses a photomultiplier element (PMT) with a wide

sensitivity range, targets that include areas of both high and

low reflectivity can be accurately measured.

VK-X100/X200Using short-wave lasers and pinhole optics, a lateral

resolution of 0.13 μm 0.01 Mil can be obtained.

1 Device 4 Benefits

Difference between a pinhole confocal system and conventional systems

Peak detection (focal point) comparison between a pinhole confocal system and conventional system.

Z-I curve of conventional optical system

Light intensity peaks at focal points are spread out in conventional optical systems

Received reflected light intensity [Intensity]

Ambient light from points other than the peak focal point

Z-I curve of the pinhole confocal optical system

Conventional system

Target

Laser light

Lens Lens

MirrorMirror

Lens CCD PMTLens

Target

Laser light

VK-X100/X200 system

Pinhole

Conventional optical systems receive reflected light from areas

outside of the peak focal point. With a confocal system, only

light from the focal point is collected, producing a sharper

image.

Optical film (1000x)

Image from a conventionaloptical microscopeDefocused light and flare cannot be removed.

Confocal image the VK-X100/X200Only displays the area that’s in focus, while eliminating defocused information.

Po

sitio

n in

th

e Z

axis

[Z p

ositio

n]

Focalposition

High accuracy measurement with the pinhole confocal optical system

Conventional pseudo-confocal optical systems that use a CCD

as the light receiving element are limited in their ability to

provide either high-accuracy measurements or high-definition

images. Since these systems do not employ a pinhole

mechanism, unfocused light is able to be collected by the

CCD. However, with a pinhole confocal system, light is only

received when it is at its focal point, creating very sharp

images with high-resolution measurement data.

Indentation/projection measurement

Divide areas above (projections) or below

(indentations) a specified height threshold value

into separate zones, and take measurements for

each area.

Position compensation function Industry’s First

When a standard sample has been registered

and a different image is opened in a template,

the VK-Analyzer automatically adjusts the image

position so that the image opens at the same

position as the registered sample. This function

is effective when measuring large sample

populations.

Sphere/surface angle measurement

Automatically extracts the radii of circular objects

in a specified area. Since the measurements

are calculated automatically, this function

reduces variations in measurements between

users.

INDENTATION MEASUREMENT

PROJECTION MEASUREMENT

AUTOMATIC POSITION COMPENSATION

HEIGHT DIFFERENCE ANALYSIS FUNCTION

SPHERE MEASUREMENT

Tilted Automatically corrected

Automatically counts and measures

circular objects within the microscope field.

Preprocessing such as automatic

separation of adjacent particles, counting,

diameter, etc can be performed.

Particle analysis module VK-H1XG

Metal surface (1000x)

Bump (2000x)

Surface of metal component after processing (3000x) Wire bonding (1000x) Microlens (1000x)

Analyzes the difference between two images as a solid 3D image. Enables surface-based image analysis that can capture minute changes.

2D & 3D Measurement ToolsAnalysis Expansion Module VK-H1XP Optional

SOFTWARE OPTIONS

Optional

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A highly-rigid, adjustable-height stand attaches to the back of the

VK microscope, allowing the measuring head to be adjusted to any

height. Inserting a spacer between the measuring head and the

base improves the stability and enables high accuracy

measurement.

A large selection of lenses are available, including high N.A., APO,

long focal distance, and low magnification lenses.

The motorized stage is essential to automatic image assembly and

programmable operation. Easy-to-mount design.

Non-destructive examination and analysis of any point on large-

sized targets by mounting the head on a 3rd-party stage.

An entire 300 mm 11.81" wafer can be examined and analyzed.

Easy-to-mount design.

VK LASER SCANNING MICROSCOPE OPTIONS

Adjustable-height stand for the VK SeriesThe unique structure of the VK-X allows for the measuring head to be separated from the base, making targets that were previously too tall to measure easily possible. (Max 128 mm 5.04") (OP-82693)

Objective lensesWide magnification range

Motorized stageAutomatic image assembly (VK-S100K/VK-S105/VK-S110)

Separate measuring headNon-destructive examination of large-sized targets

300 mm 11.81" wafer stageSupport larger wafer sizes (OP-51498)

* Optional 100 mm x 100 mm 3.94" x 3.94" motorized stage also available.

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Stand for the VK Series

128 mm5.04"

Turning the knob adjusts the height as desired.

The spacer improves the stability.

9.84"

14.9"

6.52"

0.81"

7.48"

6.61"

1.57"

0.51"

4.25"

10.65"

155 6.10"

3.05"3.93"4.25"

0.52"

16.4"

6.26"0.29"

12.50.49"

1.38"

5.12"

70.2 2.76"

160 6.30"

4.69"

6.46"

40515.94"

285 11.22"

9.84"

14.43"

63.5 2.50"

22 0.87"

416.416.39"

10.63"3.80"

13.30.52"171.3

6.74"

2.06"

159 6.26"

5.91"

0.28"

3.74"

2 x M6 Heli-Coil 1.5D

23.5 0.93"2.62"

1907.48"

3.80"

1827.17"

803.15"

(40) (1.57")

20.5 0.81"

803.15"

63.5 2.50"

2 x ø6.6 through hole

4.41"4 x M6Depth 10

56.5 2.22"

(Depth 8 0.31")

4.69"

60.24"

40515.94"

5.91"

0.24"

0.39"

ø0.26"

100 77.5108

159

53.2

13.3

415.4

7.3

249.9

378.5270.5

165.520.5

35130

108

165.5

95

249.9

366.5

96.5

145 5.71"

166.5 6.56"66.5 112

155 6.10"

96.5 270

52.2397.1 15.63"

295.4 11.63"150

7

13

168

190

(40)

150

119.2

164357 14.06" 6

119.2160 6.30"

164357 14.06"

295.4 11.63"398.4 15.33"

22 0.87"

270.5 10.65"

171.36.74"

2.09"

4 x M6 Depth 10 0.39"

0.28" 7

1726.07"

2 x M6 Heli-Coil, 1.5D

(Depth 8 0.31")0.81" 20.5

6.52"

77.5 3.05"

803.15"

2 x ø6.6 through holeø0.26"

285 11.22"

6.46"

70.28"

18317.20"

60.24"

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Unit: mm inch

DIMENSIONS

Measurement unit

VK-X210

Measurement unit

VK-X105/110

Measuring head

Measuring head

Controller

VK-X200K

Controller

VK-X100K

SYSTEM CONFIGURATION

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SPECIFICATIONS

ModelMicroscope VK-X210 VK-X110 VK-X105

Controller VK-X200K VK-X100K VK-X100K

Magnification on a 15” monitor 200x 400x 1000x 3000x 200x 400x 1000x 2000x 100x 200x 400x 1000x

Objective lens magnification 10× 20× 50× 150× 10× 20× 50× 100× 5x 10x 20x 50x

Observation/measuring range 1.

Horizontal (H): μm Mil1350 53.15

675 26.57

270 10.63

90 3.54

1350 53.15

675 26.57

270 10.63

135 5.31

2700106.30

135053.15

67526.57

27010.63

Vertical (V): μm Mil1012 39.84

506 19.92

202 7.95

67 2.64

1012 39.84

506 19.92

202 7.95

101 3.98

202579.72

101239.84

50619.92

2027.95

Working distance: mm inch16.5 0.65"

3.1 0.12"

0.35 0.01"

0.2 0.008"

16.5 0.65"

3.1 0.12"

0.54 0.02"

0.3 0.01"

22.50.89"

16.50.65"

3.10.12"

0.540.02"

Numerical Aperture (N.A.) 0.3 0.46 0.95 0.95 0.3 0.46 0.8 0.95 0.13 0.3 0.46 0.8

Optical zoom 1x to 8x

Total magnification 200x to 24000x 200x to 16000x 100x to 8000x

Optical system for observation/measurement Pinhole confocal optical system

Height measurement

Measuring range 7 mm 0.28" 7 mm 0.28" 7 mm 0.28"

Display resolution 0.0005 μm 0.00002 Mil 0.005 μm 0.0002 Mil 0.005 μm 0.0002 Mil

Repeatability σ 0.012 μm 0.0005 Mil 2. 0.02 μm 0.0008 Mil 2. 0.02 μm 0.0008 Mil 2.

Width measurementDisplay resolution 0.001 μm 0.00004 Mil 0.01 μm 0.0004 Mil 0.01 μm 0.0004 Mil

Repeatability 3σ 0.02 μm 0.0008 Mil 3. 0.03 μm 0.001 Mil 4. 0.05 μm 0.002 Mil 5.

Frame memory

Pixel count 2048 x 1536, 1024 x 768, 1024 x 64

For monochrome image 16-bit

For color image 8-bit for RGB each

For height measurement 24-bit 21-bit 21-bit

Frame rate*8Surface scan 4 Hz to 120 Hz

Line scan 7900 Hz

Auto function AAG (Auto gain), Auto focus, Auto upper/lower limit setting, Double Scan brightness settings

Laser beam light source for measurement

Wavelength Violet laser, 408 nm Red semiconductor laser, 658 nm

Output 0.95 mW

Laser Class Class 2 Laser Product (IEC 60825-1, FDA (CDRH) Part1040.10 6.)

Laser light-receiving element PMT (Photoelectron Multiplier Tube)

Light source for optical observation

Lamp 100 W halogen lamp

Color camera for optical observation

Imaging element 1/3" Color CCD image sensor

Recording resolution Super high resolution (3072×2304)

Auto adjustment Gain, Shutter speed

Data processing unit Dedicated PC, supplied by KEYENCE with the VK-X (OS: Windows 7 Professional Edition) 7.

Power supplyPower-supply voltage 100 to 240 VAC, 50/60 Hz

Current consumption 450 VA max.

WeightMicroscope

Approx. 26 kg (Measuring head detached: approx. 10 kg)

Approx. 25 kg (Measuring head detached: approx. 8.5 kg)

Approx. 25 kg (Measuring head detached: approx. 8.5 kg)

Controller Approx. 11 kg

1. The observation/measuring range is the minimum visual field range.

2. When a standard height difference of 2 μm 0.08 Mil is measured with the 50x objective lens.

3. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 150x objective lens in line peak mode (image averaging: 8 times).

4. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 100x objective lens in line peak mode (image averaging: 8 times).

5. When the KEYENCE reference chart line width of 1 μm 0.04 Mil is measured with the 50x objective lens (optical zoom 2x) in line peak mode (image averaging: 8 times).

6. The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No.50.

7. Windows 7 is a registered trademark of Microsoft, U.S.A.

8. At top speed when using a combination of measurement mode/measurement quality/lens magnification. When line scan has a measurement pitch that is within 0.1 μm.

• Viewer software

VK-H1XVE

• Analysis software

VK-H1XAE

• Analysis expansion module

VK-H1XP (Optional)

• Image stitching software

VK-H1XJ (Optional)

• Particle analysis module

VK-H1XG (Optional)

• Motorized XY stage for image stitching VK-S105/S100K (50 mm 1.97")VK-S110/S100K (100 mm 3.94")

• Stage for 300 mm 11.81" wafer OP-51498 (Optional)

• VK Series stand OP-82693 (Optional)

* Please contact KEYENCE for large-sized sample stage.

VK-X200K

VK-X100K

VK-X110VK-X105

VK-X210

Measuring unit Controller

Control PC Monitor (Optional)

latest VK-X series (2)

Documents

Transcript of latest VK-X series (2)