Kunshan Unistar Electronics Co., Ltd. 2016 Unistar Plant...

Kunshan Unistar Electronics Co., Ltd.

2016 Unistar Plant Profile

Your

Most Reliable Partner

Since 2003

2003 Formed Unistar Electronics, Co., Ltd, Kunshan, China /Register Capital USD$ 60M

2005 Unistar Plant Operational, Land Area 102,000M2 / Floor Area 22,000 M2/ 300K SF

2006 Formed CT International, LLC, Unistar Plant TS 16949 & ISO 14001 Certified

2007 Begin MCPCB & Heavy Copper Production

2011 Expansion Floor Area To 26,000M2 /Capacity To 400K SF QC-080000 Certified

2011 Award customer ADVANTECH “ THE BEST SUPPLIER 2011”

2011 Award customer ARCADYAN “ THE BEST SUPPLIER 2011”

2012 Certified HI-TECH patent “LED MCPCB MATERIAL”

2012 Certified HI-TECH patent “TELECOM COPPER PLATING TENTING TECH ”

2012 Certified HI-TECH patent “HAVEY COPPER PCB TECH”

2013 Formed CT Europe

2014 Award Automotive customer KEBODA “ THE BEST SUPPLIER 2013”

2016 Capacity : 500K SF/M , Employee : 850 , Main Product : 2 ~ 12 layer

History

Board of Directors

Taoyuan, Taiwan

Mr. Louis Wang Chairman

CT An-Tung Plant

Taoyuan, Taiwan

CT Unistar Plant

Kunshan, China

CT International

Atlanta, GA

Manufacturing Locations

Sales & Service Locations

Locations

CT TaiwanAn-Tung Plant - Chung Li, Taiwan.

Manufacturing Floor Area – 215K ft2

Land Area – 2.5 Acres

Schillinger AssociatesDetroit, MI

CT InternationalBirmingham, UK

CT InternationalBoston, MA

CT InternationalAtlanta, GA

Schillinger AssociatesKokomo, IN

JSK High-Tech, Pte., Ltd.Prodigy Electronics Limited

CT ChinaUnistar Plant - Kunshan, China.Manufacturing Floor Area – 260k ft2

Land Area – 27 Acres

DS & Multilayer HDI

Heavy Copper Metal Core

Products

Revenue & Capacity

0

50,000

100,000

150,000

200,000

250,000

300,000

350,000

400,000

450,000

500,000

2012 2013 2014 2015 2016(F)

400,000420,000 450,000

500,000 500,000

Capacity (Ft2/mo.)

0

5,000

10,000

15,000

20,000

25,000

30,000

35,000

40,000

45,000

50,000

2012 2013 2014 2015 2016(F)

50,00045,000

Revenue (US$/thousands)

Distribution, Segments, Mix & Finishes

40%

30%

10%

5%15%

Finishes

OSP

ENIG / Gold Plating

Immersion Silver

HASL

LF-HASL

40%

15%

20%

15%

5%5%

Market Segments

Automotive

Communications

Computer &

PeripheralsIndustrial/Consumer

IndustrialConsumer

Other

45%

10%

45%

Product Distribution

North America

Europe

Asia

15%

43%15%

24%

Product Mix

2L

4L

6L

8L

10L+

AL

Communications

Computer & Peripherals

Industrial

Automotive

Customers

UL:E252691

ISO 9001:2008 TS16949:2009 ISO 14001:2004

QC080000:2012

Quality Certifications

CQC

2016

• Auto Planarization (via fill) • SIR Test• AVI• Flying Probe • Solder Mask Coating (spray)• General Automation

Capital Investment

$0.0

$1.0

$2.0

$3.0

$4.0

2012 2013 2014 2015 2016

(Unit: US$M)

0

100

200

300

400

500

600

2014 2015 2016 2017(F)

450 500 500 550

Total Capacity

Unit : K Ft2/month

Capacity

30%

10%

60%

Asia - China

Europe

North

America

35%

25%

15%

10%

10%5% Integrated Electronic

Control Panel

HVAC & Radio

Steering Angle

Sensors

Steering Column

Control Module

Complex Switches

Other

Automotive Product Distribution

Process Item 2016 2017 Unit Notes

Layers 2 - 12 Layers 2 - 12 layers

Board Thickness 3 - 236 2-236 mil

Dimension - Max. 21x24 21x24 inch

Impedance Control +/-10 +/-8 %

Warpage and Twist 0.007"/inch 0.005"/inch

HDI Process 1+C+1 2+C+2

FR4 Tg 150 Available Available NANYA,ITEQ,GRACE,SHEN-YI

FR4 Tg 180 Available Available

Halogen Free ( Tg 150 & Tg 170) Available Available

Aluminum Metal 1-2 Layer 1-4 Layer

Minimum Space Line to line 3./3. 2.5/2.5 mil Copper thickness: H oz

Registrat ion Tolerance 2 2 mil

Max. Working Panel Size 22x26 22x26 inch

Minimum Core Thickness 3 2 mil

Etching undercut(total) 0.5 0.5 mil Copper thickness: H oz

Etching undercut(total) 1 1 mil Copper thickness: 1 oz

Circuit width tolerance +/-10 +/-10 %

Copper Weight 1/3 to 4 1/3 to 6 oz

General

Material

Inner layer

Capability

Process Item 2016 2017 Unit Note

Copper thickness 1 oz 3 3 mil

Copper weight ( external ) 1/3 to 4 1/3 to 4 oz


Board thickness tolerance +/-3 +/-3 mil

Drill Size 6 to 250 4 to 250 mil


Roughness 1 1 mil

Aspect Ratio 8 to 1 8 to 1

Minimum PTH Hole Tolerance 2 2 mil

Max. Board Thickness 236 236 mil

Min. Board Thickness 4.5 4.5 mil

Dry Film (External) Minimum Space Line to line 3/3 3/3 mil Copper thickness 1 oz

Max. Copper Weight: 4 6 oz

Circuit Width Tolerance +/-15 +/-10 %

Soldermask on BGA Tolerance 2 2 mil

Soldermask Registrat ion

Tolerance2 2 mil

Solder Dam 2.5 2 mil

Soldermask Thickness >0.4 >0.4 mil

Solder Mask

Lamination

Drilling

PTH

Etching

Capability

Capability


Electroplated Gold 1~ 50 1 ~ 50 u"

HASL (Leaded) 50~1000 50~1000 u" Sub-contracted

HASL (Pb Free) 50~1000 50~1000 u"

OSP 0.3~0.6 0.3~0.6 um

1~3 1~3 μ" Au

100~300 100~300 μ" Ni

Immersion Silver 6 ~ 25 6 ~ 25 u"

Immersion Tin 1.0 ~ 1.2 1.0 ~ 1.2 um Sub-contracted

Minimum Space Line 5 4 mil

Registrat ion Tolerance 3 3 mil

Rout Tolerance +/-4 +/-4 mil

V-Cut Tolerance +/-4 +/-4 mil

Maximum Array Size 18 X 17 18 X 17 inch

Minimum Jump Score 3 3 mm

Bevel Angle 30 ~ 60 30~60 degree

Surface Finish

Immersion Gold/ENIG

Legend Print ing

Forming


Maximum Test Points Per Board

(O/S Test)73,000 73728 points

Minimum SMT Feature Pitch 11 10 mil

Max.Board size 14.4X11.2 14.4X11.2 inch

Continuity Test 20~50 20~50 Ohm

Isolat ion Test 10M 10M Ohm


Max.Board size 21x24 21x24 inch




Max.Board size 21X24 21X24 inch



Electrical Test ing

Universal Test

Auto Test

Flying Probe Test

Capability

President & GM

Joseph Hsu

Sales & Marketing

Ken Wang

Sales

Angus Chen

Marketing

Sam Chen

Customer Service

Cherolyn Xiao

Manufacturing

Eric Li

Production

Se-I Lou

Engineering

Alan Young

Process Engineering

Zhiqiang Xu

Product Engineering

Zhijun Dong

Design Engineering

Quality Assurance

Paul Yang

Quality Control

Peter Hu

Chemical Lab

Junqiang Wang

Administration

Seth Liao

Finance

Vicky Liu

Unistar Plant Organization

Betty Tseng - Taiwan

18+ Years Industry Experience

10+ Years Sales & Customer Service

Experience

Ken Wang – China


20+ Years Sales, Marketing and

Customer Service Experience

5+ Years PCB Manufacturing

Experience

Sammi Yeh – Taiwan


8+ Years Sales, Marketing &


Angus Chen – China


15+ Years Sales and Customer

Service Experience

5+ Years PCB Engineering

Sam HS Chen – China


25+ Years Sales Marketing &


17+ Years Engineering and Quality

Management Experience.

8+ Years PCB Assembly and Supply

Chain Management Experience.

Kevin Herring – USA

20+ Years Manufacturing & Quality

Engineering Experience


6+ Years Automotive PCB Assembly

Experience

7+ Years Avionics Technician

Experience

Direct Support

A MANUFACTURING

ORGANIZATION

WORKINGwith Knowledge, Integrity

and Precision

Kerri McFarland – USA


14+ Years Global Account

Management, Customer Service,

Inside/Outside Sales Experience

8+ Years Manufacturing &

Production Control Experience

Alex Mikolowsky - USA


25+ Years Manufacturing &

Engineering Experience

20+ Years Sales and Customer

Service Experience

Tony Dry – United Kingdom


10+ Years Manufacturing Experience

THANK YOU !

Unistar Plant – Mr. Ken Wang

Tel: +86-512-57753888

[email protected]

Time Zone = UTC +8

#900, Hanpu Road, Kunshan City,

Jiangsu, China.

www.circuitech.com.tw

www.ctpcbgroup.com

America Sales & Service

Ms. Kerri McFarland

Mobile: +1-512-417-3396

[email protected]

Time Zone = UTC -5

Boston, MA USA

Europe Sales & Service

Mr. Tony Dry

Tel: +44 121 537 5910

Mobile : +44 7584087563

[email protected]

Birmingham, UK

mailto:[email protected]

http://www.ctpcbgroup.com/



Kunshan Unistar Electronics Co., Ltd. 2016 Unistar Plant...

Documents

Transcript of Kunshan Unistar Electronics Co., Ltd. 2016 Unistar Plant...