KLOE II Inner Tracker - FEE Status Antonio Ranieri RD51 Collaboration Meeting Paris 13-15 October...

KLOE II Inner Tracker - FEE Status

Antonio Ranieri RD51 Collaboration Meeting Paris 13-15 October 2008

INFN-Bari

Servizio Elettronico Laboratori Frascati

GASTONE (Gem Amplifier Shaper GASTONE (Gem Amplifier Shaper Tracking ON Events) Tracking ON Events)

A prototype Front-End chip for the KLOE Inner A prototype Front-End chip for the KLOE Inner Tracker DetectorTracker Detector

On behalf of KLOE2 Bari-LNF Collaboration



INFN-Bari

Servizio Elettronico Laboratori FrascatiOutline

KLOE detector upgrade requirements

Inner Tracker purpose and requirements• prototype detector parameters

Readout device parameters• readout requirements & time constraints• readout data frame

Front-End Electronics development• GASTONE device description

• analog and digital blocks (main features)• GASTONE Front-End Board • prototype testing

Detector - FE integration • Input protection• RO boards - strip interconnections

Future plans and developments

Conclusions

2



INFN-Bari


Pisa - 21/04/23

KLOE detector upgrade requirements

IT Proto 1.0 (constructed in 2007)

Triple-GEM with 3,2,2,2 gap thickness

150 mm radius (Layer 1) x 352 mm active length

Electrodes obtained joining 3 foils (450x320 mm2)

650 µm pitch (only along r)

Anode readout with 1538 strips

One-dimensional readout

128 ch equipped with GASTONE

Drift chamber

Inner Tracker

Improve vertex reconstruction of KS and decays

5 tracking layers

from 150 to 250 mm

200x500 µm spatial resolution

700 mm active length

1.5% X0 total radiation length

Technology: Cylindrical-GEM

3



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4

Inner Tracker Purpose and Requirements

Tracking device (NO charge / NO time measurements)

Low gas gain device• High sensitivity head amplifier (few fC)

High density readout (pitch 650m / 35k RO channels)• Low power FE

Most internal layer strip rate < 30 kHz• DC restorer can be avoided

Expected input charge range: 10 50 fC

Stereo strips RO• Cin spread (1 pF ÷ 50 pF)

Very light device (kapton + support structure)• R&D on detector - readout integration



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Ref GEMRef GEM

5

Detector X-ray Test validation

6 keV X-ray gun6 keV X-ray gun

CGEM in current mode

10x10cm2 GEM used as reference (normalization for pressure/temperature effects)

Gain and electron transparency measured

Uniformity measured throughout the whole CGEM surface

Prototype detector parameters



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Servizio Elettronico Laboratori FrascatiReadout device parameters

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Header(8+2 bits)

Trigger Counter(5bits)

Chip ID(9 Bits) Data (64 Bit)

End Byte(8 zeros)

1 bit / channel

KLOE DAQ timing“bunched” beam structure

• < 2 s (data RO)• 200 ns (input signal spread – worst case)• 96 bits to be read in < 2 s acquisition rate 100 Mbps)

1. High modularity (64 channels)2. Serial RO protocol (to reduce power consumption and cables)

a. Copper link3. RO clock only after trigger arrival (to avoid internal x-talk)4. OR output (self-trigger capability)



INFN-Bari

Servizio Elettronico Laboratori FrascatiGASTONE device description

Low-noise and low-power mixed analog-digital ASIC designed to satisfy IT requirements

First 16 channel prototype already tested Second 16 channel release with protection network

inside the chip will be mounted soon 64 channels proto beginning of 2009

CMOS AMS 0.35m

16 Analog channels + 2 dummy channels ~ 3.2x2.6 mm2 die complete digital section (64 chan) QFP80 package (24x16 mm2)

In 1

In 64

Pre Comp/Mon

Analog Digital

SHAPING

Tigger

Ck (RO)

CommonSignals

MASK

Common SC

signals

A/S

Pre Comp/MonA/S

Data out

Data in

Ck (SC)

Reset

Data (RO)

CONTROL



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8

Analog Section - 3 basic blocks (simulation)

a charge preamplifier to integrate the input strip current into a voltage

Internal test pulsing capability(10 fC)

1

a semi-gaussian shaper (CR-RC) circuit providing noise filtering

2

A leading-edge discriminatordesigned in fully differential mode AC-coupled with previous stage for reducing the channel to channel offset variations

3

type Pre-amplifier (cascode

configuration)

Feedback capacitor 150 fF

Feedback resistor 100 MΩ

W/L aspect ratio 500/0,5

gm 2.2 mA/V

Bias current 110 A

Pre-amplifier gain 5.6 mV/fC @ CIN=0 pF

Non linearity < 1%type Shaper (cascode

configuration)

Voltage gain 4

Non linearity < 3%

Bias current 110 A

Peaking time @ Cdet=10

50 pF

90 220 nstype Leading edge

Threshold range 0.5 200fC

Bias current 180 A



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9

Digital Section - 4 basic blocks

Discr 1 monostable

max 1 µs width

1

Discr 64 monostable

SERIALIZER

Data (RO)

TriggerCk(RO)

2

DATA RO SECTION

Data OutData In

ResetCk (SC)

CONTROLLER

DAC Vth x 4

DAC Monost.

ADC Vth x 4

ADC Monost.

3

Pulse Odd

4

Pulse EvenMask

CONTROL SECTION



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Servizio Elettronico Laboratori FrascatiGASTONE Front-End Board

10

Main features:• 2 chips/board (16 Ch (64) up / 16 (64) down)• One serial readout line per chip• 10 LVDS communication lines/board• Clock readout signal (50 MHz)• One mask register for dead channels• OR output for 16 (64) channels for self-

triggering • HW ID for each chip• 4 DAC + 4 ADC (8 bits) to set thresholds (one

for 16 channel)• 1 DAC (8 bits) + 1 ADC (8 bits) to set

monostable output width• Default threshold value (fC) set at “power-

on”

“Slow Control” section implemented to: Set threshold value (8 bit DAC) Set the monostable pulse width Enable external pulse system Enable internal/External pulsing system Read back threshold values (8 bit ADC) Read back the value for monostable width

setting Enable channel readout through an internal

mask register

About 600 chips plus 300 VFEB including spares are foreseen to fully instrument the final detector

Dimensions: 30x95 mm2

Dimensions: 30x95 mm2

Gastone 16 chs

Input protection

circuitGEM strip

inputs



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Prototype testing

1. Charge sensitivity Linearity2. Uniformity among channels3. Time-walk4. ENC5. Cross-talk 6. Threshold calibration curve7. Pulse-width calibration curve (vs. Vmon voltage)8. Functional test of digital section:

a) Spi interface (write/read internal registers, DACs and ADCs) b) Data readout

Measurements:



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Prototype testing (II)

0

50

100

150

200

250

300

350

0 2 4 6 8 10 12

Thr

esho

ld m

V

Charge fC

Board0_ chip0

ch 0

ch 1

ch 2

ch 3

ch 4

ch 5

ch 6

ch 7

ch 8

ch 9

ch 10

ch 11

ch 12

ch 13

ch 14

ch 15

0

0,1

0,2

0,3

0,4

0,5

0,6

0,7

0,8

0,9

1

23 24 25 26 27

frequency

gain mV/fC

Gain 22 chips 352 channels

<gain> 25 mV/ fC

Charge sensitivity, linearity and uniformity

Gain sensitivity measurement



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0

20

40

60

80

100

120

140

160

180

200

0 5 10 15 20 25 30 35

Tim

e n

s

input charge fC

time walk soglia 161,15 mV

soglia 241,7 mV

soglia 322,3 mV

Prototype testing (III)

Different threshold values:• Th1 = 6.45 fC• Th2 = 9.67 fC• Th3 = 12.9 fC

ENC sim = 395 e + 51 e /pFENC meas = 974 e + 59 e /pF



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Prototype testing: summary

24 chips assembled on 12 boards have been tested performing noise and gain measurements.

Noise measurements in the final setup (i.e. boards connected to the layer 0 readout strips) show a value of 974 e- + 59 e-/pF ≈ 0.6 fC (22 pF) 1.5 fC will allow good event selection.

The measured cross talk among adjacent channels is < 1%

GASTONE parameters

Input impedance 400

Cdet range 0 ÷ 50 pF

Number of channels 16

I/O Differential and serial

Baseline restorer No

Total Gain sensitivity 25 mV/fC

Peaking time 90 ns÷200 ns (CD=0 ÷50 pF)

ENC (rms) measured on detector

974 e- + 59 e-/pF

Threshold sensing/setting 8 bits ADC/DAC (16 chs modularity)

Power consumption 0.6 mA/Ch



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Detector - FE Integration

Input protection & strip reference network

10 10 nF

1. Wasting space on FEB2. strip referred to GND AC-coupling

GASTONE 1’st release

GASTONE 2’nd release

1. Input protection network inside chip2. Strip DC-coupled and referred to in-MOS (500 mV )



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Detector - FE Integration

Front-End faraday-cageInput connections Output connections



INFN-Bari

Servizio Elettronico Laboratori FrascatiDetector - FE Integration: test on CGEM

GASTONE front-end board

•Written a new DAQ •Performed noise measurements on chamber allowing the measurement of the actual readout strip capacitance

diameter 300mm, active length 352 mm. (Kloe IT

Layer1) GEM size: 450x1000 mm2 (join of 3 GEM foils 450 x 333

mm2) anode readout with 1538 strips (only X coordinate)



INFN-Bari

Servizio Elettronico Laboratori FrascatiDetector - FE Integration: cosmic ray setup

Triple coincidence of scintillators for trigger

2 sets of drift tubes in streamer mode for tracking

Load cell for CGEM mechanical tensioning

Load cell for CGEM mechanical tensioning

2 opposite zones are equipped with FEE

2 opposite zones are equipped with FEE

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Detector - FE Integration: test at PS T9 beam

detectorselectronics rack beam line: 10 GeV pion beam

beam line: 10 GeV pion beam

128 ch w GASTONE (0.5M evts)

drift tubes in streamer mode for tracking



INFN-Bari

Servizio Elettronico Laboratori FrascatiDetector - FE Integration (preliminary)

(global)2 = (GEM)2 + (tracker)2

(GEM)2 = 250µm2 – 140µm2 200µm2

(global)2 = (GEM)2 + (tracker)2

(GEM)2 = 250µm2 – 140µm2 200µm2

GEM residuals with respect to the track reconstructed by the drift

tubes

GEM residuals with respect to the track reconstructed by the drift

tubes

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GASTONEGASTONE



INFN-Bari


2121Pisa - 21/04/23

Detector Integration (future implementation)

Study of a possible arrangement of HV-

connectors, gas inlets, mechanical support for FEE

boards

Study of a possible arrangement of HV-

connectors, gas inlets, mechanical support for FEE

boards

carbon-fiber shell

gas inlets/outlets

fiberglass FEE support

HV connector

signal connector

kapton readout circuit

FEE board

ASIC



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XV Readout Studies

Readout circuit with XV strips engraved on a single Kapton substrate

The readout prototype will be mounted on dedicated 10x10cm2 GEM detectors to study and finalize the readout of the IT

old and new ASIC releases will be used

Two ground configurations will be tested

Production of bigger planar GEM detector and tests with GASTONE will then proceed

X pitch 650 µm

V

pitch

65

0 µm

40°1000 µm

Current developments

X strips and V strips on the same plane



INFN-Bari

Servizio Elettronico Laboratori FrascatiConclusions

23

24 GASTONE prototypes (16 chs) have been produced and tested IT layer 0 has been instrumented with 128 chs GASTONE prototypes A GASTONE data readout system has been implemented and fully integrated with the RO SW used in cosmic ray setup and CERN test beam. Spatial resolution of CGEM layer1 prototype has been measured with GASTONE giving expected resultsThe ASIC performances fulfill the requirements

Integration of input protection network (several tests will be performed to test tolerance to discharges) Programmable test pulsing capability (0 – 50 fC)25 chips (2’nd release) have been already deliveredWe are waiting to receive the new FEBsLab tests will start soon and if successful the new FEBs will be mounted on the detector for new integration tests

Proceed with the 64 prototype (beginning of the next year)

Next steps – GASTONE Rel. 2 Next steps – GASTONE Rel. 2

AchievementsAchievements

Final steps – GASTONE Rel. 3 Final steps – GASTONE Rel. 3



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Servizio Elettronico Laboratori FrascatiSPARE SLIDES

24



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Qth = 3.5 fC

Qth = 3.5 fC

“Smile” effect due to longer projected path of non-radial

tracks

“Smile” effect due to longer projected path of non-radial

tracks

GASTONEGASTONE

Cluster size

KLOE II Inner Tracker - FEE Status Antonio Ranieri RD51 Collaboration Meeting Paris 13-15 October...

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